JP6333648B2 - 個片化物品の移送方法、製造方法及び製造装置 - Google Patents

個片化物品の移送方法、製造方法及び製造装置 Download PDF

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Publication number
JP6333648B2
JP6333648B2 JP2014145543A JP2014145543A JP6333648B2 JP 6333648 B2 JP6333648 B2 JP 6333648B2 JP 2014145543 A JP2014145543 A JP 2014145543A JP 2014145543 A JP2014145543 A JP 2014145543A JP 6333648 B2 JP6333648 B2 JP 6333648B2
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injection time
pads
article
suction
individual
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JP2014145543A
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English (en)
Japanese (ja)
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JP2016021541A (ja
Inventor
一郎 今井
一郎 今井
渡辺　創
創 渡辺
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Towa Corp
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Towa Corp
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Priority to JP2014145543A priority Critical patent/JP6333648B2/ja
Priority to CN201510319500.6A priority patent/CN105304542B/zh
Priority to KR1020150082691A priority patent/KR101741319B1/ko
Priority to TW104119208A priority patent/TWI548027B/zh
Publication of JP2016021541A publication Critical patent/JP2016021541A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Manipulator (AREA)
  • Eyeglasses (AREA)
JP2014145543A 2014-07-16 2014-07-16 個片化物品の移送方法、製造方法及び製造装置 Active JP6333648B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014145543A JP6333648B2 (ja) 2014-07-16 2014-07-16 個片化物品の移送方法、製造方法及び製造装置
CN201510319500.6A CN105304542B (zh) 2014-07-16 2015-06-11 单片化物品的移送方法、制造方法以及制造装置
KR1020150082691A KR101741319B1 (ko) 2014-07-16 2015-06-11 개편화 물품의 이송 방법, 제조 방법 및 제조 장치
TW104119208A TWI548027B (zh) 2014-07-16 2015-06-15 A method of transferring a monolithic article, a manufacturing method, and a manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014145543A JP6333648B2 (ja) 2014-07-16 2014-07-16 個片化物品の移送方法、製造方法及び製造装置

Publications (2)

Publication Number Publication Date
JP2016021541A JP2016021541A (ja) 2016-02-04
JP6333648B2 true JP6333648B2 (ja) 2018-05-30

Family

ID=55201620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014145543A Active JP6333648B2 (ja) 2014-07-16 2014-07-16 個片化物品の移送方法、製造方法及び製造装置

Country Status (4)

Country Link
JP (1) JP6333648B2 (zh)
KR (1) KR101741319B1 (zh)
CN (1) CN105304542B (zh)
TW (1) TWI548027B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6640142B2 (ja) 2017-03-31 2020-02-05 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
JP6901908B2 (ja) * 2017-06-02 2021-07-14 株式会社ディスコ チップ収容方法、搬送装置及び分割装置
JP6952515B2 (ja) * 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
JP6861602B2 (ja) * 2017-09-15 2021-04-21 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP7138002B2 (ja) * 2018-09-21 2022-09-15 株式会社ディスコ 搬送ユニット及び搬送方法
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
KR102630948B1 (ko) * 2020-12-29 2024-01-30 세메스 주식회사 반도체 패키지 이송 방법과 반도체 패키지 이송 모듈 및 반도체 패키지 절단 및 분류 장치
CN114178230B (zh) * 2021-11-17 2023-06-16 贵州德科纳精密设备制造有限公司 气门自动清洗机

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348033A (en) * 1991-10-01 1994-09-20 National Semiconductor Corporation Method and apparatus for handling singulated electronic components
JP2002050670A (ja) * 2000-08-04 2002-02-15 Toshiba Corp ピックアップ装置及びピックアップ方法
US6709877B2 (en) * 2001-07-23 2004-03-23 Asm Assembly Automation Limited Apparatus and method for testing semiconductor devices
JP2003168659A (ja) 2001-12-04 2003-06-13 Tokyo Seimitsu Co Ltd 高圧洗浄ノズルを有するシンギュレーション装置
JP3849589B2 (ja) 2002-06-20 2006-11-22 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP3769254B2 (ja) * 2002-09-10 2006-04-19 Ｓｍｃ株式会社 真空吸着装置及びその駆動方法
KR100604098B1 (ko) * 2005-04-20 2006-07-24 한미반도체 주식회사 반도체 패키지 픽업장치
US8011058B2 (en) * 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
JP2011207552A (ja) * 2010-03-29 2011-10-20 Ihi Corp 浮上搬送装置
JP2012033739A (ja) * 2010-07-30 2012-02-16 Japan Fine Tech Co Ltd 基板搬送装置
KR101559420B1 (ko) * 2011-01-19 2015-10-13 (주)테크윙 테스트핸들러용 반도체소자 파지 및 파지 해제 압 제공 시스템
US9519007B2 (en) * 2012-02-10 2016-12-13 Asm Technology Singapore Pte Ltd Handling system for testing electronic components
JP5858837B2 (ja) * 2012-03-23 2016-02-10 株式会社ディスコ 吸引保持手段の被加工物離脱方法
JP5975703B2 (ja) * 2012-04-09 2016-08-23 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
TWI548027B (zh) 2016-09-01
CN105304542B (zh) 2017-10-13
KR20160009490A (ko) 2016-01-26
TW201608666A (zh) 2016-03-01
JP2016021541A (ja) 2016-02-04
KR101741319B1 (ko) 2017-05-29
CN105304542A (zh) 2016-02-03

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