JP6334864B2 - 有機発光装置およびその製造方法 - Google Patents
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Description
2:カッター
10:下部保護フィルム
11:キャリアフィルム
12:粘着剤層
13:第1除電層
14:離型フィルム
16:第2除電層
15:第3除電層
17:遮光層
18:放熱板
20:基板
30:有機発光素子
40:薄膜封止層
50:上部保護フィルム
100:有機発光表示パネル
Claims (17)
- 可撓性基板と、
前記可撓性基板上の有機発光素子と、
前記有機発光素子を覆う薄膜封止層と、
前記可撓性基板の下に付着される下部保護フィルムと、を含み、
前記下部保護フィルムは、静電気を除去する第1除電層と、キャリアフィルムと、前記キャリアフィルム上の粘着剤層と、前記キャリアフィルムと前記粘着剤層との間に配置される遮光層及び放熱板の一方又は双方とを含むことを特徴とする有機発光装置。 - 前記有機発光素子は、
前記可撓性基板上に形成されており、スキャン信号を伝達するゲート線と、
前記ゲート線と絶縁されて交差しており、データ信号および駆動電圧をそれぞれ伝達するデータ線および駆動電圧線と、
前記ゲート線およびデータ線に連結されているスイッチング薄膜トランジスタと、
前記スイッチング薄膜トランジスタおよび前記駆動電圧線に連結されている駆動薄膜トランジスタと、
前記駆動薄膜トランジスタに連結されている画素電極と、
前記画素電極上に形成されている有機発光部材と、
前記有機発光部材上に形成されている共通電極とを含むことを特徴とする請求項1記載の有機発光装置。 - 前記第1除電層は、前記可撓性基板と前記粘着剤層との間に位置し、前記可撓性基板に接触していることを特徴とする請求項1又は2に記載の有機発光装置。
- 前記キャリアフィルムと前記粘着剤層は、前記可撓性基板と前記第1除電層との間に位置することを特徴とする請求項1又は2に記載の有機発光装置。
- 前記キャリアフィルムの下に第2除電層をさらに含み、
前記第1除電層は、前記可撓性基板と前記粘着剤層との間に位置することを特徴とする請求項1記載の有機発光装置。 - 前記キャリアフィルムは、ポリエチレンテレフタレート(polyethylene terephthalate、PET)、ポリエチレンナフタレート(polyethylene naphthalate、PEN)、ポリエチレンスルフィド(polyethylene sulfide、PES)、ポリエチレン(polyethylene、PE)の中から選択されたいずれか1つの物質を含むことを特徴とする請求項1〜5のいずれか一項記載の有機発光装置。
- 前記キャリアフィルムの厚さは、25μm〜300μmであることを特徴とする請求項1〜6のいずれか一項記載の有機発光装置。
- 前記粘着剤層は、アクリル(Acryl)系の強粘着フィルムであることを特徴とする請求項1記載の有機発光装置。
- 前記粘着剤層の粘着力は、被着剤がステンレス鋼(steel use stainless、SUS)の場合、500gf/inch以上であることを特徴とする請求項8記載の有機発光装置。
- 支持部材上に、可撓性基板と、前記可撓性基板上に形成されている複数の有機発光素子と、前記有機発光素子を覆っている薄膜封止層と、を含む有機発光表示パネルを形成するステップと、
前記有機発光表示パネルから前記支持部材を分離するステップと、
前記有機発光表示パネルの前記可撓性基板の下に下部保護フィルムを付着するステップと、
前記有機発光表示パネルをカッティングして複数の有機発光装置に分離するステップと、を含み、
前記下部保護フィルムは、静電気を除去する第1除電層と、キャリアフィルムと、前記キャリアフィルム上の粘着剤層と、前記キャリアフィルムと前記粘着剤層との間に配置される遮光層及び放熱板の一方又は双方とを含むことを特徴とする有機発光装置の製造方法。 - 前記下部保護フィルムは、前記粘着剤層上に前記第1除電層が設けられ、
前記下部保護フィルムを付着するステップは、
前記第1除電層上に離型フィルムが付着された状態で前記下部保護フィルムを提供するステップと、
前記下部保護フィルムから前記離型フィルムを除去するステップと、を含むことを特徴とする請求項10記載の有機発光装置の製造方法。 - 前記下部保護フィルムは、前記可撓性基板と前記第1除電層との間に、前記キャリアフィルムと前記粘着剤層とが設けられ、
前記下部保護フィルムを付着するステップは、
前記粘着剤層上に離型フィルムが付着された状態で前記下部保護フィルムを提供するステップと、
前記下部保護フィルムから前記離型フィルムを除去するステップと、を含むことを特徴とする請求項10記載の有機発光装置の製造方法。 - 前記下部保護フィルムは、前記キャリアフィルムの下に第2除電層をさらに含み、前記可撓性基板と前記粘着剤層との間に、前記第1除電層が設けられ、
前記下部保護フィルムを付着するステップは、
前記第1除電層上に離型フィルムが付着された状態で前記下部保護フィルムを提供するステップと、
前記下部保護フィルムから前記離型フィルムを除去するステップと、を含むことを特徴とする請求項10記載の有機発光装置の製造方法。 - 前記粘着剤層は、アクリル(Acryl)系の強粘着フィルムであることを特徴とする請求項10〜13のいずれか一項記載の有機発光装置の製造方法。
- 前記粘着剤層の粘着力は、被着剤がステンレス鋼(steel use stainless、SUS)の場合、500gf/inch以上であることを特徴とする請求項14記載の有機発光装置の製造方法。
- 前記有機発光表示パネルから前記支持部材を取り外す前に、前記有機発光表示パネルの薄膜封止層上に上部保護フィルムを付着するステップをさらに含むことを特徴とする請求項10〜15のいずれか一項記載の有機発光装置の製造方法。
- 前記有機発光表示パネルをカッティングして複数の有機発光装置に分離した後、前記上部保護フィルムを除去するステップをさらに含むことを特徴とする請求項16記載の有機発光装置の製造方法。
