JP6254180B2 - 振動が制御される基板ハンドリングロボット、システム及び方法 - Google Patents
振動が制御される基板ハンドリングロボット、システム及び方法 Download PDFInfo
- Publication number
- JP6254180B2 JP6254180B2 JP2015545103A JP2015545103A JP6254180B2 JP 6254180 B2 JP6254180 B2 JP 6254180B2 JP 2015545103 A JP2015545103 A JP 2015545103A JP 2015545103 A JP2015545103 A JP 2015545103A JP 6254180 B2 JP6254180 B2 JP 6254180B2
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- robot
- substrate
- sensor
- end effector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/16—Program controls
- B25J9/1628—Program controls characterised by the control loop
- B25J9/1653—Program controls characterised by the control loop parameters identification, estimation, stiffness, accuracy, error analysis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261731816P | 2012-11-30 | 2012-11-30 | |
| US61/731,816 | 2012-11-30 | ||
| PCT/US2013/071037 WO2014085163A1 (en) | 2012-11-30 | 2013-11-20 | Vibration-controlled substrate handling robot, systems, and methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015536253A JP2015536253A (ja) | 2015-12-21 |
| JP2015536253A5 JP2015536253A5 (https=) | 2017-01-12 |
| JP6254180B2 true JP6254180B2 (ja) | 2017-12-27 |
Family
ID=50826195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015545103A Expired - Fee Related JP6254180B2 (ja) | 2012-11-30 | 2013-11-20 | 振動が制御される基板ハンドリングロボット、システム及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9296105B2 (https=) |
| JP (1) | JP6254180B2 (https=) |
| KR (2) | KR101859441B1 (https=) |
| CN (1) | CN104813462B (https=) |
| TW (1) | TWI573675B (https=) |
| WO (1) | WO2014085163A1 (https=) |
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| KR20160020338A (ko) * | 2014-08-13 | 2016-02-23 | 박호석 | 매니플레이터용 진동 모니터링 장치 |
| US10014198B2 (en) * | 2015-08-21 | 2018-07-03 | Lam Research Corporation | Wear detection of consumable part in semiconductor manufacturing equipment |
| NL2016330B1 (en) * | 2016-02-26 | 2017-09-20 | Mecal Intellectual Property And Standards B V | Active inertial damper system and method |
| JP6739258B2 (ja) * | 2016-07-06 | 2020-08-12 | 株式会社ダイヘン | 振動低減制御装置、及びロボット |
| DE102017104335A1 (de) * | 2017-03-02 | 2018-09-06 | Physik Instrumente (Pi) Gmbh & Co. Kg | Vorrichtung zur Bewegungsanalyse und Antriebsvorrichtung |
| JP6870433B2 (ja) * | 2017-03-31 | 2021-05-12 | セイコーエプソン株式会社 | 制御装置、およびロボットシステム |
| JP2018171668A (ja) * | 2017-03-31 | 2018-11-08 | セイコーエプソン株式会社 | 制御装置、ロボット、およびロボットシステム |
| JP6939024B2 (ja) | 2017-03-31 | 2021-09-22 | セイコーエプソン株式会社 | ロボット制御装置、ロボットおよびロボットシステム |
| JP7106816B2 (ja) * | 2017-03-31 | 2022-07-27 | セイコーエプソン株式会社 | 制御装置、制御システム、およびロボットシステム |
| US10406562B2 (en) * | 2017-07-21 | 2019-09-10 | Applied Materials, Inc. | Automation for rotary sorters |
| US10695907B2 (en) | 2017-09-29 | 2020-06-30 | Intel Corporation | Methods and apparatus for monitoring robot health in manufacturing environments |
| JP7051045B2 (ja) * | 2017-11-08 | 2022-04-11 | オムロン株式会社 | 移動式マニピュレータ、移動式マニピュレータの制御方法及びプログラム |
| DE102018207826A1 (de) * | 2018-05-18 | 2019-11-21 | Kuka Deutschland Gmbh | Handhabung, insbesondere, Transport von Gütern, insbesondere Wafern, durch einen Roboter |
| US10533852B1 (en) * | 2018-09-27 | 2020-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Leveling sensor, load port including the same, and method of leveling a load port |
