JP6356582B2 - 接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法 - Google Patents

接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法

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Publication number
JP6356582B2
JP6356582B2 JP2014238021A JP2014238021A JP6356582B2 JP 6356582 B2 JP6356582 B2 JP 6356582B2 JP 2014238021 A JP2014238021 A JP 2014238021A JP 2014238021 A JP2014238021 A JP 2014238021A JP 6356582 B2 JP6356582 B2 JP 6356582B2
Authority
JP
Japan
Prior art keywords
adhesive sheet
adhesive
resin
bonding
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014238021A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016100532A (ja
Inventor
木村　雄大
雄大 木村
三隅　貞仁
貞仁 三隅
謙司 大西
謙司 大西
雄一郎 宍戸
雄一郎 宍戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2014238021A priority Critical patent/JP6356582B2/ja
Priority to KR1020150160596A priority patent/KR102408996B1/ko
Priority to TW104137921A priority patent/TWI656189B/zh
Priority to CN201510834272.6A priority patent/CN105623580B/zh
Publication of JP2016100532A publication Critical patent/JP2016100532A/ja
Application granted granted Critical
Publication of JP6356582B2 publication Critical patent/JP6356582B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
JP2014238021A 2014-11-25 2014-11-25 接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法 Active JP6356582B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014238021A JP6356582B2 (ja) 2014-11-25 2014-11-25 接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法
KR1020150160596A KR102408996B1 (ko) 2014-11-25 2015-11-16 접착 시트, 다이싱 시트가 부착된 접착 시트 및 반도체 장치의 제조 방법
TW104137921A TWI656189B (zh) 2014-11-25 2015-11-17 Substrate, subsequent sheet with dicing sheet, and method of manufacturing semiconductor device
CN201510834272.6A CN105623580B (zh) 2014-11-25 2015-11-25 粘接片、带有切割片的粘接片及半导体装置的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014238021A JP6356582B2 (ja) 2014-11-25 2014-11-25 接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2016100532A JP2016100532A (ja) 2016-05-30
JP6356582B2 true JP6356582B2 (ja) 2018-07-11

Family

ID=56038944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014238021A Active JP6356582B2 (ja) 2014-11-25 2014-11-25 接着シート、ダイシングシート付き接着シート及び半導体装置の製造方法

Country Status (4)

Country Link
JP (1) JP6356582B2 (ko)
KR (1) KR102408996B1 (ko)
CN (1) CN105623580B (ko)
TW (1) TWI656189B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102481281B1 (ko) * 2016-11-02 2022-12-27 린텍 가부시키가이샤 스텔스 다이싱용 점착 시트
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
CN110536908B (zh) * 2017-06-06 2022-04-19 日本化药株式会社 光固化性组合物及电子部件用粘接剂
CN113348221B (zh) * 2019-01-28 2024-01-09 株式会社力森诺科 胶黏剂组合物、膜状胶黏剂、胶黏剂片及半导体装置的制造方法
WO2023152837A1 (ja) * 2022-02-09 2023-08-17 株式会社レゾナック フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4449325B2 (ja) * 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
US7560821B2 (en) * 2005-03-24 2009-07-14 Sumitomo Bakelite Company, Ltd Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
JP4939574B2 (ja) * 2008-08-28 2012-05-30 日東電工株式会社 熱硬化型ダイボンドフィルム
JP5580701B2 (ja) * 2010-09-13 2014-08-27 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2012092225A (ja) * 2010-10-27 2012-05-17 Hitachi Chemical Co Ltd 接着フィルム、ダイシングテープ付接着フィルム及びこれを用いた半導体装置
JP2012186361A (ja) * 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP5888805B2 (ja) 2011-09-01 2016-03-22 日東電工株式会社 接着フィルム及びダイシング・ダイボンドフィルム
JP6247204B2 (ja) * 2012-04-10 2017-12-13 住友ベークライト株式会社 半導体装置、ダイアタッチ材料および半導体装置の製造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
KR20160062692A (ko) 2016-06-02
TWI656189B (zh) 2019-04-11
CN105623580B (zh) 2020-11-06
JP2016100532A (ja) 2016-05-30
KR102408996B1 (ko) 2022-06-14
TW201627452A (zh) 2016-08-01
CN105623580A (zh) 2016-06-01

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