JP6133879B2 - 相変化を生じる体積減少材を用いて電子部品を封止する方法および装置 - Google Patents

相変化を生じる体積減少材を用いて電子部品を封止する方法および装置 Download PDF

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Publication number
JP6133879B2
JP6133879B2 JP2014537018A JP2014537018A JP6133879B2 JP 6133879 B2 JP6133879 B2 JP 6133879B2 JP 2014537018 A JP2014537018 A JP 2014537018A JP 2014537018 A JP2014537018 A JP 2014537018A JP 6133879 B2 JP6133879 B2 JP 6133879B2
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JP
Japan
Prior art keywords
mold cavity
sealing
volume reducing
volume
reducing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014537018A
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English (en)
Japanese (ja)
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JP2014530510A (ja
Inventor
レオナルダス ユリアン ゼイル，ヨハネス
レオナルダス ユリアン ゼイル，ヨハネス
ヘラルダス ヨセフ ハル，ウィルヘルムス
ヘラルダス ヨセフ ハル，ウィルヘルムス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Netherlands BV
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Besi Netherlands BV
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Publication date
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Publication of JP2014530510A publication Critical patent/JP2014530510A/ja
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Publication of JP6133879B2 publication Critical patent/JP6133879B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1701—Component parts, details or accessories; Auxiliary operations using a particular environment during moulding, e.g. moisture-free or dust-free
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/005—Using a particular environment, e.g. sterile fluids other than air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2014537018A 2011-10-18 2012-10-18 相変化を生じる体積減少材を用いて電子部品を封止する方法および装置 Expired - Fee Related JP6133879B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2007614A NL2007614C2 (nl) 2011-10-18 2011-10-18 Werkwijze en inrichting voor het met behulp van een reductie-materiaal dat een faseovergang ondergaat omhullen van elektronische componenten.
NL2007614 2011-10-18
PCT/NL2012/050724 WO2013066162A1 (en) 2011-10-18 2012-10-18 Method and device for encapsulating electronic components using a reduction material which undergoes a phase change

Publications (2)

Publication Number Publication Date
JP2014530510A JP2014530510A (ja) 2014-11-17
JP6133879B2 true JP6133879B2 (ja) 2017-05-24

Family

ID=47116232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014537018A Expired - Fee Related JP6133879B2 (ja) 2011-10-18 2012-10-18 相変化を生じる体積減少材を用いて電子部品を封止する方法および装置

Country Status (9)

Country Link
JP (1) JP6133879B2 (ko)
KR (1) KR102017672B1 (ko)
CN (1) CN103874569B (ko)
DE (1) DE112012004392B4 (ko)
GB (1) GB2516148B (ko)
MY (1) MY165079A (ko)
NL (1) NL2007614C2 (ko)
SG (1) SG2014011431A (ko)
WO (1) WO2013066162A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2016011B1 (en) * 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
DE102017216711A1 (de) * 2017-09-21 2019-03-21 Robert Bosch Gmbh Vorrichtung und Verfahren zur Herstellung von mit einer Gießmasse zumindest bereichsweise überdeckten Bauelementen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1554851A1 (de) * 1966-04-16 1970-01-22 Phoenix Gummiwerke Ag Verfahren zum Einspritzen einer plastischen Kautschuk- oder Kunststoffmischung in eine Hohlform
JPS6297812A (ja) * 1985-10-23 1987-05-07 Mitsubishi Electric Corp 樹脂成形方法
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
DE4427309C2 (de) 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
JP3407987B2 (ja) * 1994-08-18 2003-05-19 Ｔｏｗａ株式会社 樹脂封止成形用金型の保管方法及び電子部品の樹脂封止成形方法
JP3569224B2 (ja) * 2000-12-11 2004-09-22 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
JP2006198813A (ja) * 2005-01-18 2006-08-03 Hitachi Chem Co Ltd 封止成形方法及び封止成形装置
JP2009099680A (ja) * 2007-10-15 2009-05-07 Panasonic Corp 光学デバイスおよびその製造方法
NL2003792C2 (nl) * 2009-07-17 2011-01-18 Fico Bv Werkwijze en inrichting voor het met gecontroleerde gasdruk omhullen van elektronische componenten.

Also Published As

Publication number Publication date
NL2007614C2 (nl) 2013-04-22
CN103874569A (zh) 2014-06-18
CN103874569B (zh) 2017-02-15
GB2516148B (en) 2016-10-26
DE112012004392B4 (de) 2021-10-28
DE112012004392T5 (de) 2014-07-10
WO2013066162A1 (en) 2013-05-10
GB201407324D0 (en) 2014-06-11
SG2014011431A (en) 2014-06-27
JP2014530510A (ja) 2014-11-17
MY165079A (en) 2018-02-28
KR20140079453A (ko) 2014-06-26
KR102017672B1 (ko) 2019-09-03
GB2516148A (en) 2015-01-14

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