| CN109240087B (zh) * | 2018-10-23 | 2022-03-01 | 固高科技股份有限公司 | 实时改变指令规划频率抑制振动的方法和系统 |
| JP7181055B2 (ja) * | 2018-11-02 | 2022-11-30 | ファナック株式会社 | ロボット装置 |
| JP2020157402A (ja) * | 2019-03-26 | 2020-10-01 | セイコーエプソン株式会社 | ロボット制御装置、ロボットの制御方法、およびロボットシステム |
| CN110154057B (zh) * | 2019-06-14 | 2023-08-01 | 中国计量大学 | 能够实现变位加工的减振末端执行器及变位加工制孔方法 |
| JP7045353B2 (ja) * | 2019-10-02 | 2022-03-31 | 株式会社アルバック | 基板搬送装置、および、基板搬送方法 |
| US12485554B2 (en) | 2019-11-01 | 2025-12-02 | Lam Research Corporation | Wafer handling robot with gravitational field sensor |
| CN110757463B (zh) * | 2019-11-20 | 2023-06-27 | 贵州大学 | 一种机械手抓取力度控制方法及装置 |
| TWI728762B (zh) * | 2020-03-27 | 2021-05-21 | 財團法人工業技術研究院 | 減低機械手臂振動之方法 |
| US20210407837A1 (en) * | 2020-06-30 | 2021-12-30 | Applied Materials, Inc. | Robot apparatus and systems, and methods for transporting substrates in electronic device manufacturing |
| TWI899391B (zh) * | 2020-12-21 | 2025-10-01 | 日商發那科股份有限公司 | 機器人控制裝置及機器人系統 |
| CN115338903A (zh) * | 2021-04-28 | 2022-11-15 | 三和技研股份有限公司 | 具薄型脆性基材擦碰震荡传感器的入匣机械臂及传感器 |
| DE102021204935A1 (de) * | 2021-05-17 | 2022-11-17 | Kuka Deutschland Gmbh | Verfahren und System zum Betreiben einer Maschine |
| WO2023083573A1 (en) * | 2021-11-15 | 2023-05-19 | Asml Netherlands B.V. | Method and system of reducing chamber vibration |
| TWI800174B (zh) | 2021-12-22 | 2023-04-21 | 微程式資訊股份有限公司 | 具埋入式感測器之機械手臂承載裝置 |
| CN116476102A (zh) * | 2021-12-22 | 2023-07-25 | 微程式资讯股份有限公司 | 具埋入式感测器的机械手臂承载装置 |
| US12552029B2 (en) | 2022-09-01 | 2026-02-17 | International Business Machines Corporation | Controlling movement to avoid resonance |
| US20240203767A1 (en) * | 2022-12-15 | 2024-06-20 | Applied Materials, Inc. | Vibration sensor assembly |
| KR102607486B1 (ko) * | 2023-03-24 | 2023-11-29 | 주식회사 아임토리 | 로봇팔의 진동 노이즈 제거 방법 및 장치 |
| US20240393761A1 (en) * | 2023-05-25 | 2024-11-28 | Applied Materials, Inc. | Vibration determination in substrate processing systems |
| TWI870230B (zh) * | 2024-02-06 | 2025-01-11 | 三和技研股份有限公司 | 振動分析系統及包含其之工業自動化系統 |
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| US5699145A (en) * | 1993-07-14 | 1997-12-16 | Nikon Corporation | Scanning type exposure apparatus |
| KR100563982B1 (ko) * | 1998-10-19 | 2006-03-29 | 가부시키가이샤 야스카와덴키 | 클린 로봇의 안전 보호 장치 |
| JP2002134583A (ja) * | 2000-10-24 | 2002-05-10 | Tokyo Electron Ltd | 基板搬送装置 |
| JP2002305140A (ja) * | 2001-04-06 | 2002-10-18 | Nikon Corp | 露光装置及び基板処理システム |
| US6956268B2 (en) * | 2001-05-18 | 2005-10-18 | Reveo, Inc. | MEMS and method of manufacturing MEMS |
| JP2003228422A (ja) * | 2002-02-04 | 2003-08-15 | Canon Inc | ステージ制御装置及び露光装置並びにデバイスの製造方法 |
| US7204669B2 (en) * | 2002-07-17 | 2007-04-17 | Applied Materials, Inc. | Semiconductor substrate damage protection system |
| JP4003741B2 (ja) * | 2003-12-04 | 2007-11-07 | 松下電器産業株式会社 | モータ制御装置 |
| US8167522B2 (en) * | 2005-03-30 | 2012-05-01 | Brooks Automation, Inc. | Substrate transport apparatus with active edge gripper |
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| KR101322434B1 (ko) * | 2005-07-11 | 2013-10-28 | 브룩스 오토메이션 인코퍼레이티드 | 지능형 상태 감시 및 결함 진단 시스템 |
