JP6374344B2 - 搬送方法及び搬送システム - Google Patents

搬送方法及び搬送システム Download PDF

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Publication number
JP6374344B2
JP6374344B2 JP2015080341A JP2015080341A JP6374344B2 JP 6374344 B2 JP6374344 B2 JP 6374344B2 JP 2015080341 A JP2015080341 A JP 2015080341A JP 2015080341 A JP2015080341 A JP 2015080341A JP 6374344 B2 JP6374344 B2 JP 6374344B2
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JP
Japan
Prior art keywords
workpiece
pallet
transport
processing station
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015080341A
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English (en)
Japanese (ja)
Other versions
JP2016028978A (ja
JP2016028978A5 (enExample
Inventor
淳二 高野
淳二 高野
浩也 満島
浩也 満島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Priority to JP2015080341A priority Critical patent/JP6374344B2/ja
Priority to US14/792,105 priority patent/US9443717B2/en
Priority to MX2015009133A priority patent/MX358430B/es
Publication of JP2016028978A publication Critical patent/JP2016028978A/ja
Publication of JP2016028978A5 publication Critical patent/JP2016028978A5/ja
Application granted granted Critical
Publication of JP6374344B2 publication Critical patent/JP6374344B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Automatic Assembly (AREA)
JP2015080341A 2014-07-16 2015-04-09 搬送方法及び搬送システム Expired - Fee Related JP6374344B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015080341A JP6374344B2 (ja) 2014-07-16 2015-04-09 搬送方法及び搬送システム
US14/792,105 US9443717B2 (en) 2014-07-16 2015-07-06 Conveyance system and conveyance method
MX2015009133A MX358430B (es) 2014-07-16 2015-07-15 Sistema de transporte y metodo de transporte.

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014146284 2014-07-16
JP2014146284 2014-07-16
JP2015080341A JP6374344B2 (ja) 2014-07-16 2015-04-09 搬送方法及び搬送システム

Publications (3)

Publication Number Publication Date
JP2016028978A JP2016028978A (ja) 2016-03-03
JP2016028978A5 JP2016028978A5 (enExample) 2017-08-17
JP6374344B2 true JP6374344B2 (ja) 2018-08-15

Family

ID=55073947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015080341A Expired - Fee Related JP6374344B2 (ja) 2014-07-16 2015-04-09 搬送方法及び搬送システム

Country Status (3)

Country Link
US (1) US9443717B2 (enExample)
JP (1) JP6374344B2 (enExample)
MX (1) MX358430B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10070567B2 (en) * 2016-06-13 2018-09-04 Arris Enterprises Llc System for printed circuit board unlocking and automated reflow carrier recycling
KR102251489B1 (ko) * 2019-08-14 2021-05-13 주식회사 호용 주차용 팔레트 제조 장치
WO2024050643A1 (en) * 2022-09-09 2024-03-14 Ats Corporation Automated ultrasonic welding stations and related methods
US12481227B2 (en) * 2022-11-28 2025-11-25 Eclat Forever Machinery Co., Ltd. Substrate processing apparatus

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5634696U (enExample) * 1979-08-21 1981-04-04
JPS60251020A (ja) * 1984-05-28 1985-12-11 矢崎化工株式会社 搬送装置及び搬送装置用容器
JPH04106021A (ja) * 1990-08-23 1992-04-08 Mishima Kosan Co Ltd 搬送方法及び装置
JPH04201920A (ja) * 1990-11-30 1992-07-22 Inax Corp 移載装置
JPH05116753A (ja) * 1991-10-24 1993-05-14 Ibiden Co Ltd プリント基板のワーク搭載装置
JP3187564B2 (ja) 1991-11-27 2001-07-11 石川島播磨重工業株式会社 パネル積込み方法及び装置とパレット装置
JPH05178444A (ja) * 1991-12-27 1993-07-20 Nippon Chemicon Corp パレット搬出入装置
JP2001354203A (ja) 2000-06-09 2001-12-25 Nkk Plant Engineering Corp 青果物の箱詰め装置
JP4213888B2 (ja) * 2001-11-26 2009-01-21 平田機工株式会社 ワーク処理装置
JP5276377B2 (ja) * 2008-07-31 2013-08-28 パナソニック デバイスＳｕｎｘ株式会社 多光軸光電センサ及び多光軸光電センサのコントローラ
JP5495765B2 (ja) 2009-12-18 2014-05-21 ダイハツ工業株式会社 パレット搬送装置
JP2012166318A (ja) 2011-02-16 2012-09-06 Sanyu Kogyo Kk 車両用ガラスの処理装置
JP5483379B1 (ja) * 2012-11-30 2014-05-07 ニチユ三菱フォークリフト株式会社 搬送コンベアにおけるセンタリング装置

Also Published As

Publication number Publication date
MX358430B (es) 2018-08-20
JP2016028978A (ja) 2016-03-03
US9443717B2 (en) 2016-09-13
MX2015009133A (es) 2016-01-15
US20160016739A1 (en) 2016-01-21

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