JP6298174B2 - 回路基板およびこれを備える電子装置 - Google Patents
回路基板およびこれを備える電子装置 Download PDFInfo
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- JP6298174B2 JP6298174B2 JP2016556632A JP2016556632A JP6298174B2 JP 6298174 B2 JP6298174 B2 JP 6298174B2 JP 2016556632 A JP2016556632 A JP 2016556632A JP 2016556632 A JP2016556632 A JP 2016556632A JP 6298174 B2 JP6298174 B2 JP 6298174B2
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K3/46—Manufacturing multilayer circuits
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
また、本発明の回路基板は、一方主面から他方主面を貫く貫通孔を備えるセラミックスまたはサファイヤからなる基体と、主成分が銀からなり、前記基体における前記貫通孔内に位置する貫通導体と、前記基体の両主面および前記貫通導体上に位置する金属配線層とを備える回路基板であって、前記貫通導体と前記金属配線層との間に、Sn、CuおよびNiより選ばれる少なくとも一種を含む化合物が存在する領域を有し、前記化合物における平均結晶粒径が10μm以上30μm以下であることを特徴とする。
2 :貫通導体
3 :金属配線層
6 :領域
10:回路基板
11:電子部品
12:ボンディングワイヤ
20:電子装置
Claims (6)
- 一方主面から他方主面を貫く貫通孔を備えるセラミックスまたはサファイヤからなる基体と、
主成分が銀からなり、前記基体における前記貫通孔内に位置する貫通導体と、
前記基体の両主面および前記貫通導体上に位置する金属配線層とを備える回路基板であって、
前記貫通導体と前記金属配線層との間に、Sn、CuおよびNiより選ばれる少なくとも一種を含む化合物が存在する領域を有し、該領域が、前記基体の主面よりも前記金属配線層側に位置していることを特徴とする回路基板。 - 一方主面から他方主面を貫く貫通孔を備えるセラミックスまたはサファイヤからなる基体と、
主成分が銀からなり、前記基体における前記貫通孔内に位置する貫通導体と、
前記基体の両主面および前記貫通導体上に位置する金属配線層とを備える回路基板であって、
前記貫通導体と前記金属配線層との間に、Sn、CuおよびNiより選ばれる少なくとも一種を含む化合物が存在する領域を有し、前記化合物における平均結晶粒径が10μm以上30μm以下であることを特徴とする回路基板。 - 前記基体がセラミックスであり、前記金属配線層の主成分がAgからなることを特徴とする請求項1または請求項2に記載の回路基板。
- 前記領域が、前記基体の主面よりも前記金属配線層側に位置していることを特徴とする請求項2または請求項3に記載の回路基板。
- 前記金属配線層上にAuからなる表層が位置していることを特徴とする請求項1乃至請求項4のいずれかに記載の回路基板。
- 請求項1乃至請求項5のいずれかに記載の回路基板における金属配線層上に電子部品を備えることを特徴とする電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014220400 | 2014-10-29 | ||
JP2014220400 | 2014-10-29 | ||
PCT/JP2015/080585 WO2016068248A1 (ja) | 2014-10-29 | 2015-10-29 | 回路基板およびこれを備える電子装置 |
Publications (2)
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JPWO2016068248A1 JPWO2016068248A1 (ja) | 2017-08-03 |
JP6298174B2 true JP6298174B2 (ja) | 2018-03-20 |
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JP2016556632A Active JP6298174B2 (ja) | 2014-10-29 | 2015-10-29 | 回路基板およびこれを備える電子装置 |
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Country | Link |
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US (1) | US10147662B2 (ja) |
EP (1) | EP3200224B1 (ja) |
JP (1) | JP6298174B2 (ja) |
CN (1) | CN107112291B (ja) |
WO (1) | WO2016068248A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113646883A (zh) * | 2019-03-29 | 2021-11-12 | 京瓷株式会社 | 布线基板、电子装置用封装件以及电子装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62265796A (ja) * | 1986-05-14 | 1987-11-18 | 株式会社住友金属セラミックス | セラミツク多層配線基板およびその製造法 |
JP3237258B2 (ja) * | 1993-01-22 | 2001-12-10 | 株式会社デンソー | セラミック多層配線基板 |
JPH08125341A (ja) * | 1994-10-25 | 1996-05-17 | Hitachi Ltd | 電子回路装置 |
JP4122612B2 (ja) * | 1999-01-06 | 2008-07-23 | 株式会社村田製作所 | 低温焼成セラミック回路基板 |
JP2001274548A (ja) * | 2000-03-27 | 2001-10-05 | Kyocera Corp | セラミック配線基板の製造方法 |
JP4158159B2 (ja) | 2004-12-06 | 2008-10-01 | 日立金属株式会社 | 貫通電極付基板およびその製造方法 |
JP2007258436A (ja) * | 2006-03-23 | 2007-10-04 | Alps Electric Co Ltd | 配線基板、及びその製造方法 |
JP2009059789A (ja) * | 2007-08-30 | 2009-03-19 | Kyocera Corp | 配線基板およびその製造方法 |
KR20110019536A (ko) * | 2009-08-20 | 2011-02-28 | 삼성전기주식회사 | 세라믹 기판 및 그 제조방법 |
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2015
- 2015-10-29 JP JP2016556632A patent/JP6298174B2/ja active Active
- 2015-10-29 US US15/522,322 patent/US10147662B2/en active Active
- 2015-10-29 CN CN201580057752.4A patent/CN107112291B/zh active Active
- 2015-10-29 WO PCT/JP2015/080585 patent/WO2016068248A1/ja active Application Filing
- 2015-10-29 EP EP15855600.1A patent/EP3200224B1/en active Active
Also Published As
Publication number | Publication date |
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US10147662B2 (en) | 2018-12-04 |
EP3200224A4 (en) | 2018-02-14 |
WO2016068248A1 (ja) | 2016-05-06 |
EP3200224A1 (en) | 2017-08-02 |
CN107112291B (zh) | 2020-01-03 |
CN107112291A (zh) | 2017-08-29 |
JPWO2016068248A1 (ja) | 2017-08-03 |
EP3200224B1 (en) | 2019-06-19 |
US20170358513A1 (en) | 2017-12-14 |
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