JP6215330B2 - 位置ずれ対象の不正確性を概算および補正するための方法 - Google Patents

位置ずれ対象の不正確性を概算および補正するための方法 Download PDF

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Publication number
JP6215330B2
JP6215330B2 JP2015531193A JP2015531193A JP6215330B2 JP 6215330 B2 JP6215330 B2 JP 6215330B2 JP 2015531193 A JP2015531193 A JP 2015531193A JP 2015531193 A JP2015531193 A JP 2015531193A JP 6215330 B2 JP6215330 B2 JP 6215330B2
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Japan
Prior art keywords
measurement
proportionality constant
quality
measuring
measured
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Japanese (ja)
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JP2015534267A5 (enExample
JP2015534267A (ja
Inventor
エラン アミト
エラン アミト
ダナ クレイン
ダナ クレイン
ガイ コーエン
ガイ コーエン
アミル ウィドマン
アミル ウィドマン
ニムロド シュアル
ニムロド シュアル
アムノン マナッセン
アムノン マナッセン
ヌリエル アミル
ヌリエル アミル
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KLA Corp
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KLA Corp
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2015531193A 2012-09-05 2013-09-05 位置ずれ対象の不正確性を概算および補正するための方法 Active JP6215330B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201261696963P 2012-09-05 2012-09-05
US201261697159P 2012-09-05 2012-09-05
US61/696,963 2012-09-05
US61/697,159 2012-09-05
US201361764441P 2013-02-13 2013-02-13
US61/764,441 2013-02-13
US201361766320P 2013-02-19 2013-02-19
US61/766,320 2013-02-19
US13/834,915 2013-03-15
US13/834,915 US9329033B2 (en) 2012-09-05 2013-03-15 Method for estimating and correcting misregistration target inaccuracy
PCT/US2013/058254 WO2014039674A1 (en) 2012-09-05 2013-09-05 Method for estimating and correcting misregistration target inaccuracy

Publications (3)

Publication Number Publication Date
JP2015534267A JP2015534267A (ja) 2015-11-26
JP2015534267A5 JP2015534267A5 (enExample) 2016-10-20
JP6215330B2 true JP6215330B2 (ja) 2017-10-18

Family

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JP2015531193A Active JP6215330B2 (ja) 2012-09-05 2013-09-05 位置ずれ対象の不正確性を概算および補正するための方法

Country Status (6)

Country Link
US (1) US9329033B2 (enExample)
JP (1) JP6215330B2 (enExample)
KR (1) KR102000746B1 (enExample)
CN (1) CN104736962B (enExample)
TW (1) TWI591342B (enExample)
WO (1) WO2014039674A1 (enExample)

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US10372114B2 (en) * 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
US10527952B2 (en) * 2016-10-25 2020-01-07 Kla-Tencor Corporation Fault discrimination and calibration of scatterometry overlay targets
US10191112B2 (en) * 2016-11-18 2019-01-29 Globalfoundries Inc. Early development of a database of fail signatures for systematic defects in integrated circuit (IC) chips
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KR20230027089A (ko) 2020-06-25 2023-02-27 케이엘에이 코포레이션 반도체 디바이스의 오정합 및 비대칭을 개선하기 위한 웨이블릿 시스템 및 방법
US12100574B2 (en) 2020-07-01 2024-09-24 Kla Corporation Target and algorithm to measure overlay by modeling back scattering electrons on overlapping structures
CN116157708A (zh) * 2020-07-20 2023-05-23 应用材料公司 光学装置和光学装置计量的方法
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Also Published As

Publication number Publication date
US20140060148A1 (en) 2014-03-06
TWI591342B (zh) 2017-07-11
JP2015534267A (ja) 2015-11-26
TW201418711A (zh) 2014-05-16
CN104736962B (zh) 2017-10-03
KR20150052128A (ko) 2015-05-13
KR102000746B1 (ko) 2019-07-16
CN104736962A (zh) 2015-06-24
WO2014039674A1 (en) 2014-03-13
US9329033B2 (en) 2016-05-03

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