JP6176962B2 - Cvd反応室のプロセスチャンバの壁の洗浄方法 - Google Patents
Cvd反応室のプロセスチャンバの壁の洗浄方法 Download PDFInfo
- Publication number
- JP6176962B2 JP6176962B2 JP2013063153A JP2013063153A JP6176962B2 JP 6176962 B2 JP6176962 B2 JP 6176962B2 JP 2013063153 A JP2013063153 A JP 2013063153A JP 2013063153 A JP2013063153 A JP 2013063153A JP 6176962 B2 JP6176962 B2 JP 6176962B2
- Authority
- JP
- Japan
- Prior art keywords
- process chamber
- gas inlet
- gas
- slm
- inlet region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012102661.0 | 2012-03-28 | ||
DE102012102661.0A DE102012102661B4 (de) | 2012-03-28 | 2012-03-28 | Verfahren zum Reinigen der Wände einer Prozesskammer eines CVD-Reaktors |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013207301A JP2013207301A (ja) | 2013-10-07 |
JP6176962B2 true JP6176962B2 (ja) | 2017-08-09 |
Family
ID=49154553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013063153A Active JP6176962B2 (ja) | 2012-03-28 | 2013-03-26 | Cvd反応室のプロセスチャンバの壁の洗浄方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6176962B2 (de) |
KR (1) | KR102178716B1 (de) |
DE (1) | DE102012102661B4 (de) |
TW (1) | TWI573893B (de) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE46699E1 (en) | 2013-01-16 | 2018-02-06 | Greatbatch Ltd. | Low impedance oxide resistant grounded capacitor for an AIMD |
US9895534B2 (en) | 2008-03-20 | 2018-02-20 | Greatbatch Ltd. | MLCC filter on an AIMD circuit board with conductive ground pin attached to a hermetic feedthrough ferrule |
US9931514B2 (en) | 2013-06-30 | 2018-04-03 | Greatbatch Ltd. | Low impedance oxide resistant grounded capacitor for an AIMD |
US10080889B2 (en) | 2009-03-19 | 2018-09-25 | Greatbatch Ltd. | Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD |
US10350421B2 (en) | 2013-06-30 | 2019-07-16 | Greatbatch Ltd. | Metallurgically bonded gold pocket pad for grounding an EMI filter to a hermetic terminal for an active implantable medical device |
US10559409B2 (en) | 2017-01-06 | 2020-02-11 | Greatbatch Ltd. | Process for manufacturing a leadless feedthrough for an active implantable medical device |
US10561837B2 (en) | 2011-03-01 | 2020-02-18 | Greatbatch Ltd. | Low equivalent series resistance RF filter for an active implantable medical device utilizing a ceramic reinforced metal composite filled via |
US10589107B2 (en) | 2016-11-08 | 2020-03-17 | Greatbatch Ltd. | Circuit board mounted filtered feedthrough assembly having a composite conductive lead for an AIMD |
US10905888B2 (en) | 2018-03-22 | 2021-02-02 | Greatbatch Ltd. | Electrical connection for an AIMD EMI filter utilizing an anisotropic conductive layer |
US10912945B2 (en) | 2018-03-22 | 2021-02-09 | Greatbatch Ltd. | Hermetic terminal for an active implantable medical device having a feedthrough capacitor partially overhanging a ferrule for high effective capacitance area |
US11147977B2 (en) | 2008-03-20 | 2021-10-19 | Greatbatch Ltd. | MLCC filter on an aimd circuit board conductively connected to a ground pin attached to a hermetic feedthrough ferrule |
US11198014B2 (en) | 2011-03-01 | 2021-12-14 | Greatbatch Ltd. | Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013104105A1 (de) | 2013-04-23 | 2014-10-23 | Aixtron Se | MOCVD-Schichtwachstumsverfahren mit nachfolgendem mehrstufigen Reinigungsschritt |
TWI563542B (en) * | 2014-11-21 | 2016-12-21 | Hermes Epitek Corp | Approach of controlling the wafer and the thin film surface temperature |
DE102015101462A1 (de) | 2015-02-02 | 2016-08-04 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden einer III-V-Halbleiterschicht |
JP7042689B2 (ja) * | 2018-05-23 | 2022-03-28 | 東京エレクトロン株式会社 | サセプタのドライクリーニング方法及び基板処理装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0279420A (ja) * | 1988-09-14 | 1990-03-20 | Babcock Hitachi Kk | 光励起cvd装置 |
JP3326538B2 (ja) * | 1991-10-24 | 2002-09-24 | 東京エレクトロン株式会社 | コールドウォール形成膜処理装置 |
US5609721A (en) * | 1994-03-11 | 1997-03-11 | Fujitsu Limited | Semiconductor device manufacturing apparatus and its cleaning method |
