JP6133888B2 - その場でのメトロロジ用に構成された反応チャンバを有する堆積システムおよび関連の方法 - Google Patents

その場でのメトロロジ用に構成された反応チャンバを有する堆積システムおよび関連の方法 Download PDF

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Publication number
JP6133888B2
JP6133888B2 JP2014546661A JP2014546661A JP6133888B2 JP 6133888 B2 JP6133888 B2 JP 6133888B2 JP 2014546661 A JP2014546661 A JP 2014546661A JP 2014546661 A JP2014546661 A JP 2014546661A JP 6133888 B2 JP6133888 B2 JP 6133888B2
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Prior art keywords
reaction chamber
thermal radiation
impermeable
impermeable material
volume
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JP2014546661A
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English (en)
Japanese (ja)
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JP2015502055A (ja
Inventor
リンドウ エド
リンドウ エド
バートラム ロナルド
バートラム ロナルド
カニサレス クラウディオ
カニサレス クラウディオ
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Soitec SA
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Soitec SA
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Priority claimed from US13/327,302 external-priority patent/US20130052333A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C23C16/303—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
JP2014546661A 2011-12-15 2012-11-12 その場でのメトロロジ用に構成された反応チャンバを有する堆積システムおよび関連の方法 Expired - Fee Related JP6133888B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US13/327,302 2011-12-15
US13/327,302 US20130052333A1 (en) 2011-08-22 2011-12-15 Deposition systems having reaction chambers configured for in-situ metrology and related methods
FR1162463 2011-12-27
FR1162463A FR2984923B1 (fr) 2011-12-27 2011-12-27 Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes
PCT/IB2012/002388 WO2013088213A1 (en) 2011-12-15 2012-11-12 Deposition system having a reaction chamber configured for in situ metrology and related method

Publications (2)

Publication Number Publication Date
JP2015502055A JP2015502055A (ja) 2015-01-19
JP6133888B2 true JP6133888B2 (ja) 2017-05-24

Family

ID=45815784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014546661A Expired - Fee Related JP6133888B2 (ja) 2011-12-15 2012-11-12 その場でのメトロロジ用に構成された反応チャンバを有する堆積システムおよび関連の方法

Country Status (8)

Country Link
JP (1) JP6133888B2 (zh)
KR (1) KR20140103291A (zh)
CN (1) CN103987877B (zh)
DE (1) DE112012005276T5 (zh)
FR (1) FR2984923B1 (zh)
SG (1) SG11201402877YA (zh)
TW (1) TWI570285B (zh)
WO (1) WO2013088213A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812342B2 (en) * 2015-12-08 2017-11-07 Watlow Electric Manufacturing Company Reduced wire count heater array block

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01268120A (ja) * 1988-04-20 1989-10-25 Fujitsu Ltd 半導体装置用ウェハの温度測定方法
GB2238868A (en) * 1989-11-22 1991-06-12 Res Corp Technologies Inc Silicon wafer temperature measurement by optical transmission monitoring.
JP3058658B2 (ja) * 1990-06-21 2000-07-04 国際電気株式会社 半導体製造装置
JPH062147A (ja) * 1992-06-16 1994-01-11 Babcock Hitachi Kk 気相化学反応装置
JP2884556B2 (ja) * 1994-06-10 1999-04-19 信越石英株式会社 枚葉式ウェーハ熱処理装置
JPH0897167A (ja) * 1994-09-28 1996-04-12 Tokyo Electron Ltd 処理装置及び熱処理装置
JP3011866B2 (ja) * 1994-11-30 2000-02-21 信越石英株式会社 枚葉式ウエーハ熱処理装置
JP3218164B2 (ja) * 1995-05-31 2001-10-15 東京エレクトロン株式会社 被処理体の支持ボート、熱処理装置及び熱処理方法
JP3551609B2 (ja) * 1996-02-23 2004-08-11 東京エレクトロン株式会社 熱処理装置
WO1999049101A1 (en) * 1998-03-23 1999-09-30 Mattson Technology, Inc. Apparatus and method for cvd and thermal processing of semiconductor substrates
US6179913B1 (en) 1999-04-16 2001-01-30 Cbl Technologies, Inc. Compound gas injection system and methods
WO2005017988A1 (ja) * 2003-08-15 2005-02-24 Hitachi Kokusai Electric Inc. 基板処理装置および半導体デバイスの製造方法
JP2007005399A (ja) * 2005-06-21 2007-01-11 Hitachi Kokusai Electric Inc 基板処理装置
KR101330156B1 (ko) * 2006-11-22 2013-12-20 소이텍 삼염화 갈륨 주입 구조
US8382898B2 (en) 2006-11-22 2013-02-26 Soitec Methods for high volume manufacture of group III-V semiconductor materials
CN101911253B (zh) * 2008-01-31 2012-08-22 应用材料公司 闭环mocvd沉积控制
WO2009108221A2 (en) * 2008-02-27 2009-09-03 S.O.I.Tec Silicon On Insulator Technologies Thermalization of gaseous precursors in cvd reactors
CN102047387B (zh) * 2008-06-30 2012-07-04 S.O.I.Tec绝缘体上硅技术公司 模块化的cvd反应器子系统、其配置方法和独立功能模块
KR101324303B1 (ko) * 2008-08-28 2013-10-30 소이텍 클로라이드 가스 흐름의 ｕｖ 흡수기반의 모니터 및 제어

Also Published As

Publication number Publication date
WO2013088213A1 (en) 2013-06-20
KR20140103291A (ko) 2014-08-26
TWI570285B (zh) 2017-02-11
DE112012005276T5 (de) 2014-10-09
TW201323670A (zh) 2013-06-16
SG11201402877YA (en) 2014-07-30
FR2984923B1 (fr) 2014-11-07
CN103987877A (zh) 2014-08-13
FR2984923A1 (fr) 2013-06-28
JP2015502055A (ja) 2015-01-19
CN103987877B (zh) 2016-08-17

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