JP6327679B2 - アルカリ土類金属を含むアリール基含有シロキサン組成物 - Google Patents

アルカリ土類金属を含むアリール基含有シロキサン組成物 Download PDF

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Publication number
JP6327679B2
JP6327679B2 JP2016500589A JP2016500589A JP6327679B2 JP 6327679 B2 JP6327679 B2 JP 6327679B2 JP 2016500589 A JP2016500589 A JP 2016500589A JP 2016500589 A JP2016500589 A JP 2016500589A JP 6327679 B2 JP6327679 B2 JP 6327679B2
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Japan
Prior art keywords
alkaline earth
earth metal
aryl group
composition
silicon
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JP2016500589A
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English (en)
Japanese (ja)
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JP2016516111A5 (enExample
JP2016516111A (ja
Inventor
シュミット ランドール
シュミット ランドール
香須美 竹内
香須美 竹内
シュイ シュヨンチーン
シュイ シュヨンチーン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Dow Silicones Corp
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Publication of JP2016516111A publication Critical patent/JP2016516111A/ja
Publication of JP2016516111A5 publication Critical patent/JP2016516111A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Led Device Packages (AREA)
JP2016500589A 2013-03-15 2014-03-04 アルカリ土類金属を含むアリール基含有シロキサン組成物 Active JP6327679B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361789881P 2013-03-15 2013-03-15
US61/789,881 2013-03-15
PCT/US2014/020216 WO2014149670A2 (en) 2013-03-15 2014-03-04 Aryl group-containing siloxane compositions including alkaline earth metal

Publications (3)

Publication Number Publication Date
JP2016516111A JP2016516111A (ja) 2016-06-02
JP2016516111A5 JP2016516111A5 (enExample) 2017-04-06
JP6327679B2 true JP6327679B2 (ja) 2018-05-23

Family

ID=50628887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016500589A Active JP6327679B2 (ja) 2013-03-15 2014-03-04 アルカリ土類金属を含むアリール基含有シロキサン組成物

Country Status (7)

Country Link
US (1) US9550866B2 (enExample)
EP (1) EP2970666B1 (enExample)
JP (1) JP6327679B2 (enExample)
KR (1) KR102174540B1 (enExample)
CN (1) CN105051113B (enExample)
TW (1) TWI648349B (enExample)
WO (1) WO2014149670A2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7509752B2 (ja) 2018-09-19 2024-07-02 ダウ シリコーンズ コーポレーション アリール官能化ポリシロキサンにおけるアリール切断阻害

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3267031A (en) 1963-12-17 1966-08-16 Socony Mobil Oil Co Inc Stabilized silicone fluids
JPH06100672B2 (ja) * 1986-09-30 1994-12-12 東芝シリコ−ン株式会社 中性子遮蔽材
GB8902935D0 (en) 1989-02-09 1989-03-30 Dow Corning Process for producing organosilicon products
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
US20090286935A1 (en) * 2004-06-30 2009-11-19 Lauren Tonge Fluorocarbon elastomer silicone vulcanizates
US20060134440A1 (en) * 2004-10-27 2006-06-22 Crivello James V Silicone encapsulants for light emitting diodes
JP5357020B2 (ja) * 2006-06-26 2013-12-04 ダウ・コーニング・コーポレイション シリコーンゴムエラストマーの製造
US20090088547A1 (en) * 2006-10-17 2009-04-02 Rpo Pty Limited Process for producing polysiloxanes and use of the same
KR100980270B1 (ko) 2008-07-31 2010-09-07 한국과학기술원 Ｌｅｄ 봉지용 실록산 수지
GB0823431D0 (en) * 2008-12-23 2009-01-28 Dow Corning Elastomer composition
KR101259887B1 (ko) * 2009-08-04 2013-05-02 한국과학기술원 광학용 투명 실록산 수지 조성물
CN101775217B (zh) * 2009-12-30 2011-07-13 苏州天山新材料技术有限公司 室温硫化有机聚硅氧烷组合物和制备方法
KR101853598B1 (ko) * 2010-03-23 2018-04-30 가부시키가이샤 아사히 러버 실리콘 수지제 반사 기재, 그 제조 방법, 및 그 반사 기재에 이용하는 원재료 조성물
CN102234426B (zh) * 2010-05-05 2013-10-30 南亚塑胶工业股份有限公司 用于光学镜片与光学封装的树脂组合物
JP5500037B2 (ja) * 2010-10-12 2014-05-21 信越化学工業株式会社 難燃性オルガノポリシロキサン組成物
JP5661429B2 (ja) * 2010-11-01 2015-01-28 株式会社ダイセル 液状付加硬化性メタロシロキサン
US20140008697A1 (en) * 2010-12-08 2014-01-09 Brian R. Harkness Siloxane Compositions Including Titanium Dioxide Nanoparticles Suitable For Forming Encapsulants
JP2012122002A (ja) * 2010-12-09 2012-06-28 Daicel Corp 付加硬化性メタロシロキサン化合物
US9598575B2 (en) 2011-01-26 2017-03-21 Dow Corning Corporation High temperature stable thermally conductive materials
CN103131189B (zh) * 2013-01-05 2014-11-05 中科院广州化学有限公司 Led封装用无机/有机杂化纳米复合材料及其制备方法

Also Published As

Publication number Publication date
KR102174540B1 (ko) 2020-11-05
TWI648349B (zh) 2019-01-21
CN105051113B (zh) 2018-08-10
TW201443158A (zh) 2014-11-16
CN105051113A (zh) 2015-11-11
JP2016516111A (ja) 2016-06-02
EP2970666A2 (en) 2016-01-20
EP2970666B1 (en) 2016-10-19
WO2014149670A2 (en) 2014-09-25
KR20150132351A (ko) 2015-11-25
WO2014149670A3 (en) 2014-11-13
US20160027974A1 (en) 2016-01-28
US9550866B2 (en) 2017-01-24

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