JP6313602B2 - エポキシ樹脂材料及び多層基板 - Google Patents

エポキシ樹脂材料及び多層基板 Download PDF

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JP6313602B2
JP6313602B2 JP2014011397A JP2014011397A JP6313602B2 JP 6313602 B2 JP6313602 B2 JP 6313602B2 JP 2014011397 A JP2014011397 A JP 2014011397A JP 2014011397 A JP2014011397 A JP 2014011397A JP 6313602 B2 JP6313602 B2 JP 6313602B2
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epoxy resin
epoxy
resin material
equivalent
active ester
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JP2014208764A (ja
JP2014208764A5 (enExample
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智輝 國川
智輝 國川
達史 林
達史 林
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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  • Compositions Of Macromolecular Compounds (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
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  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Power Engineering (AREA)
JP2014011397A 2013-03-22 2014-01-24 エポキシ樹脂材料及び多層基板 Active JP6313602B2 (ja)

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JP2014011397A JP6313602B2 (ja) 2013-03-22 2014-01-24 エポキシ樹脂材料及び多層基板

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JP2013060689 2013-03-22
JP2013060689 2013-03-22
JP2014011397A JP6313602B2 (ja) 2013-03-22 2014-01-24 エポキシ樹脂材料及び多層基板

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JP2018056069A Division JP2018115334A (ja) 2013-03-22 2018-03-23 エポキシ樹脂材料及び多層基板

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JP2014208764A JP2014208764A (ja) 2014-11-06
JP2014208764A5 JP2014208764A5 (enExample) 2017-01-26
JP6313602B2 true JP6313602B2 (ja) 2018-04-18

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JP2018056069A Pending JP2018115334A (ja) 2013-03-22 2018-03-23 エポキシ樹脂材料及び多層基板

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018115334A (ja) * 2013-03-22 2018-07-26 積水化学工業株式会社 エポキシ樹脂材料及び多層基板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6867131B2 (ja) * 2015-09-30 2021-04-28 積水化学工業株式会社 積層体及び積層体の製造方法
WO2018116967A1 (ja) * 2016-12-22 2018-06-28 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム、ボンディングシート、銅張積層板及び電磁波シールド材
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
US11891474B2 (en) 2018-12-04 2024-02-06 Taiyo Holdings Co., Ltd. Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic component
JP7254528B2 (ja) * 2019-01-15 2023-04-10 積水化学工業株式会社 樹脂材料及び多層プリント配線板
WO2020262654A1 (ja) * 2019-06-26 2020-12-30 昭和電工マテリアルズ株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554541B (zh) * 2011-05-10 2016-10-21 Ajinomoto Kk Resin composition
WO2012165012A1 (ja) * 2011-05-27 2012-12-06 味の素株式会社 樹脂組成物
TWI609917B (zh) * 2011-05-31 2018-01-01 Ajinomoto Co., Inc. 樹脂組成物
JP2013010899A (ja) * 2011-06-30 2013-01-17 Sekisui Chem Co Ltd 樹脂ワニス、ろ過処理樹脂ワニス及びその製造方法、積層フィルム並びに多層基板
JP6123177B2 (ja) * 2012-07-04 2017-05-10 味の素株式会社 樹脂組成物
JP6217895B2 (ja) * 2013-02-14 2017-10-25 味の素株式会社 硬化性樹脂組成物
JP6313602B2 (ja) * 2013-03-22 2018-04-18 積水化学工業株式会社 エポキシ樹脂材料及び多層基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018115334A (ja) * 2013-03-22 2018-07-26 積水化学工業株式会社 エポキシ樹脂材料及び多層基板

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JP2014208764A (ja) 2014-11-06
JP2018115334A (ja) 2018-07-26

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