JP6173215B2 - 導電性粒子、樹脂粒子、導電材料及び接続構造体 - Google Patents

導電性粒子、樹脂粒子、導電材料及び接続構造体 Download PDF

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JP6173215B2
JP6173215B2 JP2013535615A JP2013535615A JP6173215B2 JP 6173215 B2 JP6173215 B2 JP 6173215B2 JP 2013535615 A JP2013535615 A JP 2013535615A JP 2013535615 A JP2013535615 A JP 2013535615A JP 6173215 B2 JP6173215 B2 JP 6173215B2
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particles
resin
conductive
conductive particles
electrode
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JPWO2014007334A1 (ja
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伸也 上野山
伸也 上野山
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C08J2333/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Non-Insulated Conductors (AREA)
JP2013535615A 2012-07-05 2013-07-04 導電性粒子、樹脂粒子、導電材料及び接続構造体 Active JP6173215B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012151618 2012-07-05
JP2012151618 2012-07-05
PCT/JP2013/068380 WO2014007334A1 (ja) 2012-07-05 2013-07-04 導電性粒子、樹脂粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JPWO2014007334A1 JPWO2014007334A1 (ja) 2016-06-02
JP6173215B2 true JP6173215B2 (ja) 2017-08-02

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ID=49882085

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JP2013535615A Active JP6173215B2 (ja) 2012-07-05 2013-07-04 導電性粒子、樹脂粒子、導電材料及び接続構造体

Country Status (5)

Country Link
JP (1) JP6173215B2 (ko)
KR (2) KR102093270B1 (ko)
CN (1) CN104380393B (ko)
TW (1) TWI601159B (ko)
WO (1) WO2014007334A1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104684970B (zh) * 2013-01-24 2018-01-30 积水化学工业株式会社 基材粒子、导电性粒子、导电材料及连接结构体
JP6737566B2 (ja) * 2014-01-14 2020-08-12 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
KR102401753B1 (ko) * 2014-05-12 2022-05-26 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
CN105849820B (zh) * 2014-05-14 2018-10-26 积水化学工业株式会社 导电糊剂、导电糊剂的制造方法、连接结构体及连接结构体的制造方法
WO2017051872A1 (ja) * 2015-09-25 2017-03-30 積水化学工業株式会社 接続構造体の製造方法、導電性粒子、導電フィルム及び接続構造体
JP6925102B2 (ja) * 2015-09-30 2021-08-25 大日本印刷株式会社 透明導電性積層体及びタッチパネル
JP6544183B2 (ja) * 2015-09-30 2019-07-17 三菱マテリアル株式会社 熱伝導性組成物
CN105541034B (zh) * 2016-01-15 2018-07-10 济南大学 一种镀锌废水净水系统及净水方法
JP7453738B2 (ja) * 2016-11-04 2024-03-21 積水化学工業株式会社 基材粒子、導電性粒子、導電材料、接続材料及び接続構造体
CN110268809A (zh) * 2017-03-09 2019-09-20 株式会社藤仓 伸缩性布线体和伸缩性基板
KR102391136B1 (ko) * 2017-06-12 2022-04-28 세키스이가가쿠 고교가부시키가이샤 수지 입자, 도전성 입자, 도전 재료, 접착제, 접속 구조체 및 액정 표시 소자
JP7335687B2 (ja) * 2017-09-06 2023-08-30 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP2019179647A (ja) * 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
JP7255102B2 (ja) * 2018-08-14 2023-04-11 株式会社レゾナック 樹脂粒子の製造方法、導電性粒子の製造方法、異方導電材料の製造方法、及び接続構造体の製造方法
WO2021095804A1 (ja) 2019-11-15 2021-05-20 日本化学工業株式会社 導電性粒子、その製造方法及びそれを含む導電性材料
JPWO2021095803A1 (ko) 2019-11-15 2021-05-20
JP2020121563A (ja) * 2020-04-07 2020-08-13 大日本印刷株式会社 透明導電性積層体及びタッチパネル
KR20230012496A (ko) 2020-05-20 2023-01-26 니폰 가가쿠 고교 가부시키가이샤 도전성 입자, 그것을 사용한 도전성 재료 및 접속 구조체

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216841A (ja) * 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2001155540A (ja) * 1999-11-29 2001-06-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電接着剤及び導電接続構造体
JP3991093B2 (ja) 2002-02-22 2007-10-17 綜研化学株式会社 高弾力性定形粒子、その製造方法及びその用途
JP2003313304A (ja) 2002-04-22 2003-11-06 Sekisui Chem Co Ltd 導電性微粒子、導電性微粒子の製造方法及び電子部品の接合材料
JP2006245140A (ja) * 2005-03-01 2006-09-14 Nissha Printing Co Ltd 回路端子の接続構造及び接続方法
JP4962706B2 (ja) * 2006-09-29 2012-06-27 日本化学工業株式会社 導電性粒子およびその製造方法
EP2202755A4 (en) * 2007-10-24 2011-03-30 Sekisui Chemical Co Ltd ELECTRICALLY CONDUCTIVE MICROPARTICLES, ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL, CONNECTING STRUCTURE AND METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE MICROPARTICLE
WO2009119788A1 (ja) * 2008-03-27 2009-10-01 積水化学工業株式会社 重合体粒子、導電性粒子、異方性導電材料及び接続構造体
JP2011119154A (ja) * 2009-12-04 2011-06-16 Hitachi Chem Co Ltd 接続方法及び接続構造体
JP5619675B2 (ja) * 2010-08-16 2014-11-05 株式会社日本触媒 導電性微粒子および異方性導電材料

Also Published As

Publication number Publication date
KR102093270B1 (ko) 2020-03-25
CN104380393A (zh) 2015-02-25
TWI601159B (zh) 2017-10-01
TW201405582A (zh) 2014-02-01
CN104380393B (zh) 2017-11-28
KR20150035531A (ko) 2015-04-06
WO2014007334A1 (ja) 2014-01-09
KR20200033983A (ko) 2020-03-30
JPWO2014007334A1 (ja) 2016-06-02

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