JP6276488B1 - 温度センサ - Google Patents
温度センサ Download PDFInfo
- Publication number
- JP6276488B1 JP6276488B1 JP2017553268A JP2017553268A JP6276488B1 JP 6276488 B1 JP6276488 B1 JP 6276488B1 JP 2017553268 A JP2017553268 A JP 2017553268A JP 2017553268 A JP2017553268 A JP 2017553268A JP 6276488 B1 JP6276488 B1 JP 6276488B1
- Authority
- JP
- Japan
- Prior art keywords
- housing
- temperature sensor
- element body
- mold
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000005394 sealing glass Substances 0.000 claims abstract description 39
- 239000000919 ceramic Substances 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 29
- 239000002184 metal Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 25
- 238000001746 injection moulding Methods 0.000 description 16
- 238000001514 detection method Methods 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002199 base oil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/004765 WO2018146776A1 (ja) | 2017-02-09 | 2017-02-09 | 温度センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6276488B1 true JP6276488B1 (ja) | 2018-02-07 |
JPWO2018146776A1 JPWO2018146776A1 (ja) | 2019-02-14 |
Family
ID=61158309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017553268A Active JP6276488B1 (ja) | 2017-02-09 | 2017-02-09 | 温度センサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10955296B2 (de) |
EP (1) | EP3382358B2 (de) |
JP (1) | JP6276488B1 (de) |
CN (2) | CN108885143A (de) |
WO (1) | WO2018146776A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6830278B1 (ja) * | 2019-12-24 | 2021-02-17 | 株式会社大泉製作所 | 温度センサ |
EP4030156B1 (de) * | 2020-11-06 | 2023-01-04 | Shibaura Electronics Co., Ltd. | Temperatursensor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02247532A (ja) * | 1989-03-20 | 1990-10-03 | Mitsubishi Electric Corp | 温度センサ |
JPH067029U (ja) * | 1992-07-06 | 1994-01-28 | 日本サーモスタット株式会社 | 温度センサー |
JPH08261847A (ja) * | 1995-03-27 | 1996-10-11 | Aisin Aw Co Ltd | 温度センサ |
JP2003121269A (ja) * | 2001-10-17 | 2003-04-23 | Oizumi Seisakusho:Kk | 温度測定センサと、温度測定センサの製造方法並びに温度測定センサの製造に用いる成形型 |
JP2003139622A (ja) * | 2001-11-05 | 2003-05-14 | Denso Corp | 温度センサ |
JP2013015476A (ja) * | 2011-07-06 | 2013-01-24 | Shibaura Electronics Co Ltd | 温度センサ、温度及び圧力を検知する一体型センサ |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4337221A (en) * | 1978-01-19 | 1982-06-29 | Gray Adrian L | Method of making thermocouples and products thereof |
JPS5855727A (ja) * | 1981-09-29 | 1983-04-02 | Toshiba Corp | 熱電対装置 |
US5133606A (en) * | 1989-07-28 | 1992-07-28 | Becton, Dickinson And Company | Electronic clinical thermometer |
DE4103642A1 (de) * | 1991-02-07 | 1992-08-13 | Ego Elektro Blanc & Fischer | Temperaturfuehler |
JP2961394B2 (ja) | 1992-10-16 | 1999-10-12 | ナイルス部品株式会社 | 温度検出センサの成形方法 |
DE4237039A1 (de) | 1992-11-03 | 1994-05-05 | Henschel Kunststofftechn Gmbh | Temperaturmeßeinrichtung mit aufgesetzter Kappe |
FR2699673B1 (fr) | 1992-12-18 | 1995-03-17 | Jaeger | Perfectionnement aux capteurs de température comportant une thermistance. |
JP3339182B2 (ja) | 1994-05-31 | 2002-10-28 | 株式会社デンソー | 温度検出センサ |
JP3039277B2 (ja) | 1994-08-05 | 2000-05-08 | 株式会社デンソー | 温度センサ |
DE19534890C2 (de) * | 1995-09-20 | 2003-12-18 | Bosch Gmbh Robert | Temperaturfühler |
EP0764837A1 (de) * | 1995-09-25 | 1997-03-26 | Isuzu Ceramics Research Institute Co., Ltd. | Thermoelementstruktur |