JPH0888177A (ja) * | 1994-09-19 | 1996-04-02 | Fujitsu Ltd | 薄膜形成装置及びクリーニング方法 |
US5849092A (en) * | 1997-02-25 | 1998-12-15 | Applied Materials, Inc. | Process for chlorine trifluoride chamber cleaning |
JP2000355767A (ja) * | 1999-06-11 | 2000-12-26 | Nippon Sanso Corp | シリコンcvd装置 |
JP4733856B2 (ja) * | 2001-05-10 | 2011-07-27 | ルネサスエレクトロニクス株式会社 | 高密度プラズマcvd装置のリモートプラズマクリーニング方法 |
DE10163394A1 (de) * | 2001-12-21 | 2003-07-03 | Aixtron Ag | Verfahren und Vorrichtung zum Abscheiden kristalliner Schichten und auf kristallinen Substraten |
DE102004009130A1 (de) | 2004-02-25 | 2005-09-15 | Aixtron Ag | Einlasssystem für einen MOCVD-Reaktor |
DE102006018515A1 (de) * | 2006-04-21 | 2007-10-25 | Aixtron Ag | CVD-Reaktor mit absenkbarer Prozesskammerdecke |
DE102007009145A1 (de) * | 2007-02-24 | 2008-08-28 | Aixtron Ag | Vorrichtung zum Abscheiden kristalliner Schichten wahlweise mittels MOCVD oder HVPE |
JP2010034424A (ja) | 2008-07-30 | 2010-02-12 | Sumco Corp | エピタキシャル成長炉内のガスクリーニング方法 |
US20100154826A1 (en) * | 2008-12-19 | 2010-06-24 | Tokyo Electron Limited | System and Method For Rinse Optimization |
DE102010000554A1 (de) * | 2009-03-16 | 2010-09-30 | Aixtron Ag | MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte |
DE102011054566A1 (de) | 2011-10-18 | 2013-04-18 | Aixtron Se | Vorrichtung und Verfahren zum Abscheiden mehrkomponentiger Schichten, insbesondere metallorganischer Halbleiterschichten |
-
2012
- 2012-03-28 DE DE102012102661.0A patent/DE102012102661B4/de active Active
-
2013
- 2013-03-26 JP JP2013063153A patent/JP6176962B2/ja active Active
- 2013-03-26 TW TW102110632A patent/TWI573893B/zh active
- 2013-03-26 KR KR1020130032208A patent/KR102178716B1/ko active IP Right Grant
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11013928B2 (en) | 2008-03-20 | 2021-05-25 | Greatbatch Ltd. | Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough |
US10016595B2 (en) | 2008-03-20 | 2018-07-10 | Greatbatch Ltd. | MLCC filter on an AIMD circuit board with ground electrical connection to a gold braze between a hermetic feedthrough ferrule and insulator |
US11648409B2 (en) | 2008-03-20 | 2023-05-16 | Greatbatch Ltd. | Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough |
US10016596B2 (en) | 2008-03-20 | 2018-07-10 | Greatbatch Ltd. | MLCC filter on an AIMD circuit board having an external ground plate adjacent to the hermetic seal insulator |
US10722706B2 (en) | 2008-03-20 | 2020-07-28 | Greatbatch Ltd. | Filtered feedthrough assembly having an MLCC filter capacitor on an AIMD circuit board attached to the ferrule of a hermetic feedthrough |
US11241581B2 (en) | 2008-03-20 | 2022-02-08 | Greatbatch Ltd. | Feedthrough terminal assembly with an electrically conductive pad conductively connected to a terminal pin |
US10099051B2 (en) | 2008-03-20 | 2018-10-16 | Greatbatch Ltd. | MLCC filter on an AIMD circuit board with direct connect to the gold braze hermetically sealing a feed through insulator to a ferrule |
US10857369B2 (en) | 2008-03-20 | 2020-12-08 | Greatbatch Ltd. | Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough |
US11147977B2 (en) | 2008-03-20 | 2021-10-19 | Greatbatch Ltd. | MLCC filter on an aimd circuit board conductively connected to a ground pin attached to a hermetic feedthrough ferrule |
US10874866B2 (en) | 2008-03-20 | 2020-12-29 | Greatbatch Ltd. | Flat-through capacitor mounted in a tombstone position on a hermetic feedthrough for an active implantable medical device |
US10124164B2 (en) | 2008-03-20 | 2018-11-13 | Greatbatch Ltd. | MLCC filter on an AIMD circuit board with conductive ground pin attached to a hermetic feedthrough ferrule |
US9895534B2 (en) | 2008-03-20 | 2018-02-20 | Greatbatch Ltd. | MLCC filter on an AIMD circuit board with conductive ground pin attached to a hermetic feedthrough ferrule |
US10080889B2 (en) | 2009-03-19 | 2018-09-25 | Greatbatch Ltd. | Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD |
US11071858B2 (en) | 2011-03-01 | 2021-07-27 | Greatbatch Ltd. | Hermetically sealed filtered feedthrough having platinum sealed directly to the insulator in a via hole |
US10561837B2 (en) | 2011-03-01 | 2020-02-18 | Greatbatch Ltd. | Low equivalent series resistance RF filter for an active implantable medical device utilizing a ceramic reinforced metal composite filled via |
US10596369B2 (en) | 2011-03-01 | 2020-03-24 | Greatbatch Ltd. | Low equivalent series resistance RF filter for an active implantable medical device |
US11198014B2 (en) | 2011-03-01 | 2021-12-14 | Greatbatch Ltd. | Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing |
USRE46699E1 (en) | 2013-01-16 | 2018-02-06 | Greatbatch Ltd. | Low impedance oxide resistant grounded capacitor for an AIMD |
US9931514B2 (en) | 2013-06-30 | 2018-04-03 | Greatbatch Ltd. | Low impedance oxide resistant grounded capacitor for an AIMD |
US10350421B2 (en) | 2013-06-30 | 2019-07-16 | Greatbatch Ltd. | Metallurgically bonded gold pocket pad for grounding an EMI filter to a hermetic terminal for an active implantable medical device |
US10589107B2 (en) | 2016-11-08 | 2020-03-17 | Greatbatch Ltd. | Circuit board mounted filtered feedthrough assembly having a composite conductive lead for an AIMD |
US10559409B2 (en) | 2017-01-06 | 2020-02-11 | Greatbatch Ltd. | Process for manufacturing a leadless feedthrough for an active implantable medical device |
US10912945B2 (en) | 2018-03-22 | 2021-02-09 | Greatbatch Ltd. | Hermetic terminal for an active implantable medical device having a feedthrough capacitor partially overhanging a ferrule for high effective capacitance area |
US10905888B2 (en) | 2018-03-22 | 2021-02-02 | Greatbatch Ltd. | Electrical connection for an AIMD EMI filter utilizing an anisotropic conductive layer |
US11712571B2 (en) | 2018-03-22 | 2023-08-01 | Greatbatch Ltd. | Electrical connection for a hermetic terminal for an active implantable medical device utilizing a ferrule pocket |
Also Published As
Publication number | Publication date |
---|---|
JP2013207301A (ja) | 2013-10-07 |
TWI573893B (zh) | 2017-03-11 |
TW201348506A (zh) | 2013-12-01 |
KR102178716B1 (ko) | 2020-11-13 |
DE102012102661A1 (de) | 2013-10-02 |
KR20130110079A (ko) | 2013-10-08 |
DE102012102661B4 (de) | 2024-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6176962B2 (ja) | Cvd反応室のプロセスチャンバの壁の洗浄方法 | |
US10407771B2 (en) | Atomic layer deposition chamber with thermal lid | |
JP4673881B2 (ja) | 結晶層堆積装置および結晶層堆積方法 | |
US11377730B2 (en) | Substrate processing apparatus and furnace opening cover | |
JP4930438B2 (ja) | 反応管及び熱処理装置 | |
JP5294694B2 (ja) | シリコン及びチタン窒化物のインサイチュ蒸着 | |
KR101599431B1 (ko) | Cvd 방법 및 cvd 반응기 | |
RU2011130900A (ru) | Mocvd-реактор с цилиндрическим газовпускным элементом | |
JP6640596B2 (ja) | 成膜方法 | |
JP2009152521A (ja) | 半導体製造装置および半導体製造方法 | |
CN106245003A (zh) | 气体分配器及使用该气体分配器的沉积设备 | |
JP2019537837A5 (de) | ||
KR20220052996A (ko) | 금속 증착 | |
US10253427B2 (en) | Epitaxial growth apparatus and method of manufacturing a semiconductor device | |
JP6226677B2 (ja) | 半導体製造装置および半導体製造方法 | |
JP2007180528A (ja) | 成膜方法及び成膜装置 | |
TW201500577A (zh) | 用於化學氣相沉積的反應裝置及反應製程 | |
JP2011151118A (ja) | 半導体製造装置および半導体製造方法 | |
JP6302379B2 (ja) | 基板処理装置及び処理ガス生成器 | |
KR101807567B1 (ko) | Ald 산화막 형성 방법 및 장치 | |
JP2010186949A (ja) | 半導体製造装置および半導体製造方法 | |
JP2016044341A (ja) | 基板処理装置及び処理ガス生成器 | |
KR102337411B1 (ko) | 증착 장치 | |
KR100450173B1 (ko) | 확산억제가스흐름과 확산억제수단을 이용한 화학기상증착방법 및 그 장치 | |
JP2023007474A (ja) | 膜を堆積するための化学蒸着炉 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160219 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161207 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170221 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170620 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170711 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6176962 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |