JP6232448B2 - 電子銃装置及び真空蒸着装置 - Google Patents

電子銃装置及び真空蒸着装置 Download PDF

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Publication number
JP6232448B2
JP6232448B2 JP2015553358A JP2015553358A JP6232448B2 JP 6232448 B2 JP6232448 B2 JP 6232448B2 JP 2015553358 A JP2015553358 A JP 2015553358A JP 2015553358 A JP2015553358 A JP 2015553358A JP 6232448 B2 JP6232448 B2 JP 6232448B2
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JP
Japan
Prior art keywords
heating current
current
unit
state
supply unit
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JP2015553358A
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English (en)
Japanese (ja)
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JPWO2015092998A1 (ja
Inventor
以誠 後田
以誠 後田
矢島　太郎
太郎 矢島
透 増井
透 増井
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Ulvac Inc
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Ulvac Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/06—Electron sources; Electron guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3132—Evaporating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2015553358A 2013-12-20 2014-12-05 電子銃装置及び真空蒸着装置 Active JP6232448B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013264142 2013-12-20
JP2013264142 2013-12-20
PCT/JP2014/006086 WO2015092998A1 (ja) 2013-12-20 2014-12-05 電子銃装置及び真空蒸着装置

Publications (2)

Publication Number Publication Date
JPWO2015092998A1 JPWO2015092998A1 (ja) 2017-03-16
JP6232448B2 true JP6232448B2 (ja) 2017-11-15

Family

ID=53402377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015553358A Active JP6232448B2 (ja) 2013-12-20 2014-12-05 電子銃装置及び真空蒸着装置

Country Status (5)

Country Link
JP (1) JP6232448B2 (zh)
KR (1) KR20160035053A (zh)
CN (1) CN105555994B (zh)
TW (1) TWI568868B (zh)
WO (1) WO2015092998A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111607762B (zh) * 2020-05-13 2021-03-16 北京航空航天大学 一种实现电子束物理气相沉积自动蒸发陶瓷靶材的装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3397672A (en) * 1965-11-10 1968-08-20 United States Steel Corp Control system for vapor-deposition coating apparatus
JPH11233059A (ja) * 1998-02-19 1999-08-27 Jeol Ltd 電子ビーム発生装置
JP2000096215A (ja) * 1998-09-25 2000-04-04 Toshiba Corp セラミック被覆製造装置とその製造方法及びセラミック被覆部材
JP3952708B2 (ja) * 2001-06-29 2007-08-01 株式会社Ｎｈｖコーポレーション 多ヘッド電子線照射装置のビーム切れ検出運転継続機構
JP2005026112A (ja) * 2003-07-03 2005-01-27 Sony Corp 電子銃の運用方法、電子銃を備えた電子ビーム装置
JP4086786B2 (ja) * 2004-01-05 2008-05-14 株式会社エイコー・エンジニアリング ハイブリッドｅｂセルとそれを使用した成膜材料蒸発方法
CN100526500C (zh) * 2007-10-31 2009-08-12 中国科学院上海光学精密机械研究所 电子束蒸发速率自动控制设备及其控制方法
CN100516285C (zh) * 2007-12-06 2009-07-22 南开大学 电子束加热蒸发方法与装置及其用途
JP2013191353A (ja) * 2012-03-13 2013-09-26 Shimadzu Corp 熱電界放出エミッタ電子銃

Also Published As

Publication number Publication date
TWI568868B (zh) 2017-02-01
KR20160035053A (ko) 2016-03-30
TW201527565A (zh) 2015-07-16
CN105555994B (zh) 2018-05-29
WO2015092998A1 (ja) 2015-06-25
JPWO2015092998A1 (ja) 2017-03-16
CN105555994A (zh) 2016-05-04

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