US5743646A (en) * | 1996-07-01 | 1998-04-28 | General Motors Corporation | Temperature sensor with improved thermal barrier and gas seal between the probe and housing |
EP0965826A4 (de) * | 1998-01-08 | 2000-03-22 | Matsushita Electric Ind Co Ltd | Temperatursensor und verfahren zur herstellung |
FR2793020B1 (fr) | 1999-04-27 | 2001-12-28 | Sc2N Sa | Capteur de temperature, notamment pour la mesure de fluide dans un moteur de vehicule automobile |
EP1096241A1 (de) | 1999-11-01 | 2001-05-02 | Delphi Technologies, Inc. | Integrierter Druck- und Temperatursensor für Fluide unter hohem Druck |
JP2002267540A (ja) | 2001-03-13 | 2002-09-18 | Denso Corp | 温度センサ |
US20020135454A1 (en) * | 2001-03-22 | 2002-09-26 | Shunji Ichida | Temperature sensor |
JP2003139621A (ja) | 2001-11-05 | 2003-05-14 | Denso Corp | 温度センサおよびその取付構造 |
JP2003302292A (ja) * | 2002-02-07 | 2003-10-24 | Denso Corp | センサおよびその製造方法 |
JP4041018B2 (ja) | 2003-06-25 | 2008-01-30 | Tdk株式会社 | 温度センサ |
JP4867437B2 (ja) * | 2006-04-05 | 2012-02-01 | 株式会社デンソー | 温度センサ |
JP4996336B2 (ja) * | 2007-05-21 | 2012-08-08 | 三菱電線工業株式会社 | 温度センサの製造方法 |
DE102009058761A1 (de) | 2009-12-14 | 2011-06-16 | Tmc Sensortechnik Gmbh | Temperatursensor |
DE102011086600B4 (de) * | 2011-11-17 | 2018-01-18 | Micro-Epsilon Messtechnik Gmbh & Co. Kg | Temperatursensor |
JP5532523B2 (ja) * | 2012-01-27 | 2014-06-25 | 株式会社デンソー | 温度センサ支持装置 |
US10126179B2 (en) * | 2013-10-15 | 2018-11-13 | Panasonic Intellectual Property Management Co., Ltd. | Temperature sensor and manufacturing method therefor |
JP6032224B2 (ja) * | 2014-02-24 | 2016-11-24 | 株式会社デンソー | 電気コネクタおよびその製造方法 |
EP3115760A1 (de) * | 2014-03-06 | 2017-01-11 | Citizen Holdings Co., Ltd. | Drahtlostemperaturfühler |
CN205333218U (zh) * | 2015-12-31 | 2016-06-22 | 广东爱晟电子科技有限公司 | 一种带有新型绝缘封装结构的温度传感器 |
CN105865644A (zh) * | 2016-05-26 | 2016-08-17 | 句容市博远电子有限公司 | 用于封装电子元件的壳体及温度传感器 |
-
2017
- 2017-02-09 WO PCT/JP2017/004765 patent/WO2018146776A1/ja unknown
- 2017-02-09 CN CN201780003456.5A patent/CN108885143A/zh active Pending
- 2017-02-09 JP JP2017553268A patent/JP6276488B1/ja active Active
- 2017-02-09 US US15/770,540 patent/US10955296B2/en active Active
- 2017-02-09 EP EP17861199.2A patent/EP3382358B2/de active Active
- 2017-02-09 CN CN202111190138.9A patent/CN113865728A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02247532A (ja) * | 1989-03-20 | 1990-10-03 | Mitsubishi Electric Corp | 温度センサ |
JPH067029U (ja) * | 1992-07-06 | 1994-01-28 | 日本サーモスタット株式会社 | 温度センサー |
JPH08261847A (ja) * | 1995-03-27 | 1996-10-11 | Aisin Aw Co Ltd | 温度センサ |
JP2003121269A (ja) * | 2001-10-17 | 2003-04-23 | Oizumi Seisakusho:Kk | 温度測定センサと、温度測定センサの製造方法並びに温度測定センサの製造に用いる成形型 |
JP2003139622A (ja) * | 2001-11-05 | 2003-05-14 | Denso Corp | 温度センサ |
JP2013015476A (ja) * | 2011-07-06 | 2013-01-24 | Shibaura Electronics Co Ltd | 温度センサ、温度及び圧力を検知する一体型センサ |
Also Published As
Publication number | Publication date |
---|---|
EP3382358B1 (de) | 2021-01-13 |
US20190064000A1 (en) | 2019-02-28 |
CN108885143A (zh) | 2018-11-23 |
EP3382358B2 (de) | 2024-02-28 |
EP3382358A1 (de) | 2018-10-03 |
CN113865728A (zh) | 2021-12-31 |
JPWO2018146776A1 (ja) | 2019-02-14 |
EP3382358A4 (de) | 2019-01-16 |
US10955296B2 (en) | 2021-03-23 |
WO2018146776A1 (ja) | 2018-08-16 |
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