JP6150898B2 - 基板収納容器を梱包するための梱包構造体 - Google Patents
基板収納容器を梱包するための梱包構造体 Download PDFInfo
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- JP6150898B2 JP6150898B2 JP2015542444A JP2015542444A JP6150898B2 JP 6150898 B2 JP6150898 B2 JP 6150898B2 JP 2015542444 A JP2015542444 A JP 2015542444A JP 2015542444 A JP2015542444 A JP 2015542444A JP 6150898 B2 JP6150898 B2 JP 6150898B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
- B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2 基板収納容器
3 基板収納容器収容袋(容器収容袋)
4 持上げ装置
10 梱包箱
11 上蓋
12 スリーブ部材
13 下蓋
14、14E、14F 第1装置位置決め部
16、16A 第2装置位置決め部
43、43F 第1被位置決め部
45、45A、45F 第2被位置決め部
111 天板
112 上蓋周壁
132 下蓋周壁
133、133C 下蓋脚部
142、142−1、142−2、142−3、142E、142F 規制方向一端部
143、143−1、143−2、143−3、143E、143F 規制方向他端部
144、144−1、144−2、144−3、144F、149F、164、164A
接近離間方向端部
432、432−1、432−2、432−3、432F 一端部当接部
433、433−1、433−2、433−3、433F 他端部当接部
434、434−1、434−2、434−3、434F 接近離間方向端部当接部
W 基板
Claims (8)
- 複数の基板を収納可能な基板収納空間が内部に形成され、一端部に前記基板収納空間に連通する容器本体開口部が形成された容器本体と、前記容器本体開口部に対して着脱可能であり、前記容器本体開口部を閉塞可能な蓋体とを備える基板収納容器であって、半導体ウェーハからなる基板を収納して輸送するための基板収納容器を梱包するための梱包構造体であって、
前記基板収納容器を支持する底板と前記底板の周囲から上方へ延出する下蓋周壁とを有する下蓋と、上下方向に延出する軸心を有する筒状のスリーブ部材と、天板と前記天板の周囲から下方へ延出する上蓋周壁とを有する上蓋と、を有する梱包箱を備え、
前記スリーブ部材の下端部は、前記下蓋の底板の上に載置され、前記スリーブ部材の上端部には、前記上蓋の天板が載置され、
前記下蓋は、装置位置決め部を備え、
前記装置位置決め部は、前記上蓋が取り外された状態の梱包箱の前記下蓋に支持された前記基板収納容器を、前記下蓋から持上げる持上げ装置の被位置決め部に係合可能である梱包構造体。 - 前記装置位置決め部は、前記上蓋と前記下蓋とを結ぶ方向に直交する方向であって前記下蓋に対して接近又は離間する方向である接近離間方向における接近離間方向端部と、前記上蓋と前記下蓋とを結ぶ方向及び前記接近離間方向に対して直交する方向である規制方向における規制方向一端部と規制方向他端部と、を有する請求項1に記載の梱包構造体。
- 前記装置位置決め部は、前記接近離間方向端部と前記規制方向一端部と前記規制方向他端部とを有する少なくとも1つの第1装置位置決め部と、前記第1装置位置決め部とは異なる形状を有して前記接近離間方向端部を有する少なくとも1つの第2装置位置決め部と、を有する請求項2に記載の梱包構造体。
- 前記装置位置決め部は、前記接近離間方向端部と前記規制方向一端部と前記規制方向他端部とを有する同一形状の少なくとも3つの第1装置位置決め部を有し、隣接する前記第1装置位置決め部は、全て同一の間隔で離間しているのではなく異なる間隔で離間して配置される請求項2に記載の梱包構造体。
- 前記持上げ装置の前記被位置決め部は、前記接近離間方向における端部を構成する接近離間方向端部当接部と前記規制方向における一端部を構成する一端部当接部とを有する第1被位置決め部と、前記接近離間方向端部当接部と前記規制方向における他端部を構成する他端部当接部とを有する第2被位置決め部と、を有し、
前記装置位置決め部は、前記第1被位置決め部の前記接近離間方向端部当接部及び前記第2被位置決め部の前記接近離間方向端部当接部が当接可能な前記接近離間方向端部と、前記第1被位置決め部の前記一端部当接部が当接可能な前記規制方向一端部と、前記第2被位置決め部の前記他端部当接部が当接可能な前記規制方向他端部と、を有する共通装置位置決め部を有する請求項2に記載の梱包構造体。 - 前記装置位置決め部は、前記下蓋周壁に存在する請求項1〜請求項5のいずれかに記載の梱包構造体。
- 前記下蓋は、前記底板の下面から下方へ延出する下蓋脚部を有し、
前記装置位置決め部は、前記下蓋脚部に存在する請求項1〜請求項5のいずれかに記載の梱包構造体。 - 前記梱包箱内において前記基板収納容器が載置される下部緩衝材を備える請求項1〜請求項7のいずれかに記載の梱包構造体。
Applications Claiming Priority (1)
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PCT/JP2013/078108 WO2015056317A1 (ja) | 2013-10-16 | 2013-10-16 | 基板収納容器を梱包するための梱包構造体 |