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Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103384447B (zh) * | 2013-06-26 | 2016-06-29 | 友达光电股份有限公司 | 软性电子装置 |
KR102120423B1 (ko) | 2013-09-16 | 2020-06-09 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
CN104167513A (zh) * | 2014-07-22 | 2014-11-26 | 京东方科技集团股份有限公司 | 柔性显示面板的制作方法和柔性显示装置 |
KR102206027B1 (ko) * | 2014-10-06 | 2021-01-20 | 삼성전자주식회사 | 박막 형성 장치 및 이를 이용한 유기 발광 소자의 제조 방법 |
KR102388722B1 (ko) * | 2015-11-20 | 2022-04-21 | 삼성디스플레이 주식회사 | 표시 장치 및 유기 발광 표시 장치 |
KR101821782B1 (ko) | 2016-03-11 | 2018-01-25 | 삼성디스플레이 주식회사 | 디스플레이 장치 제조방법 및 디스플레이 장치 |
KR102550696B1 (ko) * | 2016-04-08 | 2023-07-04 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN105957869B (zh) * | 2016-06-22 | 2018-09-04 | 京东方科技集团股份有限公司 | 承载基板及其制作方法 |
KR20180018972A (ko) * | 2016-08-12 | 2018-02-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN107482041B (zh) | 2017-08-16 | 2020-04-24 | 武汉天马微电子有限公司 | 柔性显示面板与柔性显示装置 |
JP2019090879A (ja) * | 2017-11-13 | 2019-06-13 | 株式会社Joled | 表示装置および表示装置の製造方法 |
CN107978687B (zh) * | 2017-11-22 | 2020-06-05 | 武汉华星光电半导体显示技术有限公司 | 柔性oled显示面板的制备方法 |
KR102290640B1 (ko) | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
KR102290639B1 (ko) * | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
KR102293549B1 (ko) * | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
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KR102293935B1 (ko) * | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
CN111226314B (zh) * | 2018-07-27 | 2023-12-22 | 青禾晶元(天津)半导体材料有限公司 | 多层复合基板结构及其制备方法 |
KR102290629B1 (ko) * | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
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KR102293550B1 (ko) * | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
KR20200094243A (ko) * | 2019-01-29 | 2020-08-07 | 삼성디스플레이 주식회사 | 표시 장치 |
CN110930880A (zh) * | 2019-11-27 | 2020-03-27 | 昆山国显光电有限公司 | 显示模组及显示模组制作方法 |
US11744107B2 (en) * | 2020-06-09 | 2023-08-29 | Samsung Display Co., Ltd. | Display device including light-blocking layer directly attached to supporting member for improved visibility |
TWI757141B (zh) * | 2021-04-01 | 2022-03-01 | 友達光電股份有限公司 | 顯示裝置及其製造方法 |
CN113793860A (zh) * | 2021-07-13 | 2021-12-14 | 上海和辉光电股份有限公司 | 一种改善残影的柔性显示面板及其制备方法 |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS533274A (en) | 1976-06-28 | 1978-01-12 | Sanyo Electric Co Ltd | Charging device of electronic watch |
CN2101357U (zh) * | 1991-08-31 | 1992-04-08 | 符晓友 | 屏幕静电消除膜 |
JPH08137392A (ja) * | 1994-09-14 | 1996-05-31 | Petsutaa:Kk | ラベル連続体 |
JP3533274B2 (ja) | 1995-10-20 | 2004-05-31 | 藤森工業株式会社 | 偏光板または位相板の表面保護フィルム |
JPH09249866A (ja) * | 1996-03-19 | 1997-09-22 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物 |