| US20070097340A1 (en) * | 2005-10-31 | 2007-05-03 | Nikon Corporation | Active damper with counter mass to compensate for structural vibrations of a lithographic system |
| JP2007251088A (ja) * | 2006-03-20 | 2007-09-27 | Tokyo Electron Ltd | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
| JP4606388B2 (ja) * | 2006-06-12 | 2011-01-05 | 川崎重工業株式会社 | 基板移載装置の搬送系ユニット |
| US7498759B2 (en) * | 2006-08-17 | 2009-03-03 | Micron Technology, Inc. | Semiconductor wafer processing accelerometer |
| DE502006008851D1 (de) * | 2006-11-08 | 2011-03-17 | Integrated Dynamics Eng Gmbh | Kombiniertes Motion-Control-System |
| US7778793B2 (en) * | 2007-03-12 | 2010-08-17 | Cyberoptics Semiconductor, Inc. | Wireless sensor for semiconductor processing systems |
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| US20100129940A1 (en) * | 2008-11-24 | 2010-05-27 | Texas Instruments Incorporated | Vibration monitoring of electronic substrate handling systems |
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| KR101778519B1 (ko) * | 2009-01-11 | 2017-09-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 전자 디바이스 제조시에 기판을 이송하기 위한 로봇 시스템, 장치 및 방법 |
| US8777547B2 (en) * | 2009-01-11 | 2014-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for transporting substrates |
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| JP5549129B2 (ja) * | 2009-07-06 | 2014-07-16 | セイコーエプソン株式会社 | 位置制御方法、ロボット |
| JP2011152621A (ja) * | 2010-01-28 | 2011-08-11 | Yaskawa Electric Corp | 基板搬送用装置 |
| JP2011161562A (ja) * | 2010-02-09 | 2011-08-25 | Yaskawa Electric Corp | 無線伝送装置とそれを用いたロボットの振動抑制制御装置およびロボット制御装置 |
| US8318094B1 (en) * | 2010-06-18 | 2012-11-27 | Pacific Biosciences Of California, Inc. | Substrate analysis systems |
| JP2012044014A (ja) * | 2010-08-20 | 2012-03-01 | Canon Inc | 除振装置、それを用いた露光装置及びデバイスの製造方法 |
| JP5645564B2 (ja) * | 2010-09-14 | 2014-12-24 | キヤノン株式会社 | センサ装置及びロボット装置 |
| JP5817142B2 (ja) * | 2011-02-22 | 2015-11-18 | セイコーエプソン株式会社 | 水平多関節ロボット |
| WO2012140846A1 (ja) * | 2011-04-12 | 2012-10-18 | パナソニック株式会社 | Mems圧力センサ |
| WO2013039550A2 (en) * | 2011-09-13 | 2013-03-21 | Persimmon Technologies Corporation | Method for transporting a substrate with a substrate support |
| US8983660B1 (en) * | 2012-10-01 | 2015-03-17 | Kla-Tencor Corporation | Substrate transporter |
-
2013
- 2013-11-20 KR KR1020177008360A patent/KR101859441B1/ko active Active
- 2013-11-20 KR KR1020157016896A patent/KR20150091346A/ko not_active Ceased
- 2013-11-20 US US14/085,462 patent/US9296105B2/en active Active
- 2013-11-20 CN CN201380061393.0A patent/CN104813462B/zh not_active Expired - Fee Related
- 2013-11-20 WO PCT/US2013/071037 patent/WO2014085163A1/en not_active Ceased
- 2013-11-20 JP JP2015545103A patent/JP6254180B2/ja not_active Expired - Fee Related
- 2013-11-25 TW TW102142889A patent/TWI573675B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140156070A1 (en) | 2014-06-05 |
| CN104813462A (zh) | 2015-07-29 |
| TWI573675B (zh) | 2017-03-11 |
| JP2015536253A (ja) | 2015-12-21 |
| US9296105B2 (en) | 2016-03-29 |
| CN104813462B (zh) | 2017-04-26 |
| KR20150091346A (ko) | 2015-08-10 |
| KR101859441B1 (ko) | 2018-05-21 |
| TW201429653A (zh) | 2014-08-01 |
| KR20170038107A (ko) | 2017-04-05 |
| WO2014085163A1 (en) | 2014-06-05 |
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