JP6161411B2 - 液体吐出装置の製造方法 - Google Patents
液体吐出装置の製造方法 Download PDFInfo
- Publication number
- JP6161411B2 JP6161411B2 JP2013118726A JP2013118726A JP6161411B2 JP 6161411 B2 JP6161411 B2 JP 6161411B2 JP 2013118726 A JP2013118726 A JP 2013118726A JP 2013118726 A JP2013118726 A JP 2013118726A JP 6161411 B2 JP6161411 B2 JP 6161411B2
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- pressure chamber
- adhesive film
- liquid
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 37
- 239000002313 adhesive film Substances 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 55
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 32
- 238000005304 joining Methods 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 239000010408 film Substances 0.000 description 15
- 229920000052 poly(p-xylylene) Polymers 0.000 description 11
- 239000010409 thin film Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
圧電体に接続される接続端子及び接続端子から延ばされる配線を有し、圧力室に対応する位置に、圧力室の開口断面積よりも断面積が小さい貫通穴が形成された配線基板を、接着性フィルムによって、液体吐出ヘッドの、吐出口側とは反対側の接合面に接着して、配線基板の接続端子と、圧力室の壁に形成された電極とを電気的に接続し、
配線基板および液体吐出ヘッドの少なくとも一方が、接続端子に対向する位置に形成され、接続端子に当接する台座構造であって、接合面に平行な断面面積が接続端子に当接する一端側から他端側に向かって連続的に増加する形状に形成された台座構造を有することを特徴とする。
インクジェットヘッド303と配線基板302を接合する、第1の実施例の製造方法について説明する。
インクジェットヘッド303と配線基板302とを接合する、第2の実施例の製造方法について説明する。
インクジェットヘッド303と配線基板302とを接合する、第3の実施例の製造方法について説明する。
インクジェットヘッド303と配線基板302とを接合する、第4の実施例の製造方法について説明する。
インクジェットヘッド303と配線基板302とを接合する、第5の実施例の製造方法について説明する。
インクジェットヘッド303と配線基板302とを接合する、第6の実施例の製造方法について説明する。
302 配線基板
303 インクジェットヘッド
306 貫通穴
309 吐出口
501 第1の圧電プレート
502 第2の圧電プレート
503 圧力室
504、507 空気室
505 第1の電極(SIG)
506 第2の電極(GND)
507 空気室
508 第3の電極(GND)
509 第4の電極(GND)
512 第5の電極(SIG)
701 接着性フィルム
702 接続端子
801 貫通電極
901 台座構造
Claims (6)
- 液体を吐出する吐出口に連通し、該吐出口から吐出される液体を貯留するための圧力室を有し、前記圧力室を構成する壁が伸長及び収縮することで前記吐出口から液体を吐出する液体吐出ヘッドであって、前記圧力室とは別に複数の空気室を有し、少なくとも1つの前記空気室と前記圧力室との間に圧電体が設けられた液体吐出ヘッドを備えた液体吐出装置の製造方法において、
前記圧電体に接続される接続端子及び前記接続端子から延ばされる配線を有し、前記圧力室に対応する位置に、前記圧力室の開口断面積よりも断面積が小さい貫通穴が形成された配線基板を、接着性フィルムによって、前記液体吐出ヘッドの、前記吐出口側とは反対側の接合面に接着して、前記配線基板の前記接続端子と、前記圧力室の前記壁に形成された電極とを電気的に接続し、
前記配線基板および前記液体吐出ヘッドの少なくとも一方が、前記接続端子に対向する位置に形成され、前記接続端子に当接する台座構造であって、前記接合面に平行な断面面積が前記接続端子に当接する一端側から他端側に向かって連続的に増加する形状に形成された台座構造を有することを特徴とする、液体吐出装置の製造方法。 - 前記空気室の壁に形成された電極と、前記接続端子とを電気的に接続する、請求項1に記載の液体吐出装置の製造方法。
- 前記配線基板における、前記接合面の反対側の面から前記配線を引き出すための貫通電極を有する前記配線基板を用いる、請求項1または2に記載の液体吐出装置の製造方法。
- 前記接着性フィルムによって前記液体吐出ヘッドと前記配線基板とを接合した後に、前記液体吐出ヘッド、前記配線基板及び前記接着性フィルムの少なくとも一部に、パラキシリレン系ポリマーからなる膜を成膜する、請求項1ないし3のいずれか1項に記載の液体吐出装置の製造方法。
- 前記接続端子と、前記圧力室の壁に形成された電極とを接続した後に、前記接着性フィルムによって、前記配線基板と前記液体吐出ヘッドとを接着する、請求項1ないし4のいずれか1項に記載の液体吐出装置の製造方法。
- 前記接続端子及び前記接着性フィルムによって、前記配線基板と前記液体吐出ヘッドとを接合し、接合後の前記接続端子の厚みを、前記接合後の前記接着性フィルムの厚み以下に形成する、請求項1ないし5のいずれか1項に記載の液体吐出装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013118726A JP6161411B2 (ja) | 2012-06-22 | 2013-06-05 | 液体吐出装置の製造方法 |
US14/292,092 US20140359984A1 (en) | 2012-06-22 | 2014-05-30 | Method of manufacturing liquid ejecting device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012140706 | 2012-06-22 | ||