US6265820B1 (en) * | 1998-01-29 | 2001-07-24 | Emagin Corporation | Heat removal system for use in organic light emitting diode displays having high brightness |
JP2001147441A (ja) * | 1999-11-19 | 2001-05-29 | Nec Corp | 横電界液晶表示装置 |
JP2001313164A (ja) * | 2000-04-28 | 2001-11-09 | Matsushita Electric Ind Co Ltd | 有機エレクトロルミネッセンス素子、それを用いた表示装置及び携帯端末 |
SG102681A1 (en) * | 2001-02-19 | 2004-03-26 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
TW548860B (en) * | 2001-06-20 | 2003-08-21 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
JP4712298B2 (ja) * | 2002-12-13 | 2011-06-29 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
JP3902186B2 (ja) * | 2003-04-21 | 2007-04-04 | 日東電工株式会社 | 帯電防止型光学フィルム、その製造方法、及び画像表示装置 |
JP4131838B2 (ja) | 2003-05-16 | 2008-08-13 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP4241217B2 (ja) * | 2003-06-24 | 2009-03-18 | コニカミノルタエムジー株式会社 | 感光性分散乳剤、該感光性分散乳剤を含有する熱現像感光材料および該熱現像感光材料を用いる画像形成方法 |
KR100611226B1 (ko) * | 2003-11-25 | 2006-08-09 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
US20070222370A1 (en) * | 2003-12-30 | 2007-09-27 | Agency For Science, Technology And Research | Flexible Electroluminescent Devices |
JP2006004907A (ja) * | 2004-05-18 | 2006-01-05 | Seiko Epson Corp | エレクトロルミネッセンス装置及び電子機器 |
JP4741200B2 (ja) * | 2004-05-28 | 2011-08-03 | 共同印刷株式会社 | 有機elディスプレイ及びその製造方法 |
JP4744862B2 (ja) * | 2004-12-16 | 2011-08-10 | 東芝モバイルディスプレイ株式会社 | 表示装置の製造方法 |
KR100635501B1 (ko) | 2005-01-24 | 2006-10-17 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
US7541671B2 (en) * | 2005-03-31 | 2009-06-02 | General Electric Company | Organic electronic devices having external barrier layer |
WO2007043285A1 (en) * | 2005-09-30 | 2007-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
JP5063066B2 (ja) * | 2005-09-30 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR100714017B1 (ko) * | 2005-12-14 | 2007-05-04 | 삼성에스디아이 주식회사 | 유기 발광표시장치 |
KR100831562B1 (ko) | 2006-03-23 | 2008-05-21 | 주식회사 엘지화학 | 유연성 기판 반송용 점착제 조성물 |
KR20070121974A (ko) * | 2006-06-23 | 2007-12-28 | 엘지.필립스 엘시디 주식회사 | 유기 발광 표시 장치 및 그의 제조방법 |
WO2008020578A1 (fr) * | 2006-08-18 | 2008-02-21 | Dai Nippon Printing Co., Ltd. | Filtre avant pour dispositif d'affichage à plasma, et dispositif d'affichage a plasma |
US7649666B2 (en) * | 2006-12-07 | 2010-01-19 | E Ink Corporation | Components and methods for use in electro-optic displays |
JP4971826B2 (ja) | 2007-02-23 | 2012-07-11 | 帝人デュポンフィルム株式会社 | 表面保護用粘着フィルム |
US7977877B2 (en) * | 2007-03-02 | 2011-07-12 | Global Oled Technology Llc | Flat panel OLED device having deformable substrate |
KR100824966B1 (ko) * | 2007-03-30 | 2008-04-28 | 한울정보기술(주) | 이엘 소자 |
US8182633B2 (en) * | 2008-04-29 | 2012-05-22 | Samsung Electronics Co., Ltd. | Method of fabricating a flexible display device |
