JP6308967B2 - 熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体 - Google Patents
熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体 Download PDFInfo
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- JP6308967B2 JP6308967B2 JP2015065784A JP2015065784A JP6308967B2 JP 6308967 B2 JP6308967 B2 JP 6308967B2 JP 2015065784 A JP2015065784 A JP 2015065784A JP 2015065784 A JP2015065784 A JP 2015065784A JP 6308967 B2 JP6308967 B2 JP 6308967B2
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- 238000010438 heat treatment Methods 0.000 title claims description 69
- 230000005856 abnormality Effects 0.000 title claims description 29
- 238000001514 detection method Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 14
- 235000012431 wafers Nutrition 0.000 description 167
- 238000012545 processing Methods 0.000 description 49
- 238000012546 transfer Methods 0.000 description 38
- 238000001816 cooling Methods 0.000 description 28
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 238000011161 development Methods 0.000 description 8
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- 230000002159 abnormal effect Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Application Number | Priority Date | Filing Date | Title |
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JP2015065784A JP6308967B2 (ja) | 2015-03-27 | 2015-03-27 | 熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体 |
TW105108665A TWI643246B (zh) | 2015-03-27 | 2016-03-21 | Heat treatment device, abnormality detection method in heat treatment, and readable computer memory medium |
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JP2015065784A JP6308967B2 (ja) | 2015-03-27 | 2015-03-27 | 熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体 |
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JP2016186962A JP2016186962A (ja) | 2016-10-27 |
JP6308967B2 true JP6308967B2 (ja) | 2018-04-11 |
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Country Status (2)
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JP (1) | JP6308967B2 (zh) |
TW (1) | TWI643246B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6809663B2 (ja) * | 2017-01-20 | 2021-01-06 | 曙ブレーキ工業株式会社 | 摩擦材の加熱装置および加熱方法 |
TWI623754B (zh) * | 2017-01-26 | 2018-05-11 | Electronic component testing device and test classification device thereof | |
JP7003759B2 (ja) * | 2017-06-28 | 2022-01-21 | 東京エレクトロン株式会社 | 熱処理装置、熱処理装置の管理方法及び記憶媒体 |
KR102222455B1 (ko) | 2018-01-15 | 2021-03-04 | 세메스 주식회사 | 기판 처리 장치 |
KR102233467B1 (ko) * | 2018-09-12 | 2021-03-31 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
KR20200122691A (ko) * | 2019-04-18 | 2020-10-28 | 세메스 주식회사 | 기판 지지 장치 및 이를 가지는 기판 처리 장치 및 방법 |
CN112063979B (zh) * | 2019-06-11 | 2023-12-22 | 北京北方华创微电子装备有限公司 | 半导体加工装置及相关磁控溅射装置 |
CN111863670A (zh) * | 2020-07-31 | 2020-10-30 | 芯米(厦门)半导体设备有限公司 | 一种晶圆热盘结构 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2845525B2 (ja) * | 1989-11-28 | 1999-01-13 | 九州日本電気株式会社 | スピンコータ |
JP3366753B2 (ja) * | 1994-11-25 | 2003-01-14 | 富士通株式会社 | 基板加熱装置 |
JP3577436B2 (ja) * | 1999-02-16 | 2004-10-13 | 東京エレクトロン株式会社 | 処理装置、処理システム、判別方法及び検出方法 |
JP3581303B2 (ja) * | 2000-07-31 | 2004-10-27 | 東京エレクトロン株式会社 | 判別方法及び処理装置 |
JP3955606B2 (ja) * | 2004-05-26 | 2007-08-08 | 松下電器産業株式会社 | 温度異常の検知方法及び半導体製造装置 |
JP5027573B2 (ja) * | 2006-07-06 | 2012-09-19 | 株式会社小松製作所 | 温度センサおよび温調装置 |
JP2008311475A (ja) * | 2007-06-15 | 2008-12-25 | Canon Inc | 処理装置 |
JP2009123816A (ja) * | 2007-11-13 | 2009-06-04 | Sokudo:Kk | 熱処理装置および熱処理方法 |
KR101182502B1 (ko) * | 2008-09-30 | 2012-09-12 | 도쿄엘렉트론가부시키가이샤 | 기판의 이상 배치 상태의 검지 방법, 기판 처리 방법, 컴퓨터 판독 가능한 기억 매체 및 기판 처리 장치 |
JP2010087343A (ja) * | 2008-10-01 | 2010-04-15 | Toray Eng Co Ltd | 基板処理装置及び基板載置方法 |
TW201142979A (en) * | 2010-05-18 | 2011-12-01 | Inotera Memories Inc | Wafer processing device and coating device |
JP2011249657A (ja) * | 2010-05-28 | 2011-12-08 | Hitachi High-Technologies Corp | 試料吸着保持装置および試料吸着判定方法 |
JP5542743B2 (ja) * | 2010-10-07 | 2014-07-09 | 東京エレクトロン株式会社 | 熱処理装置および熱処理方法 |
JP5299442B2 (ja) * | 2011-01-18 | 2013-09-25 | 東京エレクトロン株式会社 | 基板加熱装置、基板加熱方法及び記憶媒体 |
KR101389004B1 (ko) * | 2013-03-19 | 2014-04-24 | 에이피시스템 주식회사 | 온도 검출 장치 및 온도 검출 방법 및 기판 처리 장치 |
-
2015
- 2015-03-27 JP JP2015065784A patent/JP6308967B2/ja active Active
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2016
- 2016-03-21 TW TW105108665A patent/TWI643246B/zh active
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TWI643246B (zh) | 2018-12-01 |
TW201703114A (zh) | 2017-01-16 |
JP2016186962A (ja) | 2016-10-27 |
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