JP6317028B2 - 高効率熱経路を有する積層半導体ダイアセンブリの製造方法 - Google Patents
高効率熱経路を有する積層半導体ダイアセンブリの製造方法 Download PDFInfo
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- JP6317028B2 JP6317028B2 JP2017501355A JP2017501355A JP6317028B2 JP 6317028 B2 JP6317028 B2 JP 6317028B2 JP 2017501355 A JP2017501355 A JP 2017501355A JP 2017501355 A JP2017501355 A JP 2017501355A JP 6317028 B2 JP6317028 B2 JP 6317028B2
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Description
Claims (4)
- 第一のダイと積層されて配置された複数の第二のダイとを有する半導体ダイアセンブリをパッケージするための方法であって、前記第一のダイは前記第二のダイの積層から側方向に外側に延びる周辺領域を有し、前記方法は、
前記第一のダイの前記周辺領域に、熱伝達構造の少なくとも一部を配置することであって、前記熱伝達構造は、熱伝導材料を含む、ことと、
前記第一のダイの前記周辺領域に前記熱伝達構造を配置した後、前記第二のダイ同士の間にアンダーフィル材料を流すことであって、前記アンダーフィル材料は、前記第二のダイの積層から側方向に延びるフィレットを有し、前記アンダーフィル材料の前記側方向の延伸は、前記熱伝達構造によって制限される、ことと、
を含み、
前記アンダーフィル材料を流した後、前記熱伝達構造と前記第二のダイの積層との間の空洞内に誘電液体を注入することをさらに含む、
方法。 - 前記空洞内で前記誘電液体を少なくとも部分的に硬化させることをさらに含む、
請求項1に記載の方法。 - 第一のダイと前記第一のダイの上に積層されて配置された複数の第二のダイとを有する半導体ダイアセンブリをパッケージするための方法であって、前記第一のダイは前記第二のダイの積層から側方向に外側に延びる周辺領域を有し、前記方法は、
前記第一のダイの前記周辺領域に熱伝達構造を結合することと、
前記第一のダイの前記周辺領域に、前記熱伝達構造を結合した後、前記第二のダイ同士の間にアンダーフィル材料を流すことであって、前記熱伝達構造は、前記アンダーフィル材料の側方向の流れを制限する、ことと、
を含み、
前記第一のダイの前記周辺領域に、前記熱伝達構造を結合することは、パッケージ支持基板に熱伝導性ケーシングを取り付けることをさらに含み、前記熱伝導性ケーシングは、前記第一のダイおよび前記第二のダイの積層が配置される空洞を有し、
前記方法は、前記アンダーフィル材料を流した後、前記熱伝導性ケーシングの前記空洞内に誘電液体を注入することをさらに含み、前記誘電液体は、熱伝導性を有する、
方法。 - 前記誘電液体を前記空洞内で硬化させることをさらに含む、
請求項3に記載の方法。
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US14/330,805 US9691746B2 (en) | 2014-07-14 | 2014-07-14 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths |
US14/330,805 | 2014-07-14 | ||
PCT/US2015/037621 WO2016010702A1 (en) | 2014-07-14 | 2015-06-25 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths |
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US (5) | US9691746B2 (ja) |
EP (1) | EP3170200B1 (ja) |
JP (1) | JP6317028B2 (ja) |
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US9691746B2 (en) | 2017-06-27 |
WO2016010702A1 (en) | 2016-01-21 |
KR20170029575A (ko) | 2017-03-15 |
KR101996153B1 (ko) | 2019-07-03 |
CN106537588A (zh) | 2017-03-22 |
US20230395463A1 (en) | 2023-12-07 |
US20220013434A1 (en) | 2022-01-13 |
US20160013173A1 (en) | 2016-01-14 |
EP3170200B1 (en) | 2020-01-15 |
EP3170200A4 (en) | 2018-01-24 |
TWI588915B (zh) | 2017-06-21 |
CN106537588B (zh) | 2019-10-11 |
JP2017520932A (ja) | 2017-07-27 |
TW201606886A (zh) | 2016-02-16 |
US20180308785A1 (en) | 2018-10-25 |
US11776877B2 (en) | 2023-10-03 |
US20170229439A1 (en) | 2017-08-10 |
US10163755B2 (en) | 2018-12-25 |
EP3170200A1 (en) | 2017-05-24 |
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