JP2014208764A5 - - Google Patents
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- Publication number
- JP2014208764A5 JP2014208764A5 JP2014011397A JP2014011397A JP2014208764A5 JP 2014208764 A5 JP2014208764 A5 JP 2014208764A5 JP 2014011397 A JP2014011397 A JP 2014011397A JP 2014011397 A JP2014011397 A JP 2014011397A JP 2014208764 A5 JP2014208764 A5 JP 2014208764A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- epoxy resin
- equivalent
- resin material
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 56
- 229920000647 polyepoxide Polymers 0.000 claims description 56
- 239000004593 Epoxy Substances 0.000 claims description 28
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 9
- -1 ester compound Chemical class 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 125000004185 ester group Chemical group 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014011397A JP6313602B2 (ja) | 2013-03-22 | 2014-01-24 | エポキシ樹脂材料及び多層基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013060689 | 2013-03-22 | ||
| JP2013060689 | 2013-03-22 | ||
| JP2014011397A JP6313602B2 (ja) | 2013-03-22 | 2014-01-24 | エポキシ樹脂材料及び多層基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018056069A Division JP2018115334A (ja) | 2013-03-22 | 2018-03-23 | エポキシ樹脂材料及び多層基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014208764A JP2014208764A (ja) | 2014-11-06 |
| JP2014208764A5 true JP2014208764A5 (enExample) | 2017-01-26 |
| JP6313602B2 JP6313602B2 (ja) | 2018-04-18 |
Family
ID=51903195
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014011397A Active JP6313602B2 (ja) | 2013-03-22 | 2014-01-24 | エポキシ樹脂材料及び多層基板 |
| JP2018056069A Pending JP2018115334A (ja) | 2013-03-22 | 2018-03-23 | エポキシ樹脂材料及び多層基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018056069A Pending JP2018115334A (ja) | 2013-03-22 | 2018-03-23 | エポキシ樹脂材料及び多層基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP6313602B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6313602B2 (ja) * | 2013-03-22 | 2018-04-18 | 積水化学工業株式会社 | エポキシ樹脂材料及び多層基板 |
| JP6867131B2 (ja) * | 2015-09-30 | 2021-04-28 | 積水化学工業株式会社 | 積層体及び積層体の製造方法 |
| US11624009B2 (en) | 2016-12-22 | 2023-04-11 | Toagosei Co., Ltd. | Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition |
| JP7258453B2 (ja) * | 2017-03-31 | 2023-04-17 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
| CN113195584B (zh) * | 2018-12-04 | 2024-02-23 | 太阳控股株式会社 | 固化性树脂组合物、干膜、带树脂的铜箔、固化物和电子部件 |
| JP7254528B2 (ja) * | 2019-01-15 | 2023-04-10 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| WO2020262654A1 (ja) * | 2019-06-26 | 2020-12-30 | 昭和電工マテリアルズ株式会社 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI554541B (zh) * | 2011-05-10 | 2016-10-21 | Ajinomoto Kk | Resin composition |
| WO2012165012A1 (ja) * | 2011-05-27 | 2012-12-06 | 味の素株式会社 | 樹脂組成物 |
| TWI609917B (zh) * | 2011-05-31 | 2018-01-01 | Ajinomoto Co., Inc. | 樹脂組成物 |
| JP2013010899A (ja) * | 2011-06-30 | 2013-01-17 | Sekisui Chem Co Ltd | 樹脂ワニス、ろ過処理樹脂ワニス及びその製造方法、積層フィルム並びに多層基板 |
| JP6123177B2 (ja) * | 2012-07-04 | 2017-05-10 | 味の素株式会社 | 樹脂組成物 |
| JP6217895B2 (ja) * | 2013-02-14 | 2017-10-25 | 味の素株式会社 | 硬化性樹脂組成物 |
| JP6313602B2 (ja) * | 2013-03-22 | 2018-04-18 | 積水化学工業株式会社 | エポキシ樹脂材料及び多層基板 |
-
2014
- 2014-01-24 JP JP2014011397A patent/JP6313602B2/ja active Active
-
2018
- 2018-03-23 JP JP2018056069A patent/JP2018115334A/ja active Pending
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