JP6352133B2 - 位置検出装置、基板処理装置、位置検出方法および基板処理方法 - Google Patents

位置検出装置、基板処理装置、位置検出方法および基板処理方法 Download PDF

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JP6352133B2
JP6352133B2 JP2014197065A JP2014197065A JP6352133B2 JP 6352133 B2 JP6352133 B2 JP 6352133B2 JP 2014197065 A JP2014197065 A JP 2014197065A JP 2014197065 A JP2014197065 A JP 2014197065A JP 6352133 B2 JP6352133 B2 JP 6352133B2
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processing
image
substrate
position detection
unit
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JP2016070693A (ja
Inventor
有史 沖田
有史 沖田
央章 角間
央章 角間
佐野　洋
洋 佐野
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2014197065A priority Critical patent/JP6352133B2/ja
Priority to TW104115097A priority patent/TWI546885B/zh
Priority to KR1020150072877A priority patent/KR101785778B1/ko
Priority to US14/793,794 priority patent/US9975247B2/en
Publication of JP2016070693A publication Critical patent/JP2016070693A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1674—Programme controls characterised by safety, monitoring, diagnostic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40611—Camera to monitor endpoint, end effector position
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
JP2014197065A 2014-09-26 2014-09-26 位置検出装置、基板処理装置、位置検出方法および基板処理方法 Active JP6352133B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014197065A JP6352133B2 (ja) 2014-09-26 2014-09-26 位置検出装置、基板処理装置、位置検出方法および基板処理方法
TW104115097A TWI546885B (zh) 2014-09-26 2015-05-12 位置檢測裝置、基板處理裝置、位置檢測方法及基板處理方法
KR1020150072877A KR101785778B1 (ko) 2014-09-26 2015-05-26 위치 검출 장치, 기판 처리 장치, 위치 검출 방법 및 기판 처리 방법
US14/793,794 US9975247B2 (en) 2014-09-26 2015-07-08 Position detection apparatus, substrate processing apparatus, position detection method and substrate processing method

Applications Claiming Priority (1)

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JP2014197065A JP6352133B2 (ja) 2014-09-26 2014-09-26 位置検出装置、基板処理装置、位置検出方法および基板処理方法

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JP2016070693A JP2016070693A (ja) 2016-05-09
JP6352133B2 true JP6352133B2 (ja) 2018-07-04

