JP2014068011A5 - - Google Patents
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- Publication number
- JP2014068011A5 JP2014068011A5 JP2013195671A JP2013195671A JP2014068011A5 JP 2014068011 A5 JP2014068011 A5 JP 2014068011A5 JP 2013195671 A JP2013195671 A JP 2013195671A JP 2013195671 A JP2013195671 A JP 2013195671A JP 2014068011 A5 JP2014068011 A5 JP 2014068011A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy band
- epoxy
- band
- tip tool
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 description 51
- 239000010410 layer Substances 0.000 description 20
- 239000002826 coolant Substances 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 7
- 239000006227 byproduct Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/624,822 | 2012-09-21 | ||
| US13/624,822 US9105676B2 (en) | 2012-09-21 | 2012-09-21 | Method of removing damaged epoxy from electrostatic chuck |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014068011A JP2014068011A (ja) | 2014-04-17 |
| JP2014068011A5 true JP2014068011A5 (enExample) | 2016-10-20 |
| JP6335458B2 JP6335458B2 (ja) | 2018-05-30 |
Family
ID=50318568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013195671A Active JP6335458B2 (ja) | 2012-09-21 | 2013-09-20 | 損傷したエポキシを静電チャックから除去する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9105676B2 (enExample) |
| JP (1) | JP6335458B2 (enExample) |
| KR (1) | KR102175521B1 (enExample) |
| CN (1) | CN103681415B (enExample) |
| TW (1) | TWI591754B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9869392B2 (en) | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US10090211B2 (en) | 2013-12-26 | 2018-10-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| JP5811513B2 (ja) * | 2014-03-27 | 2015-11-11 | Toto株式会社 | 静電チャック |
| US9999947B2 (en) * | 2015-05-01 | 2018-06-19 | Component Re-Engineering Company, Inc. | Method for repairing heaters and chucks used in semiconductor processing |
| US10340171B2 (en) * | 2016-05-18 | 2019-07-02 | Lam Research Corporation | Permanent secondary erosion containment for electrostatic chuck bonds |
| US10629416B2 (en) | 2017-01-23 | 2020-04-21 | Infineon Technologies Ag | Wafer chuck and processing arrangement |
| CN107952727A (zh) * | 2017-11-30 | 2018-04-24 | 芜湖通潮精密机械股份有限公司 | 静电卡盘产品污染物清洗处理的方法 |
| CN108598022B (zh) * | 2018-05-08 | 2021-05-14 | 睿昇电子科技(深圳)有限公司 | 一种半导体电子器件封装外观除胶设备及除胶方法 |
| JP7213691B2 (ja) * | 2019-01-07 | 2023-01-27 | 日本特殊陶業株式会社 | 静電チャック |
| KR20230034452A (ko) * | 2021-09-02 | 2023-03-10 | 주식회사 템네스트 | 반도체 웨이퍼 제조 장치 및 그 내식성 향상 방법 |
| TWI888077B (zh) * | 2024-03-27 | 2025-06-21 | 萬潤科技股份有限公司 | 作業方法及裝置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2867051B2 (ja) * | 1989-12-28 | 1999-03-08 | 住友シチックス株式会社 | ウエーハの剥離方法 |
| JP2002026362A (ja) * | 2000-07-13 | 2002-01-25 | Canon Inc | 積層体の加工方法及び加工装置 |
| US6624734B2 (en) * | 2001-09-21 | 2003-09-23 | Abb Technology Ag | DC voltage/current heating/gelling/curing of resin encapsulated distribution transformer coils |
| EP1635388A4 (en) * | 2003-06-17 | 2009-10-21 | Creative Tech Corp | DIPOLAR ELECTROSTATIC CLAMPING DEVICE |
| JP4425850B2 (ja) * | 2005-11-07 | 2010-03-03 | 日本碍子株式会社 | 基板載置部材の分離方法及び再利用方法 |
| CN100370592C (zh) * | 2005-12-08 | 2008-02-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 静电卡盘 |
| US20080092806A1 (en) * | 2006-10-19 | 2008-04-24 | Applied Materials, Inc. | Removing residues from substrate processing components |
| US8291565B2 (en) * | 2008-10-10 | 2012-10-23 | Lam Research Corporation | Method of refurbishing bipolar electrostatic chuck |
| JP2010129845A (ja) * | 2008-11-28 | 2010-06-10 | Creative Technology:Kk | 静電チャック及びその製造方法 |
| JP5423632B2 (ja) * | 2010-01-29 | 2014-02-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
| US20120118510A1 (en) * | 2010-11-15 | 2012-05-17 | Applied Materials, Inc. | Method for debonding components in a chamber |
| US20120154974A1 (en) * | 2010-12-16 | 2012-06-21 | Applied Materials, Inc. | High efficiency electrostatic chuck assembly for semiconductor wafer processing |
-
2012
- 2012-09-21 US US13/624,822 patent/US9105676B2/en active Active
-
2013
- 2013-09-20 JP JP2013195671A patent/JP6335458B2/ja active Active
- 2013-09-22 CN CN201310431916.8A patent/CN103681415B/zh active Active
- 2013-09-23 KR KR1020130112919A patent/KR102175521B1/ko active Active
- 2013-09-23 TW TW102134150A patent/TWI591754B/zh active
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