JP6339020B2 - 携帯電子装置用の高性能ポリマー組成物 - Google Patents
携帯電子装置用の高性能ポリマー組成物 Download PDFInfo
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- JP6339020B2 JP6339020B2 JP2014547893A JP2014547893A JP6339020B2 JP 6339020 B2 JP6339020 B2 JP 6339020B2 JP 2014547893 A JP2014547893 A JP 2014547893A JP 2014547893 A JP2014547893 A JP 2014547893A JP 6339020 B2 JP6339020 B2 JP 6339020B2
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- 229920000642 polymer Polymers 0.000 title claims description 86
- 239000000203 mixture Substances 0.000 title claims description 61
- 229920006260 polyaryletherketone Polymers 0.000 claims description 54
- -1 aromatic sulfone Chemical class 0.000 claims description 33
- 239000003365 glass fiber Substances 0.000 claims description 22
- 239000012763 reinforcing filler Substances 0.000 claims description 20
- 229920000491 Polyphenylsulfone Polymers 0.000 claims description 12
- 229920002492 poly(sulfone) Polymers 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000835 fiber Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004695 Polyether sulfone Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 4
- 229920006393 polyether sulfone Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000010456 wollastonite Substances 0.000 description 3
- 229910052882 wollastonite Inorganic materials 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000005600 alkyl phosphonate group Chemical group 0.000 description 2
- 150000008052 alkyl sulfonates Chemical class 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- JQZOKLXPZCGGRL-KTKRTIGZSA-N CCC(C)/C=C\C(C)(C[N](C)(C)(N)#C)OC Chemical compound CCC(C)/C=C\C(C)(C[N](C)(C)(N)#C)OC JQZOKLXPZCGGRL-KTKRTIGZSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- ZGDWHDKHJKZZIQ-UHFFFAOYSA-N cobalt nickel Chemical compound [Co].[Ni].[Ni].[Ni] ZGDWHDKHJKZZIQ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
- C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Description
本出願は、2011年12月21日に出願された米国出願第61/578338号明細書に対する優先権を主張し、これらの出願のそれぞれの全内容は、すべての目的のために参照により本明細書に組み込まれる。
− 少なくとも1種のポリアリールエーテルケトン(PAEK);
− 少なくとも1種の芳香族スルホンポリマー(SP)、および
− 少なくとも1種の強化フィラー
を含むポリマー組成物(C)から作られた少なくとも1つの構造部分を備える携帯電子装置に関する。
最初に、「ポリアリールエーテルケトン(PAEK)」という用語は、本発明の目的において、繰り返し単位を含むあらゆるポリマーを意味し、前記繰り返し単位の50モル%超は、Ar−C(=O)−Ar’基(ArおよびAr’は、互いに等しいかまたは異なっていて、芳香族基である)を含む繰り返し単位(RPAEK)である。繰り返し単位(RPAEK)は、一般に以下の式(J−A)〜式(J−O):
(式中:
− R’のそれぞれは、互いに等しいかまたは異なっていて、ハロゲン、アルキル、アルケニル、アルキニル、アリール、エーテル、チオエーテル、カルボン酸、エステル、アミド、イミド、アルカリまたはアルカリ土類金属スルホネート、アルキルスルホネート、アルカリまたはアルカリ土類金属ホスホネート、アルキルホスホネート、アミンおよび第四級アンモニウムからなる群から選択され;
− J’は、ゼロであるか、または0〜4の整数である)
からなる群から選択される。
本発明において、「芳香族スルホンポリマー(SP)」という表現は、その繰り返し単位の少なくとも50モル%が、式(SP)[繰り返し単位(Rsp)]:
−Ar−SO2−Ar’− 式(SP)
(ArおよびAr’は、互いに等しいかまたは異なっていて、芳香族基である)
の少なくとも1種の基を構成する、任意のポリマーを意味することが意図される。
−Ar1−(T’−Ar2)n−O−Ar3−SO2−[Ar4−(T−Ar2)n−SO2]m−Ar5−O−
(式中:
− Ar1、Ar2、Ar3、Ar4、およびAr5は、互いに等しいかまたは異なっていて、出現するごとに、独立して芳香族単核または多核基であり;
− TおよびT’は、互いに等しいかまたは異なっていて、出現するごとに、独立して結合、または1個もしくは2個以上のヘテロ原子を場合によって含む二価の基であり、好ましくはT’は、結合、−CH2−、−C(O)−、−C(CH3)2−、−C(CF3)2−、−C(=CCl2)−、−SO2−、−C(CH3)(CH2CH2COOH)−、および式:
の基からなる群から選択され、かつ好ましくは、Tは、結合、−CH2−、−C(O)−、−C(CH3)2−、−C(CF3)2−、−C(=CCl2)、−C(CH3)(CH2CH2COOH)−、および式:
の基からなる群から選択され、かつ
− nおよびmは、互いに等しいかまたは異なっていて、独立してゼロまたは1〜5の整数である)
に従う。
(式中:
− R’のそれぞれは、互いに等しいかまたは異なっていて、ハロゲン、アルキル、アルケニル、アルキニル、アリール、エーテル、チオエーテル、カルボン酸、エステル、アミド、イミド、アルカリまたはアルカリ土類金属スルホネート、アルキルスルホネート、アルカリまたはアルカリ土類金属ホスホネート、アルキルホスホネート、アミンおよび第四級アンモニウムからなる群から選択され;
− j’は、ゼロまたは0〜4の整数であり;
− TおよびT’は、互いに等しいかまたは異なっていて、結合、または1個もしくは2個以上のヘテロ原子を場合によって含む二価の基であり;好ましくは、T’は、結合、−CH2−、−C(O)−、−C(CH3)2−、−C(CF3)2−、−C(=CCl2)−、−C(CH3)(CH2CH2COOH)−、−SO2−、および式:
の基からなる群から選択され、かつ好ましくはTは、結合、−CH2−、−C(O)−、−C(CH3)2−、−C(CF3)2−、−C(=CCl2)−、−C(CH3)(CH2CH2COOH)−、および式:
の基からなる群から選択される)
のものからなる群から選択され得る。
(式中:
QおよびAr*は、互いに等しいかまたは異なっていて、出現するごとに、独立して二価の芳香族基であり;好ましくはAr*およびQは、互いに等しいかまたは異なっていて、出現するごとに、以下の構造:
および対応する場合によって置換された構造[Yは、−O−、−CH=CH、−C≡C−、−S−、−C(O)−、−(CH2)n−、−C(CF3)2−、−C(CH3)2−、−SO2−、−(CF2)n−(nは、1〜5の整数である)およびそれらの混合物である];ならびにそれらの混合物からなる群から独立して選択される)
である。
上述されたポリアリールエーテルケトン(PAEK)および芳香族スルホンポリマー(SP)に加えて、ポリマー組成物(C)は、少なくとも1種の強化フィラーも含む。
ポリマー組成物(C)は、紫外線安定剤、熱安定剤、酸化防止剤、顔料、加工助剤、潤滑剤、難燃剤、および/または導電性添加剤(例えば、カーボンブラックおよびカーボンナノフィブリル)などの追加の添加剤をさらに任意選択的に含んでもよい。
Claims (12)
- 前記ポリアリールエーテルケトン(PAEK)が、前記ポリマー組成物(C)の全重量に基づいて、少なくとも2重量%の量で存在する、請求項1または2に記載の携帯電子装置。
- 前記ポリアリールエーテルケトン(PAEK)が、前記ポリマー組成物(C)の全重量に基づいて、最大で40重量%の量で存在する、請求項1〜3のいずれか一項に記載の携帯電子装置。
- 前記少なくとも1種の芳香族スルホンポリマー(SP)が、前記ポリマー組成物(C)の全重量に基づいて、少なくとも20重量%の量で存在する、請求項1〜4のいずれか一項に記載の携帯電子装置。
- 前記少なくとも1種の芳香族スルホンポリマー(SP)が、前記ポリマー組成物(C)の全重量に基づいて、最大で80重量%の量で存在する、請求項1〜5のいずれか一項に記載の携帯電子装置。
- 前記強化フィラーが、繊維状強化フィラーである、請求項1〜6のいずれか一項に記載の携帯電子装置。
- 前記繊維状強化フィラーが、Sガラス繊維である、請求項7に記載の携帯電子装置。
- 前記強化フィラーが、前記ポリマー組成物(C)の全重量に基づいて、少なくとも20重量%の量で存在する、請求項1〜8のいずれか一項に記載の携帯電子装置。
- 前記強化フィラーが、前記ポリマー組成物(C)の全重量に基づいて、最大で40重量%の量で存在する、請求項1〜9のいずれか一項に記載の携帯電子装置。
- ラップトップ、携帯電話、GPS、タブレット、携帯端末、携帯記録装置、携帯再生装置および携帯ラジオ受信機である、請求項1〜10のいずれか一項に記載の携帯電子装置。
- 携帯電話である、請求項11に記載の携帯電子装置。
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US11060183B2 (en) | 2012-03-23 | 2021-07-13 | Hzo, Inc. | Apparatuses, systems and methods for applying protective coatings to electronic device assemblies |
EP2738219A1 (en) | 2012-11-28 | 2014-06-04 | Solvay Specialty Polymers USA, LLC. | PAEK/PAES compositions |
WO2014095973A1 (en) * | 2012-12-18 | 2014-06-26 | Solvay Specialty Polymers Usa, Llc | Mobile electronic devices made of low-chlorine aromatic polysulfones |
GB201410221D0 (en) | 2014-06-09 | 2014-07-23 | Victrex Mfg Ltd | Polymeric materials |
WO2016102330A1 (en) * | 2014-12-22 | 2016-06-30 | Solvay Specialty Polymers Usa, Llc | Paek/ppsu/pes compositions |
EP3298071A1 (en) * | 2015-05-21 | 2018-03-28 | Solvay Specialty Polymers USA, LLC. | Poly(aryletherketone) compositions |
WO2016198372A1 (en) * | 2015-06-10 | 2016-12-15 | Solvay Specialty Polymers Usa, Llc | Polymer composition and sterilizable articles obtainable therefrom |
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US20190127581A1 (en) * | 2016-04-29 | 2019-05-02 | Solvay Specialty Polymers Usa, Llc | High-flow polyphenylsulfone compositions |
JP2019515111A (ja) * | 2016-05-09 | 2019-06-06 | ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー | ポリカーボネート−ポリシロキサンコポリマーを含有するポリフェニルスルホン組成物 |
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