JP6223913B2 - 離型フィルム - Google Patents

離型フィルム Download PDF

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Publication number
JP6223913B2
JP6223913B2 JP2014121820A JP2014121820A JP6223913B2 JP 6223913 B2 JP6223913 B2 JP 6223913B2 JP 2014121820 A JP2014121820 A JP 2014121820A JP 2014121820 A JP2014121820 A JP 2014121820A JP 6223913 B2 JP6223913 B2 JP 6223913B2
Authority
JP
Japan
Prior art keywords
release
release film
thickness
film
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014121820A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015052099A (ja
Inventor
洋祐 中尾
洋祐 中尾
土谷　雅弘
雅弘 土谷
航平 宇都
航平 宇都
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014121820A priority Critical patent/JP6223913B2/ja
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to CN201480037650.1A priority patent/CN105359634B/zh
Priority to PCT/JP2014/070192 priority patent/WO2015019933A1/ja
Priority to CN201911003268.XA priority patent/CN110602896B/zh
Priority to KR1020157033856A priority patent/KR102264950B1/ko
Priority to TW103126557A priority patent/TWI650246B/zh
Priority to TW107135256A priority patent/TWI666123B/zh
Publication of JP2015052099A publication Critical patent/JP2015052099A/ja
Application granted granted Critical
Publication of JP6223913B2 publication Critical patent/JP6223913B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2014121820A 2013-08-05 2014-06-12 離型フィルム Active JP6223913B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014121820A JP6223913B2 (ja) 2013-08-05 2014-06-12 離型フィルム
PCT/JP2014/070192 WO2015019933A1 (ja) 2013-08-05 2014-07-31 離型フィルム
CN201911003268.XA CN110602896B (zh) 2013-08-05 2014-07-31 脱模膜
KR1020157033856A KR102264950B1 (ko) 2013-08-05 2014-07-31 이형 필름
CN201480037650.1A CN105359634B (zh) 2013-08-05 2014-07-31 脱模膜
TW103126557A TWI650246B (zh) 2013-08-05 2014-08-04 離型膜
TW107135256A TWI666123B (zh) 2013-08-05 2014-08-04 Release film

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013162657 2013-08-05
JP2013162657 2013-08-05
JP2014121820A JP6223913B2 (ja) 2013-08-05 2014-06-12 離型フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017192635A Division JP6574468B2 (ja) 2013-08-05 2017-10-02 離型フィルム

Publications (2)

Publication Number Publication Date
JP2015052099A JP2015052099A (ja) 2015-03-19
JP6223913B2 true JP6223913B2 (ja) 2017-11-01

Family

ID=52461269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014121820A Active JP6223913B2 (ja) 2013-08-05 2014-06-12 離型フィルム

Country Status (5)

Country Link
JP (1) JP6223913B2 (zh)
KR (1) KR102264950B1 (zh)
CN (2) CN105359634B (zh)
TW (2) TWI650246B (zh)
WO (1) WO2015019933A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム
JP6391554B2 (ja) * 2015-12-14 2018-09-19 住友ベークライト株式会社 離型フィルム
JP6977848B1 (ja) * 2020-11-02 2021-12-08 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI476103B (zh) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JP2005122147A (ja) * 2003-09-24 2005-05-12 Fuji Photo Film Co Ltd 反射防止フィルム、その製造方法、偏光板および画像表示装置
JP2005246836A (ja) * 2004-03-05 2005-09-15 Konica Minolta Photo Imaging Inc インクジェット記録用紙
CN101175637B (zh) 2005-05-13 2012-07-25 三井化学株式会社 含有4-甲基-1-戊烯类聚合物的层合体及由其构成的脱模膜
WO2009016952A1 (ja) * 2007-07-31 2009-02-05 Sumitomo Bakelite Co., Ltd. 離型フィルム
JP4332204B2 (ja) * 2007-09-21 2009-09-16 積水化学工業株式会社 離型フィルム
JP5245497B2 (ja) * 2008-03-31 2013-07-24 住友ベークライト株式会社 離型フィルム
JP5033153B2 (ja) * 2009-02-16 2012-09-26 パナソニック株式会社 片面板の製造方法及びプリント配線板の製造方法
JP5557152B2 (ja) 2010-02-09 2014-07-23 住友ベークライト株式会社 積層フィルム
WO2011111826A1 (ja) * 2010-03-12 2011-09-15 積水化学工業株式会社 離型フィルム及び離型フィルムの製造方法
JP5653123B2 (ja) * 2010-08-17 2015-01-14 ユニチカ株式会社 離型用シート
JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム

Also Published As

Publication number Publication date
CN105359634B (zh) 2019-11-12
WO2015019933A1 (ja) 2015-02-12
TWI650246B (zh) 2019-02-11
TW201902687A (zh) 2019-01-16
TWI666123B (zh) 2019-07-21
KR20160039151A (ko) 2016-04-08
CN110602896B (zh) 2023-01-03
CN110602896A (zh) 2019-12-20
JP2015052099A (ja) 2015-03-19
TW201509684A (zh) 2015-03-16
CN105359634A (zh) 2016-02-24
KR102264950B1 (ko) 2021-06-14

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