JP6292908B2 - プリント回路板 - Google Patents

プリント回路板 Download PDF

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Publication number
JP6292908B2
JP6292908B2 JP2014018566A JP2014018566A JP6292908B2 JP 6292908 B2 JP6292908 B2 JP 6292908B2 JP 2014018566 A JP2014018566 A JP 2014018566A JP 2014018566 A JP2014018566 A JP 2014018566A JP 6292908 B2 JP6292908 B2 JP 6292908B2
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JP
Japan
Prior art keywords
power supply
supply via
conductor
center point
via conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014018566A
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English (en)
Japanese (ja)
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JP2015146382A5 (enExample
JP2015146382A (ja
Inventor
星　聡
聡 星
展輝 山下
展輝 山下
裕典 村井
裕典 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014018566A priority Critical patent/JP6292908B2/ja
Publication of JP2015146382A publication Critical patent/JP2015146382A/ja
Publication of JP2015146382A5 publication Critical patent/JP2015146382A5/ja
Application granted granted Critical
Publication of JP6292908B2 publication Critical patent/JP6292908B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2014018566A 2014-02-03 2014-02-03 プリント回路板 Active JP6292908B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014018566A JP6292908B2 (ja) 2014-02-03 2014-02-03 プリント回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014018566A JP6292908B2 (ja) 2014-02-03 2014-02-03 プリント回路板

Publications (3)

Publication Number Publication Date
JP2015146382A JP2015146382A (ja) 2015-08-13
JP2015146382A5 JP2015146382A5 (enExample) 2017-03-09
JP6292908B2 true JP6292908B2 (ja) 2018-03-14

Family

ID=53890494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014018566A Active JP6292908B2 (ja) 2014-02-03 2014-02-03 プリント回路板

Country Status (1)

Country Link
JP (1) JP6292908B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6777525B2 (ja) * 2016-12-21 2020-10-28 日本碍子株式会社 電流検出用の耐熱性素子
TWI640229B (zh) * 2017-04-14 2018-11-01 和碩聯合科技股份有限公司 電源信號傳遞結構及其設計方法
JP6984441B2 (ja) 2018-01-25 2021-12-22 富士通株式会社 基板及び電子装置
JP2019201070A (ja) * 2018-05-15 2019-11-21 株式会社デンソーテン 多層基板及び多層基板を用いて素子に電流を供給する方法
JPWO2024204500A1 (enExample) * 2023-03-31 2024-10-03

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153792A (ja) * 1984-08-23 1986-03-17 株式会社東芝 多層配線基板
JPH02137071U (enExample) * 1989-04-13 1990-11-15
JPH10294564A (ja) * 1997-04-17 1998-11-04 Advantest Corp 多層プリント配線基板
JP3495917B2 (ja) * 1998-07-15 2004-02-09 日本特殊陶業株式会社 多層配線基板
JP5304185B2 (ja) * 2008-11-10 2013-10-02 富士通株式会社 プリント配線板および電子装置

Also Published As

Publication number Publication date
JP2015146382A (ja) 2015-08-13

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