JP2012140706 | 2012-06-22 | ||
JP2013118726A JP6161411B2 (ja) | 2012-06-22 | 2013-06-05 | 液体吐出装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014024325A JP2014024325A (ja) | 2014-02-06 |
JP6161411B2 true JP6161411B2 (ja) | 2017-07-12 |
Family
ID=50198430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013118726A Active JP6161411B2 (ja) | 2012-06-22 | 2013-06-05 | 液体吐出装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20140359984A1 (ja) |
JP (1) | JP6161411B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6322448B2 (ja) * | 2014-03-12 | 2018-05-09 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッドの製造方法、液体噴射ヘッド、及び液体噴射装置 |
KR20170094305A (ko) * | 2014-12-09 | 2017-08-17 | 세이코 엡슨 가부시키가이샤 | 압전 디바이스, 액체 분사 헤드, 압전 디바이스의 제조 방법, 및 액체 분사 헤드의 제조 방법 |
JP6409568B2 (ja) * | 2014-12-26 | 2018-10-24 | ブラザー工業株式会社 | 液体吐出装置 |
JP6407032B2 (ja) | 2015-01-08 | 2018-10-17 | キヤノン株式会社 | 液体吐出ヘッドおよび液体吐出装置 |
JP6492756B2 (ja) | 2015-02-25 | 2019-04-03 | ブラザー工業株式会社 | 液体吐出装置 |
WO2016136139A1 (en) * | 2015-02-27 | 2016-09-01 | Seiko Epson Corporation | Electronic device |
JP7053786B2 (ja) | 2017-07-26 | 2022-04-12 | ヒューレット-パッカード デベロップメント カンパニー エル.ピー. | ダイコンタクト形成物 |
JP7118716B2 (ja) | 2018-04-17 | 2022-08-16 | キヤノン株式会社 | 液体吐出ヘッド |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2647047B2 (ja) * | 1995-03-01 | 1997-08-27 | 日本電気株式会社 | 半導体素子のフリップチップ実装方法およびこの実装方法に用いられる接着剤 |
JPH08323980A (ja) * | 1995-05-30 | 1996-12-10 | Oki Data:Kk | インクジェットプリンタにおける印字ヘッドの製造方法 |
US6412896B2 (en) * | 1997-12-16 | 2002-07-02 | Brother Kogyo Kabushiki Kaisha | Ink jet apparatus, ink jet apparatus driving method, and storage medium for storing ink jet apparatus control program |
JPH11274347A (ja) * | 1998-03-19 | 1999-10-08 | Toshiba Corp | 半導体パッケージ、及びその形成方法 |
US6161270A (en) * | 1999-01-29 | 2000-12-19 | Eastman Kodak Company | Making printheads using tapecasting |
JP4078070B2 (ja) * | 2000-12-28 | 2008-04-23 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
JP2002252241A (ja) * | 2001-02-26 | 2002-09-06 | Nippon Dempa Kogyo Co Ltd | Icチップの接続方法及びこれを用いた水晶発振器 |
JP2006303408A (ja) * | 2004-09-09 | 2006-11-02 | Seiko Epson Corp | 電子装置及びその製造方法 |
JP2006270009A (ja) * | 2005-02-25 | 2006-10-05 | Seiko Epson Corp | 電子装置の製造方法 |
JP4267640B2 (ja) * | 2006-05-24 | 2009-05-27 | 東芝テック株式会社 | インクジェット記録ヘッド |
JP4997895B2 (ja) * | 2006-09-25 | 2012-08-08 | 富士通株式会社 | 半導体装置の製造方法 |
US7994638B2 (en) * | 2007-05-11 | 2011-08-09 | Panasonic Corporation | Semiconductor chip and semiconductor device |
US8029111B2 (en) * | 2007-11-05 | 2011-10-04 | Seiko Epson Corporation | Droplet ejection head and droplet ejection apparatus |
JP2009267266A (ja) * | 2008-04-28 | 2009-11-12 | Japan Electronic Materials Corp | フレキシブルプリント配線板と基板との接合方法 |
JP5304021B2 (ja) * | 2008-05-14 | 2013-10-02 | コニカミノルタ株式会社 | インクジェットヘッドの製造方法 |
