JP6137616B2 - フレキシブル基板 - Google Patents
フレキシブル基板 Download PDFInfo
- Publication number
- JP6137616B2 JP6137616B2 JP2013114537A JP2013114537A JP6137616B2 JP 6137616 B2 JP6137616 B2 JP 6137616B2 JP 2013114537 A JP2013114537 A JP 2013114537A JP 2013114537 A JP2013114537 A JP 2013114537A JP 6137616 B2 JP6137616 B2 JP 6137616B2
- Authority
- JP
- Japan
- Prior art keywords
- line
- signal line
- ground pattern
- flexible substrate
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 54
- 238000000926 separation method Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 7
- 239000010931 gold Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000012212 insulator Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Description
12、16 信号線路
14 接続線路
18 分岐線路
20、22、24、26 グランドパターン
28 ビア金属
30 リードピン
Claims (4)
- 第1面と前記第1面に対向する第2面とを有する絶縁基板と、
前記第1面に設けられた第1信号線路と、前記第1信号線路に対向する領域の前記第2面に設けられた第1グランドパターンと、を有するマイクロストリップ線路と、
前記第1面に設けられ、前記第1信号線路より幅の大きい第2信号線路と、その両側の前記第1面に離間して設けられた第2グランドパターンと、を有するコプレーナ線路と、
前記第1面に設けられ、前記第1信号線路と前記第2信号線路とを接続する接続線路と、
前記接続線路に設けられた開口部と、
を具備することを特徴とするフレキシブル基板。 - 前記第2面における、前記接続線路に対向する領域を除いて、その両側の辺に沿った領域に設けられた第3グランドパターンと、
前記第2面における、前記第2グランドパターンに対向した領域に設けられ、前記第3グランドパターンと接続する第4グランドパターンと、
を具備し、
前記第2面における前記第2信号線路に対向した領域と前記第4グランドパターンとの距離は、前記第2信号線路と前記第2グランドパターンとの離間距離より大きい、請求項1に記載のフレキシブル基板。 - 前記接続線路の幅は、前記第1信号線路側から前記第2信号線路側に向かって連続的に大きくなり、前記開口の幅は、前記第1信号線路側から前記第2信号線路側に向かって連続的に大きくなる、請求項1または2に記載のフレキシブル基板。
- 前記接続線路は、前記開口部により分岐された複数の分岐線路によって構成されてなり、前記分岐線路の1つは、前記第1信号線路と実質的に同じ幅で一直線上に配置されてなる、請求項1から3のいずれか一項に記載のフレキシブル基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013114537A JP6137616B2 (ja) | 2012-07-04 | 2013-05-30 | フレキシブル基板 |
US13/935,132 US9270001B2 (en) | 2012-07-04 | 2013-07-03 | Flexible circuit board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012150848 | 2012-07-04 | ||
JP2012150848 | 2012-07-04 | ||
JP2013114537A JP6137616B2 (ja) | 2012-07-04 | 2013-05-30 | フレキシブル基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014029987A JP2014029987A (ja) | 2014-02-13 |
JP2014029987A5 JP2014029987A5 (ja) | 2016-07-14 |
JP6137616B2 true JP6137616B2 (ja) | 2017-05-31 |
Family
ID=49670362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013114537A Active JP6137616B2 (ja) | 2012-07-04 | 2013-05-30 | フレキシブル基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9270001B2 (ja) |
JP (1) | JP6137616B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6137616B2 (ja) * | 2012-07-04 | 2017-05-31 | 住友電工デバイス・イノベーション株式会社 | フレキシブル基板 |
JP6398382B2 (ja) * | 2014-06-30 | 2018-10-03 | 住友大阪セメント株式会社 | 光デバイス |
JP6281428B2 (ja) | 2014-07-11 | 2018-02-21 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール及び送信装置 |
JP2017004988A (ja) * | 2015-06-04 | 2017-01-05 | 日本電信電話株式会社 | フレキシブル基板 |
CN108877545B (zh) * | 2018-06-29 | 2020-12-22 | 上海天马有机发光显示技术有限公司 | 显示装置 |
US20230115731A1 (en) * | 2021-10-13 | 2023-04-13 | Electronics And Telecommunications Research Institute | Optical submodule |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253947A (ja) * | 2003-02-19 | 2004-09-09 | Nippon Telegr & Teleph Corp <Ntt> | インピーダンス変換回路 |
JP5580994B2 (ja) * | 2009-02-20 | 2014-08-27 | 日本オクラロ株式会社 | 光モジュール |
EP2403055B1 (en) * | 2009-02-27 | 2019-11-06 | Mitsubishi Electric Corporation | Waveguide-microstrip line converter |
JP5563890B2 (ja) | 2010-05-13 | 2014-07-30 | 住友電気工業株式会社 | フレキシブル配線板 |
JP5707879B2 (ja) * | 2010-11-10 | 2015-04-30 | 富士通オプティカルコンポーネンツ株式会社 | 光送信器及び中継基板 |
JP5652145B2 (ja) * | 2010-11-15 | 2015-01-14 | 富士通オプティカルコンポーネンツ株式会社 | 通信デバイス |
JP2013157592A (ja) * | 2012-01-05 | 2013-08-15 | Canon Components Inc | 発光素子実装用フレキシブル回路基板 |
US9256773B2 (en) * | 2011-07-27 | 2016-02-09 | Féinics Amatech Teoranta | Capacitive coupling of an RFID tag with a touch screen device acting as a reader |
JP2014240998A (ja) * | 2011-10-07 | 2014-12-25 | シャープ株式会社 | タッチパネルおよびタッチパネル付き表示装置、ならびにタッチパネルの製造方法 |
JP6137616B2 (ja) * | 2012-07-04 | 2017-05-31 | 住友電工デバイス・イノベーション株式会社 | フレキシブル基板 |
JP6301056B2 (ja) * | 2012-12-21 | 2018-03-28 | 三菱電機株式会社 | 電子機器 |
US9252375B2 (en) * | 2013-03-15 | 2016-02-02 | LuxVue Technology Corporation | Method of fabricating a light emitting diode display with integrated defect detection test |
-
2013
- 2013-05-30 JP JP2013114537A patent/JP6137616B2/ja active Active
- 2013-07-03 US US13/935,132 patent/US9270001B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20140254992A9 (en) | 2014-09-11 |
JP2014029987A (ja) | 2014-02-13 |
US9270001B2 (en) | 2016-02-23 |
US20130322833A1 (en) | 2013-12-05 |
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