JP6370678B2 - 基板液処理装置 - Google Patents

基板液処理装置 Download PDF

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Publication number
JP6370678B2
JP6370678B2 JP2014219315A JP2014219315A JP6370678B2 JP 6370678 B2 JP6370678 B2 JP 6370678B2 JP 2014219315 A JP2014219315 A JP 2014219315A JP 2014219315 A JP2014219315 A JP 2014219315A JP 6370678 B2 JP6370678 B2 JP 6370678B2
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JP
Japan
Prior art keywords
liquid
substrate
processing
nozzle
liquid receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014219315A
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English (en)
Japanese (ja)
Other versions
JP2016086116A (ja
JP2016086116A5 (enExample
Inventor
▲崎▼ 翔 太 梅
▲崎▼ 翔 太 梅
斐 義 広 甲
斐 義 広 甲
一 樹 小佐井
一 樹 小佐井
中 満 雄 田
中 満 雄 田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2014219315A priority Critical patent/JP6370678B2/ja
Priority to KR1020150148637A priority patent/KR102414891B1/ko
Priority to US14/922,441 priority patent/US9842751B2/en
Publication of JP2016086116A publication Critical patent/JP2016086116A/ja
Publication of JP2016086116A5 publication Critical patent/JP2016086116A5/ja
Application granted granted Critical
Publication of JP6370678B2 publication Critical patent/JP6370678B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP2014219315A 2014-10-28 2014-10-28 基板液処理装置 Active JP6370678B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014219315A JP6370678B2 (ja) 2014-10-28 2014-10-28 基板液処理装置
KR1020150148637A KR102414891B1 (ko) 2014-10-28 2015-10-26 기판 액 처리 장치
US14/922,441 US9842751B2 (en) 2014-10-28 2015-10-26 Substrate liquid processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014219315A JP6370678B2 (ja) 2014-10-28 2014-10-28 基板液処理装置

Publications (3)

Publication Number Publication Date
JP2016086116A JP2016086116A (ja) 2016-05-19
JP2016086116A5 JP2016086116A5 (enExample) 2017-03-23
JP6370678B2 true JP6370678B2 (ja) 2018-08-08

Family

ID=55791214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014219315A Active JP6370678B2 (ja) 2014-10-28 2014-10-28 基板液処理装置

Country Status (3)

Country Link
US (1) US9842751B2 (enExample)
JP (1) JP6370678B2 (enExample)
KR (1) KR102414891B1 (enExample)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112930U (enExample) * 1990-03-01 1991-11-19
JP3667164B2 (ja) * 1999-08-09 2005-07-06 東京エレクトロン株式会社 処理液吐出ノズル、液処理装置および液処理方法
JP4256583B2 (ja) * 1999-12-17 2009-04-22 東京エレクトロン株式会社 塗布膜形成装置
US7153364B1 (en) * 2000-10-23 2006-12-26 Advance Micro Devices, Inc. Re-circulation and reuse of dummy-dispensed resist
JP4043423B2 (ja) * 2003-09-04 2008-02-06 東京エレクトロン株式会社 現像装置及び現像方法
JP4997080B2 (ja) * 2007-11-28 2012-08-08 大日本スクリーン製造株式会社 基板処理装置
JP5218450B2 (ja) * 2010-03-03 2013-06-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5440441B2 (ja) * 2010-08-12 2014-03-12 東京エレクトロン株式会社 液処理装置
JP5667545B2 (ja) * 2011-10-24 2015-02-12 東京エレクトロン株式会社 液処理装置および液処理方法
JP5693438B2 (ja) * 2011-12-16 2015-04-01 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
KR20140065655A (ko) 2012-11-19 2014-05-30 주식회사 케이씨텍 분사노즐유닛 및 이를 구비한 기판 세정장치
JP6022430B2 (ja) * 2012-11-21 2016-11-09 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20160049985A (ko) 2016-05-10
JP2016086116A (ja) 2016-05-19
US20160114345A1 (en) 2016-04-28
US9842751B2 (en) 2017-12-12
KR102414891B1 (ko) 2022-07-01

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