CN105051113B - 包含碱土金属的含有芳基基团的硅氧烷组合物 - Google Patents

包含碱土金属的含有芳基基团的硅氧烷组合物 Download PDF

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Publication number
CN105051113B
CN105051113B CN201480015807.0A CN201480015807A CN105051113B CN 105051113 B CN105051113 B CN 105051113B CN 201480015807 A CN201480015807 A CN 201480015807A CN 105051113 B CN105051113 B CN 105051113B
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aryl group
siloxane composition
group
barium
silicon
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Chinese (zh)
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CN105051113A (zh
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R·施密特
竹内香须美
徐胜清
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Dow Silicones Corp
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Dow Silicones Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
CN201480015807.0A 2013-03-15 2014-03-04 包含碱土金属的含有芳基基团的硅氧烷组合物 Active CN105051113B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361789881P 2013-03-15 2013-03-15
US61/789,881 2013-03-15
PCT/US2014/020216 WO2014149670A2 (en) 2013-03-15 2014-03-04 Aryl group-containing siloxane compositions including alkaline earth metal

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CN105051113A CN105051113A (zh) 2015-11-11
CN105051113B true CN105051113B (zh) 2018-08-10

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Country Status (7)

Country Link
US (1) US9550866B2 (enExample)
EP (1) EP2970666B1 (enExample)
JP (1) JP6327679B2 (enExample)
KR (1) KR102174540B1 (enExample)
CN (1) CN105051113B (enExample)
TW (1) TWI648349B (enExample)
WO (1) WO2014149670A2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3853299B1 (en) 2018-09-19 2025-08-20 Dow Silicones Corporation Aryl scission inhibition in aryl-functionalized polysiloxane

Citations (5)

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CN1772794A (zh) * 2004-10-27 2006-05-17 伦斯勒工业学院 用于发光二极管的硅氧烷密封剂
CN101479342A (zh) * 2006-06-26 2009-07-08 陶氏康宁公司 硅橡胶弹性体的制备
CN101775217A (zh) * 2009-12-30 2010-07-14 苏州天山新材料技术有限公司 室温硫化有机聚硅氧烷组合物和制备方法
CN102234426A (zh) * 2010-05-05 2011-11-09 南亚塑胶工业股份有限公司 用于光学镜片与光学封装的树脂组合物
CN102893417A (zh) * 2010-03-23 2013-01-23 株式会社朝日橡胶 有机硅树脂制反射基材及其制造方法、以及用于该反射基材的原材料组合物

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GB8902935D0 (en) 1989-02-09 1989-03-30 Dow Corning Process for producing organosilicon products
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
US20090286935A1 (en) * 2004-06-30 2009-11-19 Lauren Tonge Fluorocarbon elastomer silicone vulcanizates
US20090088547A1 (en) * 2006-10-17 2009-04-02 Rpo Pty Limited Process for producing polysiloxanes and use of the same
KR100980270B1 (ko) 2008-07-31 2010-09-07 한국과학기술원 Ｌｅｄ 봉지용 실록산 수지
GB0823431D0 (en) * 2008-12-23 2009-01-28 Dow Corning Elastomer composition
KR101259887B1 (ko) * 2009-08-04 2013-05-02 한국과학기술원 광학용 투명 실록산 수지 조성물
JP5500037B2 (ja) * 2010-10-12 2014-05-21 信越化学工業株式会社 難燃性オルガノポリシロキサン組成物
JP5661429B2 (ja) * 2010-11-01 2015-01-28 株式会社ダイセル 液状付加硬化性メタロシロキサン
WO2012078617A1 (en) * 2010-12-08 2012-06-14 Dow Corning Corporation Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants
JP2012122002A (ja) * 2010-12-09 2012-06-28 Daicel Corp 付加硬化性メタロシロキサン化合物
JP6048416B2 (ja) 2011-01-26 2016-12-21 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 高温安定熱伝導性材料
CN103131189B (zh) * 2013-01-05 2014-11-05 中科院广州化学有限公司 Led封装用无机/有机杂化纳米复合材料及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1772794A (zh) * 2004-10-27 2006-05-17 伦斯勒工业学院 用于发光二极管的硅氧烷密封剂
CN101479342A (zh) * 2006-06-26 2009-07-08 陶氏康宁公司 硅橡胶弹性体的制备
CN101775217A (zh) * 2009-12-30 2010-07-14 苏州天山新材料技术有限公司 室温硫化有机聚硅氧烷组合物和制备方法
CN102893417A (zh) * 2010-03-23 2013-01-23 株式会社朝日橡胶 有机硅树脂制反射基材及其制造方法、以及用于该反射基材的原材料组合物
CN102234426A (zh) * 2010-05-05 2011-11-09 南亚塑胶工业股份有限公司 用于光学镜片与光学封装的树脂组合物

Also Published As

Publication number Publication date
CN105051113A (zh) 2015-11-11
TWI648349B (zh) 2019-01-21
US9550866B2 (en) 2017-01-24
JP2016516111A (ja) 2016-06-02
EP2970666A2 (en) 2016-01-20
WO2014149670A2 (en) 2014-09-25
US20160027974A1 (en) 2016-01-28
EP2970666B1 (en) 2016-10-19
JP6327679B2 (ja) 2018-05-23
KR20150132351A (ko) 2015-11-25
TW201443158A (zh) 2014-11-16
WO2014149670A3 (en) 2014-11-13
KR102174540B1 (ko) 2020-11-05

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