JP6876942B2 - 回路基板 - Google Patents
回路基板 Download PDFInfo
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- JP6876942B2 JP6876942B2 JP2017054619A JP2017054619A JP6876942B2 JP 6876942 B2 JP6876942 B2 JP 6876942B2 JP 2017054619 A JP2017054619 A JP 2017054619A JP 2017054619 A JP2017054619 A JP 2017054619A JP 6876942 B2 JP6876942 B2 JP 6876942B2
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- 239000004020 conductor Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 description 23
- 230000005672 electromagnetic field Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Description
まず、第1欄にて、用語の定義を行う。
各図において、L軸、W軸およびT軸は互いに直交しており、回路基板1,5における長さ方向、幅方向および厚さ方向を示す。なお、長さ方向、幅方向および厚さ方向は、必要に応じて、縦方向、横方向および上下方向という場合がある。また、長さ方向は第一方向または第三方向の例示であり、高さ方向は第二方向の例示である。
以下の第2欄では、図1〜図5を参照して、本開示の回路基板1に本件発明者が至った経緯について説明する。
上記考察の結果、本件発明者は、図1、図2Aおよび図6に示すような回路基板1を想到するに至った。以下の第3欄では、これら図面に加え、図7〜図9を参照して、本開示の回路基板1を詳説する。
また、第二給電線路19もまた層間に設けられても良い。
本件発明者は、上記構造の回路基板1に対しても三次元電磁界解析を行った。三次元電磁界解析の条件は、第2欄に記載と同様である。
上記の通り、本開示の回路基板1は、複数の放射素子15に近接し、L軸方向に延在する第一給電線路13をまず備える。また、回路基板1は、T軸方向に延在し、第一給電線路13のL軸方向におけるランドL1と、自身の一方端にて接続される第一接続導体17を備える。回路基板1はさらに、W軸方向に延在し、第一接続導体17の他方端(ランドL5)と接続される第一線路部191と、第一線路部191から分岐し、かつL軸方向側から他方端(ランドL5)と接続する第二線路部193を有する第二給電線路19を備える。この構成により、使用周波数帯付近の広帯域にわたって第一供給線路13の部分13a,13bに分配される電力差を抑制することが可能となると共に、導波管を使う必要が無くなるため、安価に構成可能な回路基板1を提供することが出来る。
13 第一給電線路
15 放射素子
17 第一接続導体
19 第二給電線路
191 第一線路部
193 第二線路部
195 スタブ
111 グランド層
Claims (10)
- 基板と、
前記基板の表面に設けられた複数の放射素子に近接し、第一方向に延在する第一給電線路と、
前記第一方向と直交する第二方向に延在する第一接続導体であって、前記第一給電線路の前記第一方向における略中央部分と、自身の一方端にて接続される第一接続導体と、
前記第二方向と直交する第三方向に延在して前記第一接続導体の他方端と接続される第一線路部と、前記第一線路部から分岐し、かつ前記第三方向側から前記他方端と接続する第二線路部と、を有する第二給電線路と、
を備えた回路基板。 - 前記第二線路部の線路長は、前記第一線路部に供給される交流電流の実効波長の整数倍に基づき定められる、
請求項1に記載の回路基板。 - 前記第一線路部に供給される交流電流の実効波がミリ波帯である場合、前記基板の前記第二方向における厚さが、前記交流電流の実効波長の1/2以上である、
をさらに備えた請求項1に記載の回路基板。 - 少なくとも前記第一給電線路および前記第二給電線路における第一線路部は線状導体である、
請求項1に記載の回路基板。 - 前記第一線路部と前記第二線路部とのノードから前記実効波長の1/2以内の距離だけ離れた位置であって、前記第一線路部に設けられたスタブ、
をさらに備えた請求項2に記載の回路基板。 - グランド層、
をさらに備えた請求項1に記載の回路基板。 - 前記第一方向および前記第三方向は実質的に同方向である、
請求項1に記載の回路基板。 - 前記第一接続導体はスルーホールめっきで作製される、
請求項1に記載の回路基板。 - 前記第二線路部の線幅は前記第一線路部の線幅よりも広い、
請求項1に記載の回路基板。 - 前記第一接続導体で結合される第一給電線路および第二給電線路の双方に垂直な面に対し対称形状を有する配線層および第二接続導体を含む、
請求項1に記載の回路基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017054619A JP6876942B2 (ja) | 2017-03-21 | 2017-03-21 | 回路基板 |
US15/920,508 US10575396B2 (en) | 2017-03-21 | 2018-03-14 | Circuit board |
EP18162164.0A EP3379905A1 (en) | 2017-03-21 | 2018-03-16 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017054619A JP6876942B2 (ja) | 2017-03-21 | 2017-03-21 | 回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018157500A JP2018157500A (ja) | 2018-10-04 |
JP6876942B2 true JP6876942B2 (ja) | 2021-05-26 |
Family
ID=61691685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017054619A Active JP6876942B2 (ja) | 2017-03-21 | 2017-03-21 | 回路基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10575396B2 (ja) |
EP (1) | EP3379905A1 (ja) |
JP (1) | JP6876942B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10595411B2 (en) * | 2017-05-10 | 2020-03-17 | Power Wave Electronics Co., Ltd. | Method for manufacturing chip signal elements |
KR102362243B1 (ko) * | 2017-10-18 | 2022-02-11 | 삼성전자주식회사 | Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치 |
CN112512208A (zh) | 2019-09-16 | 2021-03-16 | 中兴通讯股份有限公司 | 一种电路板 |
EP4118711A1 (en) * | 2020-04-07 | 2023-01-18 | Huawei Technologies Co., Ltd. | Microstrip antenna device with center-fed antenna arrays |
TWI752780B (zh) * | 2020-12-31 | 2022-01-11 | 啓碁科技股份有限公司 | 寬波束之天線結構 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4200684B2 (ja) | 1998-12-24 | 2008-12-24 | 株式会社豊田中央研究所 | 導波管・伝送線路変換器 |
WO2007123494A1 (en) * | 2006-04-24 | 2007-11-01 | Agency For Science, Technology And Research | Array antenna for wireless communication and method |
US7675466B2 (en) * | 2007-07-02 | 2010-03-09 | International Business Machines Corporation | Antenna array feed line structures for millimeter wave applications |
KR101982028B1 (ko) * | 2012-09-21 | 2019-05-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 편파 공용 안테나 |
JP6339319B2 (ja) * | 2013-04-16 | 2018-06-06 | 日本ピラー工業株式会社 | マイクロストリップアンテナ及び携帯型端末 |
JP6470930B2 (ja) * | 2014-09-16 | 2019-02-13 | 日本ピラー工業株式会社 | 分配器及び平面アンテナ |
JP2018007107A (ja) * | 2016-07-05 | 2018-01-11 | パナソニックIpマネジメント株式会社 | アンテナ装置 |
-
2017
- 2017-03-21 JP JP2017054619A patent/JP6876942B2/ja active Active
-
2018
- 2018-03-14 US US15/920,508 patent/US10575396B2/en active Active
- 2018-03-16 EP EP18162164.0A patent/EP3379905A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20180279466A1 (en) | 2018-09-27 |
EP3379905A1 (en) | 2018-09-26 |
US10575396B2 (en) | 2020-02-25 |
JP2018157500A (ja) | 2018-10-04 |
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