KR20090131460A (ko) | 2008-06-18 | 2009-12-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 대전방지성 표면 보호 필름 |
KR100989114B1 (ko) | 2008-08-07 | 2010-10-20 | 도레이첨단소재 주식회사 | 대전방지 폴리에스테르 필름의 제조방법, 그로부터 제조된대전방지 폴리에스테르 필름 및 그 용도 |
EP2178133B1 (en) * | 2008-10-16 | 2019-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Flexible Light-Emitting Device, Electronic Device, and Method for Manufacturing Flexible-Light Emitting Device |
DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
KR20100072653A (ko) * | 2008-12-22 | 2010-07-01 | 엘지디스플레이 주식회사 | 상부 발광방식 유기전계발광소자 및 이의 제조방법 |
TWI607670B (zh) * | 2009-01-08 | 2017-12-01 | 半導體能源研究所股份有限公司 | 發光裝置及電子裝置 |
KR101155907B1 (ko) | 2009-06-04 | 2012-06-20 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
US20110025196A1 (en) * | 2009-07-31 | 2011-02-03 | General Electric Company | Hermetic package with getter materials |
CN102013414A (zh) * | 2009-09-08 | 2011-04-13 | 群康科技(深圳)有限公司 | 软性显示器组件的制作方法 |
KR101084230B1 (ko) * | 2009-11-16 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
JP5493791B2 (ja) * | 2009-12-09 | 2014-05-14 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
KR101108161B1 (ko) * | 2009-12-24 | 2012-01-31 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
TWI504067B (zh) * | 2010-02-05 | 2015-10-11 | Chi Mei Comm Systems Inc | 多頻天線 |
KR101107176B1 (ko) * | 2010-02-08 | 2012-01-25 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
KR101003840B1 (ko) | 2010-03-29 | 2010-12-23 | 두성산업 주식회사 | 향상된 수직 열전도도, 수평 열전도도, 전자파 차폐능 및 전자파 흡수능을 가진 복합 기능 열확산 시트 |
KR20110108697A (ko) | 2010-03-29 | 2011-10-06 | 삼성전자주식회사 | 유기 발광 소자 및 이에 채용되는 편광 구조 장치 |
KR20120057881A (ko) | 2010-11-29 | 2012-06-07 | 노바테크 (주) | 평판 디스플레이의 스크래치 방지를 위한 보호필름 부착 방법 및 필름 재활용방법 |
KR101174884B1 (ko) * | 2010-12-23 | 2012-08-17 | 삼성디스플레이 주식회사 | 플렉시블 유기 발광 표시 장치 및 그 제조방법 |
KR101897743B1 (ko) * | 2011-06-01 | 2018-09-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
US8658444B2 (en) * | 2012-05-16 | 2014-02-25 | International Business Machines Corporation | Semiconductor active matrix on buried insulator |
KR102469186B1 (ko) * | 2015-04-30 | 2022-11-21 | 삼성디스플레이 주식회사 | 플렉서블 유기 발광 표시 장치 및 플렉서블 유기 발광 표시 장치의 제조 방법 |
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JP2014049441A (ja) | 2014-03-17 |
CN109166981A (zh) | 2019-01-08 |
CN103682148B (zh) | 2018-09-28 |
US20200235347A1 (en) | 2020-07-23 |
US20140061610A1 (en) | 2014-03-06 |
US11111347B2 (en) | 2021-09-07 |
EP2704198A1 (en) | 2014-03-05 |
CN103682148A (zh) | 2014-03-26 |
US10658626B2 (en) | 2020-05-19 |
US20170346045A1 (en) | 2017-11-30 |
CN109166981B (zh) | 2021-08-03 |
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