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US (1) US9975247B2 (ko)
JP (1) JP6352133B2 (ko)
KR (1) KR101785778B1 (ko)
TW (1) TWI546885B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506153B2 (ja) * 2015-10-27 2019-04-24 株式会社Ｓｃｒｅｅｎホールディングス 変位検出装置および変位検出方法ならびに基板処理装置
JP2019168411A (ja) * 2018-03-26 2019-10-03 株式会社Ｓｃｒｅｅｎホールディングス 位置検出装置、基板処理装置、位置検出方法および基板処理方法
JP7122192B2 (ja) * 2018-08-21 2022-08-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置および基板処理システム
JP2020034344A (ja) * 2018-08-28 2020-03-05 株式会社Ｓｃｒｅｅｎホールディングス 可動部位置検出方法、基板処理方法、基板処理装置および基板処理システム
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
KR102211781B1 (ko) * 2018-11-23 2021-02-05 세메스 주식회사 기판 처리 장치, 편심 검사 장치 및 방법
JP7282640B2 (ja) * 2019-09-12 2023-05-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法
JP7482689B2 (ja) * 2020-06-03 2024-05-14 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2022145428A (ja) * 2021-03-19 2022-10-04 カシオ計算機株式会社 移動体の位置測位装置、移動体の位置測位システム、移動体の位置測位方法及び移動体の位置測位プログラム
US11956537B2 (en) 2021-03-19 2024-04-09 Casio Computer Co., Ltd. Location positioning device for moving body and location positioning method for moving body
KR102616914B1 (ko) * 2021-03-24 2023-12-21 세메스 주식회사 기판 처리 방법 및 장치
JP2023081763A (ja) * 2021-12-01 2023-06-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置およびガード判定方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2653566B2 (ja) * 1991-03-27 1997-09-17 株式会社東芝 半導体基板評価方法及び装置
JPH07297119A (ja) * 1994-04-27 1995-11-10 Nikon Corp 位置検出方法
JPH10135100A (ja) 1996-10-25 1998-05-22 Dainippon Screen Mfg Co Ltd 処理液供給装置
US5966201A (en) * 1996-11-07 1999-10-12 Nikon Corporation Mark for position detection, and mark detecting method and apparatus
JPH115056A (ja) * 1997-06-16 1999-01-12 Dainippon Screen Mfg Co Ltd 処理液供給装置
JP3076287B2 (ja) 1997-10-28 2000-08-14 山形日本電気株式会社 半導体装置の製造装置
US6643400B1 (en) * 1999-03-31 2003-11-04 Minolta Co., Ltd. Image processing apparatus and method for recognizing specific pattern and recording medium having image processing program recorded thereon
JP4672175B2 (ja) * 2000-05-26 2011-04-20 本田技研工業株式会社 位置検出装置、位置検出方法、及び位置検出プログラム
JP3410447B2 (ja) 2000-10-24 2003-05-26 株式会社日立国際電気 カメラ位置ずれ量の算出および検出の方法、および画像処理装置
JP2002319533A (ja) * 2001-04-24 2002-10-31 Nikon Corp 転写露光方法、転写露光装置及びデバイス製造方法
US7379094B2 (en) * 2002-04-18 2008-05-27 Olympus Corporation Electronic still imaging apparatus and method having function for acquiring synthesis image having wide-dynamic range
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US7231063B2 (en) * 2002-08-09 2007-06-12 Intersense, Inc. Fiducial detection system
JP3828552B2 (ja) * 2003-06-23 2006-10-04 株式会社東芝 寸法測定方法と寸法測定システム及び寸法測定プログラム
JP4315427B2 (ja) * 2003-08-07 2009-08-19 キヤノン株式会社 位置測定方法、露光装置、及びデバイスの製造方法
US7003758B2 (en) * 2003-10-07 2006-02-21 Brion Technologies, Inc. System and method for lithography simulation
US7794897B2 (en) * 2004-03-02 2010-09-14 Kabushiki Kaisha Toshiba Mask pattern correcting method, mask pattern inspecting method, photo mask manufacturing method, and semiconductor device manufacturing method
JP2005250890A (ja) * 2004-03-04 2005-09-15 Renesas Technology Corp レイアウト検証装置
US20050276443A1 (en) * 2004-05-28 2005-12-15 Slamani Mohamed A Method and apparatus for recognizing an object within an image
JP4349298B2 (ja) 2005-02-18 2009-10-21 株式会社デンソー 監視制御装置及び監視制御方法
JP2006235699A (ja) * 2005-02-22 2006-09-07 Denso Corp シミュレーション装置及びシミュレーション方法
TW200641564A (en) 2005-02-24 2006-12-01 Fuji Photo Film Co Ltd The correction method of plotting device
JP2006268032A (ja) 2005-02-24 2006-10-05 Fuji Photo Film Co Ltd 描画装置および描画装置の校正方法
JP4533785B2 (ja) 2005-03-31 2010-09-01 富士フイルム株式会社 アライメントセンサの位置校正方法、基準パターン校正方法、露光位置補正方法、校正用パターン及びアライメント装置
JP2007065251A (ja) * 2005-08-31 2007-03-15 Sony Corp 撮像装置および撮像装置の制御方法
JP2007196301A (ja) * 2006-01-24 2007-08-09 Denso Corp 画像を用いた自動運転装置及び自動運転方法
KR100982343B1 (ko) * 2007-06-11 2010-09-15 주식회사 쎄믹스 웨이퍼 프로버의 스테이지 오차 측정 및 보정 장치
JP5213237B2 (ja) * 2008-04-17 2013-06-19 パナソニック株式会社 撮像位置判定方法及び撮像位置判定装置
JP2010243317A (ja) * 2009-04-06 2010-10-28 Seiko Epson Corp 物体認識方法
US20110080476A1 (en) * 2009-10-02 2011-04-07 Lasx Industries, Inc. High Performance Vision System for Part Registration
NL2005309A (en) * 2009-10-13 2011-04-14 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2008335A (en) * 2011-04-07 2012-10-09 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and method of correcting a mask.
JP2013115384A (ja) * 2011-11-30 2013-06-10 Sony Corp 基板の歪み測定装置、基板の歪み測定方法、および半導体装置の製造方法
JP5955601B2 (ja) 2012-03-27 2016-07-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6226781B2 (ja) * 2013-03-27 2017-11-08 株式会社日立ハイテクサイエンス 集束イオンビーム装置、それを用いた試料の加工方法、及び集束イオンビーム加工用コンピュータプログラム

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Publication number Publication date
KR101785778B1 (ko) 2017-10-16
KR20160037065A (ko) 2016-04-05
US9975247B2 (en) 2018-05-22
JP2016070693A (ja) 2016-05-09
US20160091892A1 (en) 2016-03-31
TW201613024A (en) 2016-04-01
TWI546885B (zh) 2016-08-21

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