JP6263014B2 - 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置 - Google Patents

半導体装置、並びにそれを用いたオルタネータ及び電力変換装置 Download PDF

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JP6263014B2
JP6263014B2 JP2013256619A JP2013256619A JP6263014B2 JP 6263014 B2 JP6263014 B2 JP 6263014B2 JP 2013256619 A JP2013256619 A JP 2013256619A JP 2013256619 A JP2013256619 A JP 2013256619A JP 6263014 B2 JP6263014 B2 JP 6263014B2
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Prior art keywords
electrode
semiconductor device
mosfet chip
external electrode
mosfet
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JP2013256619A
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English (en)
Japanese (ja)
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JP2015116053A5 (enExample
JP2015116053A (ja
Inventor
哲也 石丸
哲也 石丸
森　睦宏
森　　睦宏
順一 坂野
順一 坂野
航平 恩田
航平 恩田
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Hitachi Ltd
Minebea Power Semiconductor Device Inc
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Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
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Priority to JP2013256619A priority Critical patent/JP6263014B2/ja
Priority to TW103142184A priority patent/TWI530080B/zh
Priority to CN201480067332.XA priority patent/CN105814785B/zh
Priority to EP14870416.6A priority patent/EP3082243A4/en
Priority to US15/102,771 priority patent/US10319849B2/en
Priority to PCT/JP2014/082947 priority patent/WO2015087997A1/ja
Priority to EP26168823.8A priority patent/EP4761561A2/en
Publication of JP2015116053A publication Critical patent/JP2015116053A/ja
Publication of JP2015116053A5 publication Critical patent/JP2015116053A5/ja
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    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP2013256619A 2013-12-12 2013-12-12 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置 Active JP6263014B2 (ja)

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TW103142184A TWI530080B (zh) 2013-12-12 2014-12-04 半導體裝置、及使用彼之交流發電機以及電力變換裝置
EP14870416.6A EP3082243A4 (en) 2013-12-12 2014-12-12 Semiconductor device, and alternator and power conversion device which use same
US15/102,771 US10319849B2 (en) 2013-12-12 2014-12-12 Semiconductor device, and alternator and power conversion device which use same
CN201480067332.XA CN105814785B (zh) 2013-12-12 2014-12-12 半导体装置、以及使用该半导体装置的交流发电机和电力变换装置
PCT/JP2014/082947 WO2015087997A1 (ja) 2013-12-12 2014-12-12 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置
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JP6617002B2 (ja) * 2015-10-20 2019-12-04 株式会社 日立パワーデバイス 整流器、それを用いたオルタネータおよび電源
JP6641161B2 (ja) * 2015-11-18 2020-02-05 株式会社 日立パワーデバイス 半導体装置、およびそれを用いたオルタネータ
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JP6988518B2 (ja) * 2018-01-26 2022-01-05 株式会社デンソー 整流装置及び回転電機
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JP7232743B2 (ja) 2019-10-24 2023-03-03 株式会社 日立パワーデバイス 半導体装置及びそれを用いた整流素子、オルタネータ
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US11881437B2 (en) 2021-10-27 2024-01-23 Infineon Technologies Ag Embedded package with electrically isolating dielectric liner
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JP2024010725A (ja) * 2022-07-13 2024-01-25 株式会社 日立パワーデバイス オルタネータ用半導体装置およびオルタネータ
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JP2024175486A (ja) 2023-06-06 2024-12-18 ミネベアパワーデバイス株式会社 半導体装置及びそれを用いた電力変換装置
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CN105814785A (zh) 2016-07-27
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EP4761561A2 (en) 2026-06-17
US20160315184A1 (en) 2016-10-27
EP3082243A4 (en) 2017-12-06
TWI530080B (zh) 2016-04-11
US10319849B2 (en) 2019-06-11
JP2015116053A (ja) 2015-06-22
WO2015087997A1 (ja) 2015-06-18
EP3082243A1 (en) 2016-10-19

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