KR102174540B1 - 알칼리 토금속을 포함하는 아릴 기-함유 실록산 조성물 - Google Patents

알칼리 토금속을 포함하는 아릴 기-함유 실록산 조성물 Download PDF

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KR102174540B1
KR102174540B1 KR1020157028969A KR20157028969A KR102174540B1 KR 102174540 B1 KR102174540 B1 KR 102174540B1 KR 1020157028969 A KR1020157028969 A KR 1020157028969A KR 20157028969 A KR20157028969 A KR 20157028969A KR 102174540 B1 KR102174540 B1 KR 102174540B1
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alkaline earth
earth metal
component
composition
aryl group
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KR20150132351A (ko
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랜달 슈미트
가스미 다케우치
성칭 쉬
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다우 실리콘즈 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Led Device Packages (AREA)
KR1020157028969A 2013-03-15 2014-03-04 알칼리 토금속을 포함하는 아릴 기-함유 실록산 조성물 Active KR102174540B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361789881P 2013-03-15 2013-03-15
US61/789,881 2013-03-15
PCT/US2014/020216 WO2014149670A2 (en) 2013-03-15 2014-03-04 Aryl group-containing siloxane compositions including alkaline earth metal

Publications (2)

Publication Number Publication Date
KR20150132351A KR20150132351A (ko) 2015-11-25
KR102174540B1 true KR102174540B1 (ko) 2020-11-05

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KR1020157028969A Active KR102174540B1 (ko) 2013-03-15 2014-03-04 알칼리 토금속을 포함하는 아릴 기-함유 실록산 조성물

Country Status (7)

Country Link
US (1) US9550866B2 (enExample)
EP (1) EP2970666B1 (enExample)
JP (1) JP6327679B2 (enExample)
KR (1) KR102174540B1 (enExample)
CN (1) CN105051113B (enExample)
TW (1) TWI648349B (enExample)
WO (1) WO2014149670A2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3853299B1 (en) 2018-09-19 2025-08-20 Dow Silicones Corporation Aryl scission inhibition in aryl-functionalized polysiloxane

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012078617A1 (en) * 2010-12-08 2012-06-14 Dow Corning Corporation Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants

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US3267031A (en) 1963-12-17 1966-08-16 Socony Mobil Oil Co Inc Stabilized silicone fluids
JPH06100672B2 (ja) * 1986-09-30 1994-12-12 東芝シリコ−ン株式会社 中性子遮蔽材
GB8902935D0 (en) 1989-02-09 1989-03-30 Dow Corning Process for producing organosilicon products
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
US20090286935A1 (en) * 2004-06-30 2009-11-19 Lauren Tonge Fluorocarbon elastomer silicone vulcanizates
US20060134440A1 (en) * 2004-10-27 2006-06-22 Crivello James V Silicone encapsulants for light emitting diodes
WO2008002532A1 (en) * 2006-06-26 2008-01-03 Dow Corning Corporation Preparation of silicone rubber elastomers
US20090088547A1 (en) * 2006-10-17 2009-04-02 Rpo Pty Limited Process for producing polysiloxanes and use of the same
KR100980270B1 (ko) 2008-07-31 2010-09-07 한국과학기술원 Ｌｅｄ 봉지용 실록산 수지
GB0823431D0 (en) * 2008-12-23 2009-01-28 Dow Corning Elastomer composition
KR101259887B1 (ko) * 2009-08-04 2013-05-02 한국과학기술원 광학용 투명 실록산 수지 조성물
CN101775217B (zh) * 2009-12-30 2011-07-13 苏州天山新材料技术有限公司 室温硫化有机聚硅氧烷组合物和制备方法
WO2011118109A1 (ja) * 2010-03-23 2011-09-29 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物
CN102234426B (zh) * 2010-05-05 2013-10-30 南亚塑胶工业股份有限公司 用于光学镜片与光学封装的树脂组合物
JP5500037B2 (ja) * 2010-10-12 2014-05-21 信越化学工業株式会社 難燃性オルガノポリシロキサン組成物
JP5661429B2 (ja) * 2010-11-01 2015-01-28 株式会社ダイセル 液状付加硬化性メタロシロキサン
JP2012122002A (ja) * 2010-12-09 2012-06-28 Daicel Corp 付加硬化性メタロシロキサン化合物
WO2012102852A1 (en) 2011-01-26 2012-08-02 Dow Corning Corporation High temperature stable thermally conductive materials
CN103131189B (zh) * 2013-01-05 2014-11-05 中科院广州化学有限公司 Led封装用无机/有机杂化纳米复合材料及其制备方法

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Publication number Priority date Publication date Assignee Title
WO2012078617A1 (en) * 2010-12-08 2012-06-14 Dow Corning Corporation Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants

Also Published As

Publication number Publication date
US9550866B2 (en) 2017-01-24
KR20150132351A (ko) 2015-11-25
CN105051113B (zh) 2018-08-10
WO2014149670A3 (en) 2014-11-13
EP2970666B1 (en) 2016-10-19
EP2970666A2 (en) 2016-01-20
WO2014149670A2 (en) 2014-09-25
US20160027974A1 (en) 2016-01-28
TW201443158A (zh) 2014-11-16
JP6327679B2 (ja) 2018-05-23
CN105051113A (zh) 2015-11-11
JP2016516111A (ja) 2016-06-02
TWI648349B (zh) 2019-01-21

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