JP6331551B2 - Memsデバイス - Google Patents
Memsデバイス Download PDFInfo
- Publication number
- JP6331551B2 JP6331551B2 JP2014061566A JP2014061566A JP6331551B2 JP 6331551 B2 JP6331551 B2 JP 6331551B2 JP 2014061566 A JP2014061566 A JP 2014061566A JP 2014061566 A JP2014061566 A JP 2014061566A JP 6331551 B2 JP6331551 B2 JP 6331551B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- lid
- insulating film
- receiving
- mems device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 65
- 238000007789 sealing Methods 0.000 claims description 56
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 25
- 229920005591 polysilicon Polymers 0.000 claims description 25
- 239000012535 impurity Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 52
- 239000004065 semiconductor Substances 0.000 description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 28
- 239000003566 sealing material Substances 0.000 description 25
- 229910052581 Si3N4 Inorganic materials 0.000 description 20
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 20
- 238000004544 sputter deposition Methods 0.000 description 17
- 229910004298 SiO 2 Inorganic materials 0.000 description 14
- 235000012239 silicon dioxide Nutrition 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 5
- 230000005669 field effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- MXSJNBRAMXILSE-UHFFFAOYSA-N [Si].[P].[B] Chemical compound [Si].[P].[B] MXSJNBRAMXILSE-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0136—Growing or depositing of a covering layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0145—Hermetically sealing an opening in the lid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
Description
本発明の各実施形態に係るMEMSデバイスは、レゾネーター、センサー、アクチュエーター等の機能素子、及び/又は、電子回路を1つの基板に集積化したデバイスである。
図1は、本発明の第1の実施形態に係るMEMSデバイスのトレンチ内の構造を示す平面図である。図1は、キャビティーが蓋部で覆われる前のトレンチ内の構造を示している。また、図2は、図1のA−A'線におけるMEMSデバイスの主要部を示す断面図である。図1及び図2に示すように、このMEMSデバイスにおいては、主面(図中上面)の第1の領域(図中右側)にトレンチ10aが形成されると共に、主面の第2の領域(図中左側)に半導体回路素子の不純物拡散領域が形成された半導体基板10が用いられる。
図4及び図5は、本発明の第1の実施形態に係るMEMSデバイスの製造工程における断面図である。まず、図4(a)に示すように、例えば、シリコン単結晶等で構成された半導体基板10の主面の一部に、フォトリソグラフィー法によってレジスト11を設けてドライエッチングを行うことにより、半導体基板10の主面の第1の領域に深いトレンチ(ディープトレンチ)10aが形成される。その後、レジスト11が除去される。
図6は、本発明の第2の実施形態に係るMEMSデバイスのトレンチ内の構造を示す平面図である。図6は、キャビティーが蓋部で覆われる前のトレンチ内の構造を示している。また、図7は、図6のB−B'線におけるMEMSデバイスの主要部を示す断面図である。第2の実施形態においては、導電性の受け部43が、機能素子に電気的に接続されて外部接続電極を構成している。その他の点に関しては、第2の実施形態は、第1の実施形態と同様である。
Claims (6)
- 基板と、
前記基板の表面に直接又は絶縁膜を介して設けられた機能素子と、
前記基板又は前記絶縁膜の表面に設けられ、前記機能素子の周囲にキャビティーを形成する構造体と、
前記基板又は前記絶縁膜の表面に対向する面における所定の位置に開口が形成され、前記機能素子との間に間隙を伴って前記キャビティーの一部を覆う第1の蓋部と、
前記基板又は前記絶縁膜の表面において複数の電極又は配線の間に設けられ、前記第1の蓋部の開口に間隙を介して対向する受け面を有する受け部と、
前記第1の蓋部の開口を封止する導電性の封止部を含む第2の蓋部と、
を備えるMEMSデバイス。 - 前記受け部は導電性を有し、前記機能素子に電気的に接続され、
前記第2の蓋部は前記受け部の受け面に延在する導電性の封止部を含む、請求項1記載のMEMSデバイス。 - 前記受け部の受け面が、平面視で前記第1の蓋部の開口及び該開口の周囲の領域と重なる、請求項1又は2記載のMEMSデバイス。
- 前記封止部が、前記受け部の受け面に延在する、請求項1記載のMEMSデバイス。
- 前記受け部の受け面の面積が、前記第1の蓋部の開口の面積よりも小さい、請求項1記載のMEMSデバイス。
- 前記受け部が、不純物がドープされたポリシリコンで形成されている、請求項1〜5のいずれか1項記載のMEMSデバイス。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014061566A JP6331551B2 (ja) | 2014-03-25 | 2014-03-25 | Memsデバイス |
US14/643,268 US9434605B2 (en) | 2014-03-25 | 2015-03-10 | MEMS device |
CN201510132149.XA CN104944357A (zh) | 2014-03-25 | 2015-03-24 | 微机电系统装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014061566A JP6331551B2 (ja) | 2014-03-25 | 2014-03-25 | Memsデバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015182187A JP2015182187A (ja) | 2015-10-22 |
JP6331551B2 true JP6331551B2 (ja) | 2018-05-30 |
Family