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JPWO2015056317A1 JPWO2015056317A1 (ja) | 2017-03-09 |
JP6150898B2 true JP6150898B2 (ja) | 2017-06-21 |
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Country Status (5)
Country | Link |
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US (1) | US9966288B2 (ja) |
JP (1) | JP6150898B2 (ja) |
KR (1) | KR102154304B1 (ja) |
TW (1) | TWI645493B (ja) |
WO (1) | WO2015056317A1 (ja) |
Families Citing this family (1)
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US8088163B1 (en) | 2008-02-06 | 2012-01-03 | Kleiner Jeffrey B | Tools and methods for spinal fusion |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0536820A (ja) | 1991-07-29 | 1993-02-12 | Hitachi Ltd | ウエハキヤリア収納ケース |
JP2803567B2 (ja) * | 1994-05-11 | 1998-09-24 | 信越半導体株式会社 | 半導体ウエーハ収納容器の梱包構造体 |
MY127829A (en) | 1996-05-30 | 2006-12-29 | Sony Emcs Malaysia Sdn Bhd | Mounting system. |
JP2968742B2 (ja) | 1997-01-24 | 1999-11-02 | 山形日本電気株式会社 | 自動保管棚及び自動保管方法 |
JP3880131B2 (ja) * | 1997-05-07 | 2007-02-14 | 信越ポリマー株式会社 | 基板収納容器 |
JP4193472B2 (ja) * | 2002-11-15 | 2008-12-10 | 株式会社カネカ | ウェーハ容器緩衝体 |
JP4335608B2 (ja) | 2003-08-14 | 2009-09-30 | Hoya株式会社 | 基板保持ケース及び基板搬送システム |
JP2008222263A (ja) * | 2007-03-12 | 2008-09-25 | Takahisa Watanabe | 包装装置 |
KR20090028973A (ko) * | 2007-09-17 | 2009-03-20 | 하현주 | 반도체 기판 이송용 캐리어 박스 |
JP2009107703A (ja) | 2007-10-31 | 2009-05-21 | Kawakami Sangyo Co Ltd | 輸送用容器 |
JP5103596B2 (ja) | 2008-10-17 | 2012-12-19 | 平田機工株式会社 | 基板収容容器およびその位置決め構造 |
JP4720932B2 (ja) * | 2009-02-10 | 2011-07-13 | ムラテックオートメーション株式会社 | 移載装置 |
JP2010208642A (ja) * | 2009-03-06 | 2010-09-24 | Takahisa Watanabe | 包装装置 |
JP2012164720A (ja) | 2011-02-04 | 2012-08-30 | Shin Etsu Polymer Co Ltd | 輸送箱 |
-
2013
- 2013-10-16 US US15/028,537 patent/US9966288B2/en active Active
- 2013-10-16 JP JP2015542444A patent/JP6150898B2/ja active Active
- 2013-10-16 WO PCT/JP2013/078108 patent/WO2015056317A1/ja active Application Filing
- 2013-10-16 KR KR1020167005634A patent/KR102154304B1/ko active IP Right Grant
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2014
- 2014-10-08 TW TW103135036A patent/TWI645493B/zh active
Also Published As
Publication number | Publication date |
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KR20160072092A (ko) | 2016-06-22 |
US20160233119A1 (en) | 2016-08-11 |
KR102154304B1 (ko) | 2020-09-09 |
TWI645493B (zh) | 2018-12-21 |
US9966288B2 (en) | 2018-05-08 |
WO2015056317A1 (ja) | 2015-04-23 |
JPWO2015056317A1 (ja) | 2017-03-09 |
TW201517198A (zh) | 2015-05-01 |
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