JP6335458B2 - 損傷したエポキシを静電チャックから除去する方法 - Google Patents

損傷したエポキシを静電チャックから除去する方法 Download PDF

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Publication number
JP6335458B2
JP6335458B2 JP2013195671A JP2013195671A JP6335458B2 JP 6335458 B2 JP6335458 B2 JP 6335458B2 JP 2013195671 A JP2013195671 A JP 2013195671A JP 2013195671 A JP2013195671 A JP 2013195671A JP 6335458 B2 JP6335458 B2 JP 6335458B2
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JP
Japan
Prior art keywords
electrostatic chuck
epoxy band
epoxy
band
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013195671A
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English (en)
Japanese (ja)
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JP2014068011A (ja
JP2014068011A5 (enExample
Inventor
ホン・シー
トゥオチャン・ホワーン
ヤン・ファン
クリフ・ラクロア
ニール・ニュートン
リッシュ・チャトレ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
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Publication date
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Publication of JP2014068011A5 publication Critical patent/JP2014068011A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013195671A 2012-09-21 2013-09-20 損傷したエポキシを静電チャックから除去する方法 Active JP6335458B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/624,822 2012-09-21
US13/624,822 US9105676B2 (en) 2012-09-21 2012-09-21 Method of removing damaged epoxy from electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2014068011A JP2014068011A (ja) 2014-04-17
JP2014068011A5 JP2014068011A5 (enExample) 2016-10-20
JP6335458B2 true JP6335458B2 (ja) 2018-05-30

Family

ID=50318568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013195671A Active JP6335458B2 (ja) 2012-09-21 2013-09-20 損傷したエポキシを静電チャックから除去する方法

Country Status (5)

Country Link
US (1) US9105676B2 (enExample)
JP (1) JP6335458B2 (enExample)
KR (1) KR102175521B1 (enExample)
CN (1) CN103681415B (enExample)
TW (1) TWI591754B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
JP5811513B2 (ja) * 2014-03-27 2015-11-11 Toto株式会社 静電チャック
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
US10340171B2 (en) * 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US10629416B2 (en) 2017-01-23 2020-04-21 Infineon Technologies Ag Wafer chuck and processing arrangement
CN107952727A (zh) * 2017-11-30 2018-04-24 芜湖通潮精密机械股份有限公司 静电卡盘产品污染物清洗处理的方法
CN108598022B (zh) * 2018-05-08 2021-05-14 睿昇电子科技(深圳)有限公司 一种半导体电子器件封装外观除胶设备及除胶方法
JP7213691B2 (ja) * 2019-01-07 2023-01-27 日本特殊陶業株式会社 静電チャック
KR20230034452A (ko) * 2021-09-02 2023-03-10 주식회사 템네스트 반도체 웨이퍼 제조 장치 및 그 내식성 향상 방법
TWI888077B (zh) * 2024-03-27 2025-06-21 萬潤科技股份有限公司 作業方法及裝置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2867051B2 (ja) * 1989-12-28 1999-03-08 住友シチックス株式会社 ウエーハの剥離方法
JP2002026362A (ja) * 2000-07-13 2002-01-25 Canon Inc 積層体の加工方法及び加工装置
US6624734B2 (en) * 2001-09-21 2003-09-23 Abb Technology Ag DC voltage/current heating/gelling/curing of resin encapsulated distribution transformer coils
EP1635388A4 (en) * 2003-06-17 2009-10-21 Creative Tech Corp DIPOLAR ELECTROSTATIC CLAMPING DEVICE
JP4425850B2 (ja) * 2005-11-07 2010-03-03 日本碍子株式会社 基板載置部材の分離方法及び再利用方法
CN100370592C (zh) * 2005-12-08 2008-02-20 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘
US20080092806A1 (en) * 2006-10-19 2008-04-24 Applied Materials, Inc. Removing residues from substrate processing components
US8291565B2 (en) * 2008-10-10 2012-10-23 Lam Research Corporation Method of refurbishing bipolar electrostatic chuck
JP2010129845A (ja) * 2008-11-28 2010-06-10 Creative Technology:Kk 静電チャック及びその製造方法
JP5423632B2 (ja) * 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
US20120118510A1 (en) * 2010-11-15 2012-05-17 Applied Materials, Inc. Method for debonding components in a chamber
US20120154974A1 (en) * 2010-12-16 2012-06-21 Applied Materials, Inc. High efficiency electrostatic chuck assembly for semiconductor wafer processing

Also Published As

Publication number Publication date
CN103681415B (zh) 2017-01-11
KR20140038909A (ko) 2014-03-31
JP2014068011A (ja) 2014-04-17
CN103681415A (zh) 2014-03-26
US20140083461A1 (en) 2014-03-27
TW201421610A (zh) 2014-06-01
KR102175521B1 (ko) 2020-11-09
TWI591754B (zh) 2017-07-11
US9105676B2 (en) 2015-08-11

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