JP6284325B2 - フレキシブル銅張積層板 - Google Patents

フレキシブル銅張積層板 Download PDF

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Publication number
JP6284325B2
JP6284325B2 JP2013199806A JP2013199806A JP6284325B2 JP 6284325 B2 JP6284325 B2 JP 6284325B2 JP 2013199806 A JP2013199806 A JP 2013199806A JP 2013199806 A JP2013199806 A JP 2013199806A JP 6284325 B2 JP6284325 B2 JP 6284325B2
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JP
Japan
Prior art keywords
copper
clad laminate
polyimide layer
thickness
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013199806A
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English (en)
Japanese (ja)
Other versions
JP2014080021A (ja
Inventor
建太郎 矢熊
建太郎 矢熊
伸悦 藤元
伸悦 藤元
和明 金子
和明 金子
真二 及川
真二 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2013199806A priority Critical patent/JP6284325B2/ja
Publication of JP2014080021A publication Critical patent/JP2014080021A/ja
Application granted granted Critical
Publication of JP6284325B2 publication Critical patent/JP6284325B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2013199806A 2012-09-28 2013-09-26 フレキシブル銅張積層板 Active JP6284325B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013199806A JP6284325B2 (ja) 2012-09-28 2013-09-26 フレキシブル銅張積層板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012217485 2012-09-28
JP2012217485 2012-09-28
JP2013199806A JP6284325B2 (ja) 2012-09-28 2013-09-26 フレキシブル銅張積層板

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2018007432A Division JP6545302B2 (ja) 2012-09-28 2018-01-19 フレキシブル回路基板
JP2018007458A Division JP6581224B2 (ja) 2012-09-28 2018-01-19 フレキシブル銅張積層板

Publications (2)

Publication Number Publication Date
JP2014080021A JP2014080021A (ja) 2014-05-08
JP6284325B2 true JP6284325B2 (ja) 2018-02-28

Family

ID=50409411

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2013199806A Active JP6284325B2 (ja) 2012-09-28 2013-09-26 フレキシブル銅張積層板
JP2018007432A Active JP6545302B2 (ja) 2012-09-28 2018-01-19 フレキシブル回路基板
JP2018007458A Active JP6581224B2 (ja) 2012-09-28 2018-01-19 フレキシブル銅張積層板

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2018007432A Active JP6545302B2 (ja) 2012-09-28 2018-01-19 フレキシブル回路基板
JP2018007458A Active JP6581224B2 (ja) 2012-09-28 2018-01-19 フレキシブル銅張積層板

Country Status (4)

Country Link
JP (3) JP6284325B2 (zh)
KR (1) KR102045089B1 (zh)
CN (1) CN103716983B (zh)
TW (1) TWI599277B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6320031B2 (ja) * 2012-12-28 2018-05-09 新日鉄住金化学株式会社 フレキシブル銅張積層板
JP6360760B2 (ja) * 2014-09-19 2018-07-18 新日鉄住金化学株式会社 銅張積層板及び回路基板
KR102404294B1 (ko) * 2014-09-30 2022-05-31 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 플렉시블 회로 기판 및 전자 기기
JP6440656B2 (ja) 2016-07-12 2018-12-19 古河電気工業株式会社 電解銅箔
EP3487268A4 (en) * 2016-07-12 2020-03-11 Fujikura, Ltd. STRETCHABLE SUBSTRATE
CN106856646A (zh) * 2016-11-13 2017-06-16 惠州市大亚湾科翔科技电路板有限公司 一种柔性覆金属叠板
JP7256618B2 (ja) * 2018-08-29 2023-04-12 タツタ電線株式会社 転写フィルム付電磁波シールドフィルム、転写フィルム付電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法
JP2021009997A (ja) 2019-06-28 2021-01-28 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及びフレキシブル回路基板
CN111526613B (zh) * 2020-05-18 2022-07-12 无锡格菲电子薄膜科技有限公司 一种铜电极石墨烯电热膜及其制备方法
CN113597144A (zh) * 2021-07-28 2021-11-02 恒赫鼎富(苏州)电子有限公司 一种多层fpc线路板制作工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193910B1 (en) * 1997-11-11 2001-02-27 Ngk Spark Plug Co., Ltd. Paste for through-hole filling and printed wiring board using the same
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
US7263769B2 (en) * 2004-10-20 2007-09-04 Matsushita Electric Industrial Co., Ltd. Multi-layered flexible print circuit board and manufacturing method thereof
JP2007208087A (ja) 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
JP2007273766A (ja) * 2006-03-31 2007-10-18 Nippon Steel Chem Co Ltd 配線基板用積層体
JP5638951B2 (ja) * 2008-07-22 2014-12-10 古河電気工業株式会社 フレキシブル銅張積層板
CN102164743A (zh) * 2008-09-26 2011-08-24 住友电木株式会社 层压板、电路板和半导体器件
JP2010280191A (ja) 2009-06-08 2010-12-16 Hitachi Cable Ltd 熱処理用銅箔、熱処理用銅箔の製造方法およびフレキシブルプリント配線板
JP5689284B2 (ja) * 2009-11-11 2015-03-25 新日鉄住金化学株式会社 フレキシブル両面銅張積層板の製造方法
WO2011078259A1 (ja) * 2009-12-25 2011-06-30 新日鐵化学株式会社 可撓性回路基板及び可撓性回路基板の屈曲部構造
WO2012020677A1 (ja) * 2010-08-09 2012-02-16 新日鐵化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話

Also Published As

Publication number Publication date
JP6581224B2 (ja) 2019-09-25
JP6545302B2 (ja) 2019-07-17
CN103716983B (zh) 2017-12-12
JP2018065395A (ja) 2018-04-26
KR102045089B1 (ko) 2019-11-14
KR20140042684A (ko) 2014-04-07
JP2014080021A (ja) 2014-05-08
TW201424475A (zh) 2014-06-16
JP2018067740A (ja) 2018-04-26
TWI599277B (zh) 2017-09-11
CN103716983A (zh) 2014-04-09

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