JP6219025B2 - リップシール構造体 - Google Patents

リップシール構造体 Download PDF

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Publication number
JP6219025B2
JP6219025B2 JP2012179853A JP2012179853A JP6219025B2 JP 6219025 B2 JP6219025 B2 JP 6219025B2 JP 2012179853 A JP2012179853 A JP 2012179853A JP 2012179853 A JP2012179853 A JP 2012179853A JP 6219025 B2 JP6219025 B2 JP 6219025B2
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JP
Japan
Prior art keywords
lip seal
semiconductor substrate
seal structure
substrate
conformal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012179853A
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English (en)
Japanese (ja)
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JP2013040404A (ja
JP2013040404A5 (enExample
Inventor
フェン、ジンビン
アール． ストウェル、マーシャル
アール． ストウェル、マーシャル
ディー． ウィルモット、フレデリック
ディー． ウィルモット、フレデリック
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Novellus Systems Inc
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Novellus Systems Inc
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Publication date
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Publication of JP2013040404A publication Critical patent/JP2013040404A/ja
Publication of JP2013040404A5 publication Critical patent/JP2013040404A5/ja
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Publication of JP6219025B2 publication Critical patent/JP6219025B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2012179853A 2011-08-15 2012-08-14 リップシール構造体 Active JP6219025B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161523800P 2011-08-15 2011-08-15
US61/523,800 2011-08-15

Publications (3)

Publication Number Publication Date
JP2013040404A JP2013040404A (ja) 2013-02-28
JP2013040404A5 JP2013040404A5 (enExample) 2015-10-01
JP6219025B2 true JP6219025B2 (ja) 2017-10-25

Family

ID=47711562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012179853A Active JP6219025B2 (ja) 2011-08-15 2012-08-14 リップシール構造体

Country Status (6)

Country Link
US (2) US9228270B2 (enExample)
JP (1) JP6219025B2 (enExample)
KR (2) KR102004538B1 (enExample)
CN (2) CN102953104B (enExample)
SG (2) SG10201506529YA (enExample)
TW (3) TWI585246B (enExample)

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US10612151B2 (en) * 2018-02-28 2020-04-07 Lam Research Corporation Flow assisted dynamic seal for high-convection, continuous-rotation plating
JP6963524B2 (ja) * 2018-03-20 2021-11-10 キオクシア株式会社 電解メッキ装置
WO2020169439A1 (de) 2019-02-21 2020-08-27 Markus Hacksteiner Anordnung zum elektrischen kontaktieren eines mikrochipsubstrates
JP2022550449A (ja) * 2019-10-04 2022-12-01 ラム リサーチ コーポレーション リップシールプレートアウトを防止するためのウエハ遮蔽
KR20220107012A (ko) * 2019-11-27 2022-08-01 램 리써치 코포레이션 쓰루-레지스트 (through-resist) 도금을 위한 에지 제거
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CN113957500B (zh) * 2021-10-15 2023-02-28 长鑫存储技术有限公司 晶圆电镀设备
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법
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US20160186355A1 (en) 2016-06-30
US10435807B2 (en) 2019-10-08
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US9228270B2 (en) 2016-01-05
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