JP5445755B2 (ja) * | 2009-11-11 | 2014-03-19 | セイコーエプソン株式会社 | 液滴噴射ヘッドおよびその製造方法、並びに液滴噴射装置 |
JP2011240636A (ja) * | 2010-05-19 | 2011-12-01 | Konica Minolta Holdings Inc | 液滴吐出ヘッド |
JP5440450B2 (ja) * | 2010-08-31 | 2014-03-12 | コニカミノルタ株式会社 | インクジェットヘッド、インクジェット記録装置およびインクジェットヘッドの製造方法 |
JP6128820B2 (ja) * | 2011-12-22 | 2017-05-17 | キヤノン株式会社 | 液体吐出ヘッド |
JP2013208886A (ja) * | 2012-02-29 | 2013-10-10 | Canon Inc | インクジェットヘッドの製造方法 |
JP5901444B2 (ja) * | 2012-06-22 | 2016-04-13 | キヤノン株式会社 | 液体吐出ヘッド |
JP6049321B2 (ja) * | 2012-06-22 | 2016-12-21 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP6039263B2 (ja) * | 2012-06-22 | 2016-12-07 | キヤノン株式会社 | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
JP5775045B2 (ja) * | 2012-09-24 | 2015-09-09 | 株式会社東芝 | インクジェットヘッド |
-
2013
- 2013-06-05 JP JP2013118726A patent/JP6161411B2/ja active Active
-
2014
- 2014-05-30 US US14/292,092 patent/US20140359984A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2014024325A (ja) | 2014-02-06 |
US20140359984A1 (en) | 2014-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6161411B2 (ja) | 液体吐出装置の製造方法 | |
US8322823B2 (en) | Liquid ejecting head, manufacturing method thereof, and liquid ejecting apparatus | |
JP6504348B2 (ja) | ヘッド及び液体噴射装置 | |
TW201823145A (zh) | Mems裝置、液體噴射頭、液體噴射裝置、mems裝置之製造方法、液體噴射頭之製造方法、及液體噴射裝置之製造方法 | |
JP2006012992A (ja) | 回路基板の電極接続構造 | |
JP2006019718A (ja) | 圧電アクチュエータの製造方法、圧電アクチュエータ及びインクジェットヘッド。 | |
JP6056329B2 (ja) | 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法 | |
WO2018020910A1 (ja) | インクジェットヘッド | |
JP2019147333A (ja) | 液体噴射ヘッド、液体噴射装置、及び、電子デバイス | |
JP6950709B2 (ja) | インクジェットヘッド及び画像形成装置 | |
JP2012030572A (ja) | インクジェットヘッドアセンブリー及びその製造方法 | |
JP5391975B2 (ja) | 液体吐出装置 | |
US7525236B2 (en) | Piezoelectric element unit, manufacturing method of the same, and liquid ejecting head using the same | |
US20110193915A1 (en) | Piezoelectric actuator, inkjet head including the same, and method of manufacturing piezoelectric actuator | |
JP2012218251A (ja) | 液体噴射ヘッド及び液体噴射装置 | |
JP3611782B2 (ja) | インクジェットヘッド | |
JPH11179903A (ja) | アクチュエータ及びインクジェット式記録ヘッド | |
US20100097427A1 (en) | Liquid ejecting head and liquid ejecting apparatus | |
JP6359367B2 (ja) | インクジェットヘッド | |
JP7415515B2 (ja) | インクジェットヘッド及びインクジェットヘッドの製造方法 | |
JP6269794B2 (ja) | 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法 | |
JP2002254629A (ja) | インクジェットヘッド | |
JP2021137986A (ja) | インクジェットヘッド及びインクジェットヘッドの製造方法 | |
JP4670378B2 (ja) | インクジェットヘッド | |
JPH08142324A (ja) | インクジェットヘッド及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20140430 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160602 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170228 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170428 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170516 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170613 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6161411 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |