JP6344476B2 - 多層回路基板 - Google Patents
多層回路基板 Download PDFInfo
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- JP6344476B2 JP6344476B2 JP2016545480A JP2016545480A JP6344476B2 JP 6344476 B2 JP6344476 B2 JP 6344476B2 JP 2016545480 A JP2016545480 A JP 2016545480A JP 2016545480 A JP2016545480 A JP 2016545480A JP 6344476 B2 JP6344476 B2 JP 6344476B2
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- conductor
- circuit board
- multilayer circuit
- insulating base
- base material
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- 239000004020 conductor Substances 0.000 claims description 399
- 239000000463 material Substances 0.000 claims description 128
- 239000000654 additive Substances 0.000 claims description 24
- 230000000996 additive effect Effects 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 description 52
- 238000004519 manufacturing process Methods 0.000 description 39
- 238000000034 method Methods 0.000 description 34
- 239000003990 capacitor Substances 0.000 description 13
- 238000000059 patterning Methods 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 11
- 238000005530 etching Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明の第1の実施形態に係る多層回路基板について、図を参照して説明する。図1は、本発明の第1の実施形態に係る多層回路基板の外観斜視図である。図2は、本発明の第1の実施形態に係る多層回路基板の製造工程毎の状態を示す斜視図である。図3は、本発明の第1の実施形態に係る多層回路基板の製造フローを示す図である。
次に、第2の実施形態に係る多層回路基板および多層回路基板の製造方法について、図を参照して説明する。図4は、本発明の第2の実施形態に係る多層回路基板の外観斜視図である。図5は、本発明の第2の実施形態に係る多層回路基板の製造工程毎の状態を示す斜視図である。図6は、本発明の第2の実施形態に係る多層回路基板の製造フローを示す図である。
次に、第3の実施形態に係る多層回路基板および多層回路基板の製造方法について、図を参照して説明する。図7は、本発明の第3の実施形態に係る多層回路基板の外観斜視図である。図8は、本発明の第3の実施形態に係る多層回路基板の製造工程毎の状態を示す斜視図である。
次に、本発明の第4の実施形態に係る多層回路基板および多層回路基板の製造方法について、図を参照して説明する。図9は、本発明の第4の実施形態に係る多層回路基板の外観斜視図である。
次に、本発明の第5の実施形態に係る多層回路基板について、図を参照して説明する。図10は、本発明の第5の実施形態に係る多層回路基板の外観斜視図である。図11は、本発明の第5の実施形態に係る多層回路基板の製造工程毎の状態を示す斜視図である。
次に、本発明の第6の実施形態に係る多層回路基板について、図を参照して説明する。図12は、本発明の第6の実施形態に係る多層回路基板の外観斜視図である。図13は、本発明の第6の実施形態に係る多層回路基板図の平面図である。図14は、図13における本発明の第6の実施形態に係る多層回路基板のA−A’断面図である。図15は、本発明の第6の実施形態に係る多層回路基板の製造フローを示す図である。
次に、本発明の第7の実施形態に係る多層回路基板について、図を参照して説明する。図16は、本発明の第7の実施形態に係る多層回路基板の外観斜視図である。図17は、本発明の第7の実施形態に係る多層回路基板の平面図である。図18は、図17における本発明の第7の実施形態に係る多層回路基板のB−B’断面図である。
次に、第8の実施形態に係る多層回路基板について、図を参照して説明する。図19は、本発明の第8の実施形態に係る多層回路基板の分解斜視図である。図20は、本発明の第8の実施形態に係る多層回路基板の外観斜視図である。
次に、本発明の第9の実施形態に係る多層回路基板について、図を参照して説明する。図21は、本発明の第9の実施形態に係る多層回路基板の外観斜視図である。
次に、本発明の第10の実施形態に係る多層回路基板について、図を参照して説明する。図22は、本発明の第10の実施形態に係る多層回路基板の外観斜視図である。
次に、本発明の第11の実施形態に係る多層回路基板について、図を参照して説明する。図23は、本発明の第11の実施形態に係る多層回路基板の部分断面図である。
21:信号導体
22:アンテナ導体
23,24,251,263:接続用ランド導体
25:インダクタ導体
30B,30C:グランド導体
31:第1グランド導体
33:グランド導体
41:第2グランド導体
51,52,70:層間接続導体
61,62,61C,62C,63,64,65:外部接続端子
70,71,72,73:層間接続導体
80:孔
90,90A,90B,90C,90D,90E,90F,90G,90H,90J,90K:積層体
210C:引き出し用導体
261,262:キャパシタ用導体
271,272:接続用導体
310、310C:各開口部
610:コネクタ
620,630:電子部品
901,902,903,901DS,902DS,901S,902S,903S,901GS,902GS,901HS,902HS,903HS,901JS,902JS,903JS,901KS,902KS,903KS:絶縁基材
910:LDS添加剤
911:段差
950:凹部
951:凹部950を覆う導体
Claims (8)
- 複数の絶縁基材を積層した積層体と、
前記積層体に形成された導体と、を備え、
前記複数の絶縁基材は、それぞれに伸長方向の途中位置で厚みが変化する湾曲面を有する第1の絶縁基材と第2の絶縁基材とを有し、
前記第1の絶縁基材は、レーザダイレクトストラクチュアリング用添加剤が含有または塗布されたものであり、
前記導体は、前記湾曲面を含んで、前記レーザダイレクトストラクチュアリング用添加剤にレーザを照射した領域にメッキ形成することによって形成されたものであり、
前記第1の絶縁基材と前記第2の絶縁基材とは、互いの湾曲面が当接し、且つ、互いの厚い部分と薄い部分とが当接するように積層されている、
多層回路基板。 - 前記第2の絶縁基材における前記第1の絶縁基材に当接する面と反対側の面には、外面導体が形成されている、
請求項1に記載の多層回路基板。 - 前記第2の絶縁基材は、レーザダイレクトストラクチュアリング用添加剤が含有または塗布されたものであり、
前記外面導体は、前記レーザダイレクトストラクチュアリング用添加剤にレーザを照射した領域にメッキ形成することによって形成されたものである、
請求項2に記載の多層回路基板。 - 前記導体と前記外面導体とは接続されている、
請求項2または請求項3に記載の多層回路基板。 - 前記導体は、その一部分が他の部分とは積層方向において異なる位置に設けられている、
請求項1乃至請求項4のいずれかに記載の多層回路基板。 - 前記積層体の側面に形成された側面導体を備え、
前記積層体の側面のうち、前記側面導体が形成されていない領域に孔が形成されている、
請求項1乃至請求項5のいずれかに記載の多層回路基板。 - 外面導体は、前記積層体の側面にも形成され、
前記積層体の前記側面のうち、前記外面導体が形成されていない領域に孔が形成されている、
請求項1乃至請求項5のいずれかに記載の多層回路基板。 - 前記孔は複数設けられ、
複数の前記孔が、前記積層体の伸長方向に沿って周期的に形成されている、
請求項6または請求項7に記載の多層回路基板。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014175600 | 2014-08-29 | ||
JP2014175600 | 2014-08-29 | ||
JP2014245316 | 2014-12-03 | ||
JP2014245316 | 2014-12-03 | ||
JP2015042598 | 2015-03-04 | ||
JP2015042598 | 2015-03-04 | ||
PCT/JP2015/073470 WO2016031691A1 (ja) | 2014-08-29 | 2015-08-21 | 多層回路基板の製造方法および多層回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016031691A1 JPWO2016031691A1 (ja) | 2017-04-27 |
JP6344476B2 true JP6344476B2 (ja) | 2018-06-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016545480A Active JP6344476B2 (ja) | 2014-08-29 | 2015-08-21 | 多層回路基板 |
Country Status (4)
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US (1) | US10123414B2 (ja) |
JP (1) | JP6344476B2 (ja) |
CN (1) | CN207166874U (ja) |
WO (1) | WO2016031691A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108882569B (zh) * | 2018-08-31 | 2021-02-09 | 生益电子股份有限公司 | 一种pcb的制作方法和pcb |
CN110891364A (zh) * | 2019-11-28 | 2020-03-17 | 盐城维信电子有限公司 | 一种低损耗柔性线路板 |
CN217936041U (zh) | 2020-03-11 | 2022-11-29 | 株式会社村田制作所 | 树脂多层基板 |
JP7435734B2 (ja) | 2020-03-11 | 2024-02-21 | 株式会社村田製作所 | 樹脂多層基板 |
Family Cites Families (28)
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JPS5610791B2 (ja) * | 1972-09-19 | 1981-03-10 | ||
JPS5610791A (en) | 1979-07-05 | 1981-02-03 | Nec Corp | Storage system for office information |
JPH0615310U (ja) * | 1992-07-28 | 1994-02-25 | 株式会社東芝 | 高周波回路基板 |
JPH0730310A (ja) * | 1993-07-14 | 1995-01-31 | Murata Mfg Co Ltd | ストリップライン装置 |
JPH10270819A (ja) * | 1997-03-28 | 1998-10-09 | Ngk Spark Plug Co Ltd | 表面実装用電子部品とその製造方法 |
US6706785B1 (en) * | 2000-02-18 | 2004-03-16 | Rona/Emi Industries, Inc. | Methods and compositions related to laser sensitive pigments for laser marking of plastics |
JP2002100842A (ja) * | 2000-09-22 | 2002-04-05 | Sumitomo Wiring Syst Ltd | フレキシブルフラット配線板及びその内部インピーダンスの調整方法 |
WO2003005784A2 (de) * | 2001-07-05 | 2003-01-16 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und verfahren zu ihrer herstellung |
JP4834937B2 (ja) * | 2001-08-22 | 2011-12-14 | 凸版印刷株式会社 | 高周波回路用多層配線板 |
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US20170188459A1 (en) | 2017-06-29 |
CN207166874U (zh) | 2018-03-30 |
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