TW201308354A - 電路連接材料及電路基板的連接構造體 - Google Patents
電路連接材料及電路基板的連接構造體 Download PDFInfo
- Publication number
- TW201308354A TW201308354A TW101124426A TW101124426A TW201308354A TW 201308354 A TW201308354 A TW 201308354A TW 101124426 A TW101124426 A TW 101124426A TW 101124426 A TW101124426 A TW 101124426A TW 201308354 A TW201308354 A TW 201308354A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit
- connecting material
- filler
- circuit connecting
- particle diameter
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011150991 | 2011-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201308354A true TW201308354A (zh) | 2013-02-16 |
TWI563519B TWI563519B (ko) | 2016-12-21 |
Family
ID=47437174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101124426A TW201308354A (zh) | 2011-07-07 | 2012-07-06 | 電路連接材料及電路基板的連接構造體 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6208011B2 (ko) |
KR (1) | KR101920952B1 (ko) |
CN (1) | CN103636068B (ko) |
TW (1) | TW201308354A (ko) |
WO (1) | WO2013005831A1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10010437B2 (en) | 2011-10-17 | 2018-07-03 | W. L. Gore & Associates, Inc. | Endoluminal device retrieval devices and related systems and methods |
CN111029875B (zh) | 2014-11-17 | 2022-05-10 | 迪睿合株式会社 | 各向异性导电膜、连接结构体及其制造方法 |
KR102445646B1 (ko) * | 2016-05-02 | 2022-09-21 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
JP6889020B2 (ja) * | 2016-05-02 | 2021-06-18 | デクセリアルズ株式会社 | 異方性導電フィルムの製造方法、及び異方性導電フィルム |
JP7011141B2 (ja) * | 2016-06-24 | 2022-02-10 | 天馬微電子有限公司 | 触覚提示用パネル、触覚提示装置および電子機器 |
KR102577181B1 (ko) * | 2017-03-29 | 2023-09-08 | 가부시끼가이샤 레조낙 | 접착제 조성물 및 구조체 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07133466A (ja) * | 1993-11-09 | 1995-05-23 | Soken Kagaku Kk | 接着方法 |
JP3561748B2 (ja) * | 1994-10-14 | 2004-09-02 | 綜研化学株式会社 | 異方導電性接着剤 |
JP2001164232A (ja) * | 1999-12-09 | 2001-06-19 | Sony Chem Corp | 熱硬化性接着材料 |
JP4178774B2 (ja) * | 2001-08-28 | 2008-11-12 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電接着剤 |
JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
JP5030196B2 (ja) * | 2004-12-16 | 2012-09-19 | 住友電気工業株式会社 | 回路接続用接着剤 |
JP4839622B2 (ja) * | 2005-01-31 | 2011-12-21 | 日立化成工業株式会社 | 接着フィルム及びこれを備える積層体 |
JP2007056209A (ja) * | 2005-08-26 | 2007-03-08 | Sumitomo Electric Ind Ltd | 回路接続用接着剤 |
JP2007110062A (ja) * | 2005-09-15 | 2007-04-26 | Hitachi Chem Co Ltd | ダイボンディング用樹脂ペースト並びに、それを用いた半導体装置の製造方法及び半導体装置 |
JP5130682B2 (ja) * | 2006-02-14 | 2013-01-30 | 日立化成工業株式会社 | ダイボンディング用樹脂ペースト、該樹脂ペーストを用いた半導体装置の製造方法、および該製造方法により得られる半導体装置 |
JP2009194359A (ja) * | 2008-01-16 | 2009-08-27 | Hitachi Chem Co Ltd | 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法 |
JP5151920B2 (ja) * | 2008-02-05 | 2013-02-27 | 日立化成工業株式会社 | 導電粒子及び導電粒子の製造方法 |
JP5304019B2 (ja) * | 2008-05-14 | 2013-10-02 | 日立化成株式会社 | 回路接続材料 |
JP2010006912A (ja) * | 2008-06-25 | 2010-01-14 | Shin-Etsu Chemical Co Ltd | 接着剤組成物、接着フィルム及びダイシング・ダイアタッチフィルム |
JP5569126B2 (ja) * | 2009-05-29 | 2014-08-13 | 日立化成株式会社 | 接着剤組成物、接着剤シート及び半導体装置の製造方法 |
JP2011233633A (ja) * | 2010-04-26 | 2011-11-17 | Hitachi Chem Co Ltd | 回路接続材料及び回路部材の接続体 |
-
2012
- 2012-07-06 CN CN201280031918.1A patent/CN103636068B/zh active Active
- 2012-07-06 JP JP2013523067A patent/JP6208011B2/ja active Active
- 2012-07-06 KR KR1020147000360A patent/KR101920952B1/ko active IP Right Grant
- 2012-07-06 WO PCT/JP2012/067329 patent/WO2013005831A1/ja active Application Filing
- 2012-07-06 TW TW101124426A patent/TW201308354A/zh unknown
-
2016
- 2016-06-01 JP JP2016110141A patent/JP6183499B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2013005831A1 (ja) | 2013-01-10 |
CN103636068A (zh) | 2014-03-12 |
JP6183499B2 (ja) | 2017-08-23 |
KR101920952B1 (ko) | 2018-11-21 |
JP6208011B2 (ja) | 2017-10-04 |
CN103636068B (zh) | 2017-09-08 |
KR20140035993A (ko) | 2014-03-24 |
TWI563519B (ko) | 2016-12-21 |
JPWO2013005831A1 (ja) | 2015-02-23 |
JP2016196646A (ja) | 2016-11-24 |
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