JP6228851B2 - 配線基板、配線基板の製造方法 - Google Patents

配線基板、配線基板の製造方法 Download PDF

Info

Publication number
JP6228851B2
JP6228851B2 JP2014003529A JP2014003529A JP6228851B2 JP 6228851 B2 JP6228851 B2 JP 6228851B2 JP 2014003529 A JP2014003529 A JP 2014003529A JP 2014003529 A JP2014003529 A JP 2014003529A JP 6228851 B2 JP6228851 B2 JP 6228851B2
Authority
JP
Japan
Prior art keywords
electronic component
connection terminal
core substrate
wiring
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014003529A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015133387A (ja
JP2015133387A5 (enExample
Inventor
貴昭 小柳
貴昭 小柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014003529A priority Critical patent/JP6228851B2/ja
Priority to US14/567,230 priority patent/US9345125B2/en
Publication of JP2015133387A publication Critical patent/JP2015133387A/ja
Publication of JP2015133387A5 publication Critical patent/JP2015133387A5/ja
Application granted granted Critical
Publication of JP6228851B2 publication Critical patent/JP6228851B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2014003529A 2014-01-10 2014-01-10 配線基板、配線基板の製造方法 Active JP6228851B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014003529A JP6228851B2 (ja) 2014-01-10 2014-01-10 配線基板、配線基板の製造方法
US14/567,230 US9345125B2 (en) 2014-01-10 2014-12-11 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014003529A JP6228851B2 (ja) 2014-01-10 2014-01-10 配線基板、配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015133387A JP2015133387A (ja) 2015-07-23
JP2015133387A5 JP2015133387A5 (enExample) 2016-11-10
JP6228851B2 true JP6228851B2 (ja) 2017-11-08

Family

ID=53522580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014003529A Active JP6228851B2 (ja) 2014-01-10 2014-01-10 配線基板、配線基板の製造方法

Country Status (2)

Country Link
US (1) US9345125B2 (enExample)
JP (1) JP6228851B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109413836B (zh) * 2017-08-15 2021-04-20 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
JP7435043B2 (ja) * 2020-03-06 2024-02-21 Tdk株式会社 電子部品内蔵回路基板及びその製造方法
TWI731745B (zh) * 2020-07-15 2021-06-21 欣興電子股份有限公司 內埋式元件結構及其製造方法
CN116711071A (zh) * 2021-01-04 2023-09-05 株式会社村田制作所 电子器件
KR20220130916A (ko) * 2021-03-19 2022-09-27 삼성전기주식회사 전자부품 내장기판

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046077B1 (ko) * 2002-10-08 2011-07-01 다이니폰 인사츠 가부시키가이샤 부품 내장 배선판, 부품 내장 배선판의 제조 방법
KR100598275B1 (ko) * 2004-09-15 2006-07-10 삼성전기주식회사 수동소자 내장형 인쇄회로기판 및 그 제조 방법
US8314343B2 (en) * 2007-09-05 2012-11-20 Taiyo Yuden Co., Ltd. Multi-layer board incorporating electronic component and method for producing the same
US8024858B2 (en) * 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
KR20120026870A (ko) * 2010-09-10 2012-03-20 삼성전자주식회사 회로 기판 및 이를 포함하는 반도체 모듈
JP2013084692A (ja) * 2011-10-06 2013-05-09 Ibiden Co Ltd 配線板及びその製造方法
JP2013211480A (ja) * 2012-03-30 2013-10-10 Fujikura Ltd 部品内蔵基板
KR101483825B1 (ko) * 2012-12-04 2015-01-16 삼성전기주식회사 전자부품 내장기판 및 그 제조방법

Also Published As

Publication number Publication date
US20150201484A1 (en) 2015-07-16
JP2015133387A (ja) 2015-07-23
US9345125B2 (en) 2016-05-17

Similar Documents

Publication Publication Date Title
CN105228341B (zh) 印刷电路板、封装基板及其制造方法
JP4204989B2 (ja) 半導体装置及びその製造方法
US9456492B2 (en) Printed circuit board with warpage prevention layer
JP6133549B2 (ja) 配線基板及び配線基板の製造方法
JP5389770B2 (ja) 電子素子内蔵印刷回路基板及びその製造方法
JP2001210761A (ja) 半導体装置及びその製造方法
JPWO2007126090A1 (ja) 回路基板、電子デバイス装置及び回路基板の製造方法
JP2015106615A (ja) プリント配線板、プリント配線板の製造方法
WO2013047520A1 (ja) 部品内蔵基板実装体及びその製造方法並びに部品内蔵基板
JP6228851B2 (ja) 配線基板、配線基板の製造方法
JP2017143096A (ja) 配線基板、半導体装置及び配線基板の製造方法
JP2017174849A (ja) 半導体装置及び半導体装置の製造方法
JP5512558B2 (ja) 部品内蔵配線基板の製造方法
WO2011030542A2 (ja) 電子部品モジュールおよびその製造方法
US20100236822A1 (en) Wiring board and method for manufacturing the same
KR20150065029A (ko) 인쇄회로기판, 그 제조방법 및 반도체 패키지
JP5397012B2 (ja) 部品内蔵配線板、部品内蔵配線板の製造方法
JP5539453B2 (ja) 電子部品搭載多層配線基板及びその製造方法
JP2004055967A (ja) 電子部品内蔵基板の製造方法
KR100888561B1 (ko) 능동소자 내장형 인쇄회로기판 제조 방법
JP2006210870A (ja) 部品内蔵モジュール及びその製造方法
JP2008243966A (ja) 電子部品が実装されたプリント基板及びその製造方法
JP5174355B2 (ja) 配線基板及びその製造方法と半導体装置
JP2004327743A (ja) 半田バンプ付き配線基板およびその製造方法
US20220071015A1 (en) Circuit board structure and manufacturing method thereof

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160923

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160923

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170808

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170915

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20171003

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20171016

R150 Certificate of patent or registration of utility model

Ref document number: 6228851

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150