ID=54159505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014061566A Expired - Fee Related JP6331551B2 (ja) | 2014-03-25 | 2014-03-25 | Memsデバイス |
Country Status (3)
Country | Link |
---|---|
US (1) | US9434605B2 (ja) |
JP (1) | JP6331551B2 (ja) |
CN (1) | CN104944357A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10407194B2 (en) * | 2016-06-21 | 2019-09-10 | United States Of America As Represented By The Secretary Of The Navy | Low temperature self-sealing vacuum packaging |
KR102257735B1 (ko) * | 2020-08-31 | 2021-05-28 | 주식회사 제이피드림 | 미세전자기계시스템 패키징 방법 및 이를 이용한 패키지 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5610431A (en) * | 1995-05-12 | 1997-03-11 | The Charles Stark Draper Laboratory, Inc. | Covers for micromechanical sensors and other semiconductor devices |
US6660564B2 (en) * | 2002-01-25 | 2003-12-09 | Sony Corporation | Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby |
US20050095835A1 (en) * | 2003-09-26 | 2005-05-05 | Tessera, Inc. | Structure and method of making capped chips having vertical interconnects |
JP2005260398A (ja) * | 2004-03-10 | 2005-09-22 | Sony Corp | 半導体装置および半導体装置の製造方法 |
US7204737B2 (en) * | 2004-09-23 | 2007-04-17 | Temic Automotive Of North America, Inc. | Hermetically sealed microdevice with getter shield |
US7098065B2 (en) * | 2004-09-28 | 2006-08-29 | Stmicroelectronics, Inc. | Integrated lid formed on MEMS device |
US7615406B2 (en) * | 2005-01-28 | 2009-11-10 | Panasonic Corporation | Electronic device package manufacturing method and electronic device package |
KR100620810B1 (ko) * | 2005-03-07 | 2006-09-07 | 삼성전자주식회사 | Mems 소자 패키지 및 그 제조방법 |
US20080002460A1 (en) * | 2006-03-01 | 2008-01-03 | Tessera, Inc. | Structure and method of making lidded chips |
DE102006040115A1 (de) * | 2006-08-26 | 2008-03-20 | X-Fab Semiconductor Foundries Ag | Verfahren und Anordnung zur hermetisch dichten vertikalen elektrischen Durchkontaktierung von Deckscheiben der Mikrosystemtechnik |
JP2008188711A (ja) * | 2007-02-05 | 2008-08-21 | Oki Electric Ind Co Ltd | 半導体装置製造方法 |
JP4386086B2 (ja) | 2007-03-15 | 2009-12-16 | セイコーエプソン株式会社 | 電子装置及びその製造方法 |
US7994594B2 (en) | 2007-03-15 | 2011-08-09 | Seiko Epson Corporation | Electronic device, resonator, oscillator and method for manufacturing electronic device |
US20100075481A1 (en) * | 2008-07-08 | 2010-03-25 | Xiao (Charles) Yang | Method and structure of monolithically integrated ic-mems oscillator using ic foundry-compatible processes |
JP5121765B2 (ja) | 2009-03-25 | 2013-01-16 | 株式会社東芝 | Memsデバイスおよびその製造方法 |
JP5568786B2 (ja) * | 2009-12-24 | 2014-08-13 | 新光電気工業株式会社 | 半導体パッケージの製造方法及び半導体パッケージ |
US20120161255A1 (en) * | 2010-12-28 | 2012-06-28 | International Business Machines Corporation | Sealed mems cavity and method of forming same |
JP2013232626A (ja) * | 2012-04-04 | 2013-11-14 | Seiko Epson Corp | 電子デバイス及びその製造方法、電子機器、並びに移動体 |
ITTO20130967A1 (it) * | 2013-11-28 | 2015-05-29 | Stmicroelectronics Malta Ltd | Metodo di impilamento di una pluralita' di piastrine per formare un dispositivo a semiconduttore impilato, e dispositivo a semiconduttore impilato |
-
2014
- 2014-03-25 JP JP2014061566A patent/JP6331551B2/ja not_active Expired - Fee Related
-
2015
- 2015-03-10 US US14/643,268 patent/US9434605B2/en active Active
- 2015-03-24 CN CN201510132149.XA patent/CN104944357A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US9434605B2 (en) | 2016-09-06 |
US20150274508A1 (en) | 2015-10-01 |
JP2015182187A (ja) | 2015-10-22 |
CN104944357A (zh) | 2015-09-30 |
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