WO2009016952A1 - 離型フィルム - Google Patents

離型フィルム Download PDF

Info

Publication number
WO2009016952A1
WO2009016952A1 PCT/JP2008/062702 JP2008062702W WO2009016952A1 WO 2009016952 A1 WO2009016952 A1 WO 2009016952A1 JP 2008062702 W JP2008062702 W JP 2008062702W WO 2009016952 A1 WO2009016952 A1 WO 2009016952A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold release
release film
styrene
thermoplastic elastomer
release layer
Prior art date
Application number
PCT/JP2008/062702
Other languages
English (en)
French (fr)
Inventor
Taichi Yatsuzuka
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to JP2009525335A priority Critical patent/JP5585079B2/ja
Priority to US12/670,914 priority patent/US20100204405A1/en
Priority to KR1020107003782A priority patent/KR101485213B1/ko
Priority to CN200880025625A priority patent/CN101778887A/zh
Publication of WO2009016952A1 publication Critical patent/WO2009016952A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
    • C08J2325/02—Homopolymers or copolymers of hydrocarbons
    • C08J2325/04—Homopolymers or copolymers of styrene
    • C08J2325/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/005—Presence of styrenic polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/005—Presence of block copolymer in the release coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)

Abstract

　シンジオタクチックポリスチレンを用いた離型フィルムの優れた性質を維持しつつ、埋め込み性にも優れた実用的な離型フィルムを提供する。   シンジオタクチックポリスチレン及び水素添加スチレン系熱可塑性エラストマーを配合した離型層を有してなる離型フィルムであって、前記水素添加スチレン系熱可塑性エラストマーの配合量が離型層の樹脂全体に対して１５～３５wt％であることを特徴とする離型フィルムを提供する。水素添加スチレン系熱可塑性エラストマーは(ｉ)スチレン－エチレン－ブチレン－スチレンブロック共重合体、又は(ii)スチレン－エチレン－プロピレン－スチレンブロック共重合体であるのが好ましい。離型層にはさらに環状ポリオレフィン系樹脂を配合してよい。
PCT/JP2008/062702 2007-07-31 2008-07-14 離型フィルム WO2009016952A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009525335A JP5585079B2 (ja) 2007-07-31 2008-07-14 離型フィルム
US12/670,914 US20100204405A1 (en) 2007-07-31 2008-07-14 Release film
KR1020107003782A KR101485213B1 (ko) 2007-07-31 2008-07-14 이형 필름
CN200880025625A CN101778887A (zh) 2007-07-31 2008-07-14 脱模膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007198319 2007-07-31
JP2007-198319 2007-07-31

Publications (1)

Publication Number Publication Date
WO2009016952A1 true WO2009016952A1 (ja) 2009-02-05

Family

ID=40304187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062702 WO2009016952A1 (ja) 2007-07-31 2008-07-14 離型フィルム

Country Status (7)

Country Link
US (1) US20100204405A1 (ja)
JP (1) JP5585079B2 (ja)
KR (1) KR101485213B1 (ja)
CN (1) CN101778887A (ja)
MY (1) MY156410A (ja)
TW (1) TWI449735B (ja)
WO (1) WO2009016952A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009040982A (ja) * 2007-08-11 2009-02-26 Sumitomo Bakelite Co Ltd 離型フィルム
WO2011099252A1 (ja) * 2010-02-09 2011-08-18 住友ベークライト株式会社 積層フィルム
JP2011161749A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
JP2011161747A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
WO2015190386A1 (ja) * 2014-06-11 2015-12-17 倉敷紡績株式会社 粗面を有するポリスチレン系離型フィルムおよびその製造方法
JP2016030419A (ja) * 2014-07-30 2016-03-07 住友ベークライト株式会社 離型フィルム
CN114072938A (zh) * 2019-07-11 2022-02-18 日本戈尔合同会社 用于制造电解质膜或膜电极组件的离型膜

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101040307B1 (ko) 2010-08-26 2011-06-10 삼민화학공업(주) 인쇄회로기판용 완충이형성 복합필름
JP5895755B2 (ja) * 2012-07-17 2016-03-30 住友ベークライト株式会社 離型フィルム
JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム
CN109628001A (zh) * 2018-11-09 2019-04-16 李梅 一种用于FPC行业的sPS胶膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11349703A (ja) * 1998-06-04 1999-12-21 Marusho Kk 離型フィルム
JP2000038461A (ja) * 1998-07-24 2000-02-08 Idemitsu Petrochem Co Ltd 離型フィルム
JP2001310428A (ja) * 2000-04-28 2001-11-06 Idemitsu Petrochem Co Ltd 積層フィルムおよびその用途
JP2001315273A (ja) * 2000-03-03 2001-11-13 Mitsubishi Plastics Ind Ltd 積層フィルム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP2001246635A (ja) * 2000-03-03 2001-09-11 Mitsubishi Plastics Ind Ltd 離形用フィルム及びプリント基板の製造方法
JP2001310422A (ja) * 2000-04-28 2001-11-06 Idemitsu Petrochem Co Ltd 離型フィルム
JP4315004B2 (ja) * 2004-01-23 2009-08-19 住友ベークライト株式会社 離型フィルム及びそれを用いたフレキシブルプリント配線板の製造方法
JP4878869B2 (ja) * 2005-04-08 2012-02-15 日東電工株式会社 発泡部材、発泡部材積層体及び発泡部材が用いられた電気・電子機器類

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11349703A (ja) * 1998-06-04 1999-12-21 Marusho Kk 離型フィルム
JP2000038461A (ja) * 1998-07-24 2000-02-08 Idemitsu Petrochem Co Ltd 離型フィルム
JP2001315273A (ja) * 2000-03-03 2001-11-13 Mitsubishi Plastics Ind Ltd 積層フィルム
JP2001310428A (ja) * 2000-04-28 2001-11-06 Idemitsu Petrochem Co Ltd 積層フィルムおよびその用途

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009040982A (ja) * 2007-08-11 2009-02-26 Sumitomo Bakelite Co Ltd 離型フィルム
WO2011099252A1 (ja) * 2010-02-09 2011-08-18 住友ベークライト株式会社 積層フィルム
JP2011161749A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
JP2011161747A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
CN102762376A (zh) * 2010-02-09 2012-10-31 住友电木株式会社 层压膜
KR101745038B1 (ko) * 2010-02-09 2017-06-08 스미또모 베이크라이트 가부시키가이샤 적층 필름
WO2015190386A1 (ja) * 2014-06-11 2015-12-17 倉敷紡績株式会社 粗面を有するポリスチレン系離型フィルムおよびその製造方法
JP2016030419A (ja) * 2014-07-30 2016-03-07 住友ベークライト株式会社 離型フィルム
CN114072938A (zh) * 2019-07-11 2022-02-18 日本戈尔合同会社 用于制造电解质膜或膜电极组件的离型膜

Also Published As

Publication number Publication date
MY156410A (en) 2016-02-26
JPWO2009016952A1 (ja) 2010-10-14
JP5585079B2 (ja) 2014-09-10
TW200922978A (en) 2009-06-01
KR101485213B1 (ko) 2015-01-22
CN101778887A (zh) 2010-07-14
KR20100042285A (ko) 2010-04-23
US20100204405A1 (en) 2010-08-12
TWI449735B (zh) 2014-08-21

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