JP6208011B2 - 回路接続材料及び回路基板の接続構造体 - Google Patents

回路接続材料及び回路基板の接続構造体 Download PDF

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Publication number
JP6208011B2
JP6208011B2 JP2013523067A JP2013523067A JP6208011B2 JP 6208011 B2 JP6208011 B2 JP 6208011B2 JP 2013523067 A JP2013523067 A JP 2013523067A JP 2013523067 A JP2013523067 A JP 2013523067A JP 6208011 B2 JP6208011 B2 JP 6208011B2
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Japan
Prior art keywords
circuit
circuit board
filler
conductive particles
silica filler
Prior art date
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JP2013523067A
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English (en)
Japanese (ja)
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JPWO2013005831A1 (ja
Inventor
憂子 永原
憂子 永原
高井　健次
健次 高井
剛幸 市村
剛幸 市村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2013005831A1 publication Critical patent/JPWO2013005831A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
JP2013523067A 2011-07-07 2012-07-06 回路接続材料及び回路基板の接続構造体 Active JP6208011B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011150991 2011-07-07
JP2011150991 2011-07-07
PCT/JP2012/067329 WO2013005831A1 (ja) 2011-07-07 2012-07-06 回路接続材料及び回路基板の接続構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016110141A Division JP6183499B2 (ja) 2011-07-07 2016-06-01 回路接続材料及び回路基板の接続構造体

Publications (2)

Publication Number Publication Date
JPWO2013005831A1 JPWO2013005831A1 (ja) 2015-02-23
JP6208011B2 true JP6208011B2 (ja) 2017-10-04

Family

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Family Applications (2)

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JP2013523067A Active JP6208011B2 (ja) 2011-07-07 2012-07-06 回路接続材料及び回路基板の接続構造体
JP2016110141A Active JP6183499B2 (ja) 2011-07-07 2016-06-01 回路接続材料及び回路基板の接続構造体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016110141A Active JP6183499B2 (ja) 2011-07-07 2016-06-01 回路接続材料及び回路基板の接続構造体

Country Status (5)

Country Link
JP (2) JP6208011B2 (ko)
KR (1) KR101920952B1 (ko)
CN (1) CN103636068B (ko)
TW (1) TW201308354A (ko)
WO (1) WO2013005831A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10010437B2 (en) 2011-10-17 2018-07-03 W. L. Gore & Associates, Inc. Endoluminal device retrieval devices and related systems and methods
CN111029875B (zh) 2014-11-17 2022-05-10 迪睿合株式会社 各向异性导电膜、连接结构体及其制造方法
JP6889020B2 (ja) 2016-05-02 2021-06-18 デクセリアルズ株式会社 異方性導電フィルムの製造方法、及び異方性導電フィルム
WO2017191776A1 (ja) * 2016-05-02 2017-11-09 デクセリアルズ株式会社 異方性導電フィルムの製造方法、及び異方性導電フィルム
JP7011141B2 (ja) * 2016-06-24 2022-02-10 天馬微電子有限公司 触覚提示用パネル、触覚提示装置および電子機器
WO2018181589A1 (ja) * 2017-03-29 2018-10-04 日立化成株式会社 接着剤組成物及び構造体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
JP3561748B2 (ja) * 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP2001164232A (ja) * 1999-12-09 2001-06-19 Sony Chem Corp 熱硬化性接着材料
JP4178774B2 (ja) * 2001-08-28 2008-11-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤
JP4238124B2 (ja) 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
JP5030196B2 (ja) * 2004-12-16 2012-09-19 住友電気工業株式会社 回路接続用接着剤
JP4839622B2 (ja) 2005-01-31 2011-12-21 日立化成工業株式会社 接着フィルム及びこれを備える積層体
JP2007056209A (ja) * 2005-08-26 2007-03-08 Sumitomo Electric Ind Ltd 回路接続用接着剤
JP2007110062A (ja) * 2005-09-15 2007-04-26 Hitachi Chem Co Ltd ダイボンディング用樹脂ペースト並びに、それを用いた半導体装置の製造方法及び半導体装置
JP5130682B2 (ja) * 2006-02-14 2013-01-30 日立化成工業株式会社 ダイボンディング用樹脂ペースト、該樹脂ペーストを用いた半導体装置の製造方法、および該製造方法により得られる半導体装置
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP5304019B2 (ja) * 2008-05-14 2013-10-02 日立化成株式会社 回路接続材料
JP2010006912A (ja) * 2008-06-25 2010-01-14 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着フィルム及びダイシング・ダイアタッチフィルム
JP5569126B2 (ja) * 2009-05-29 2014-08-13 日立化成株式会社 接着剤組成物、接着剤シート及び半導体装置の製造方法
JP2011233633A (ja) * 2010-04-26 2011-11-17 Hitachi Chem Co Ltd 回路接続材料及び回路部材の接続体

Also Published As

Publication number Publication date
JP6183499B2 (ja) 2017-08-23
JPWO2013005831A1 (ja) 2015-02-23
KR20140035993A (ko) 2014-03-24
CN103636068B (zh) 2017-09-08
WO2013005831A1 (ja) 2013-01-10
TWI563519B (ko) 2016-12-21
JP2016196646A (ja) 2016-11-24
KR101920952B1 (ko) 2018-11-21
TW201308354A (zh) 2013-02-16
CN103636068A (zh) 2014-03-12

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