CN103874569B - 用于使用经历相变的还原材料来封装电子元件的方法和设备 - Google Patents
用于使用经历相变的还原材料来封装电子元件的方法和设备 Download PDFInfo
- Publication number
- CN103874569B CN103874569B CN201280050764.0A CN201280050764A CN103874569B CN 103874569 B CN103874569 B CN 103874569B CN 201280050764 A CN201280050764 A CN 201280050764A CN 103874569 B CN103874569 B CN 103874569B
- Authority
- CN
- China
- Prior art keywords
- molding cavity
- reducing material
- carrier
- encapsulating material
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 227
- 238000000034 method Methods 0.000 title claims abstract description 50
- 230000009467 reduction Effects 0.000 title abstract description 9
- 230000008859 change Effects 0.000 title abstract description 3
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 238000000465 moulding Methods 0.000 claims description 100
- 238000005538 encapsulation Methods 0.000 claims description 36
- 239000010409 thin film Substances 0.000 claims description 27
- 239000012071 phase Substances 0.000 claims description 22
- 239000010408 film Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 230000009466 transformation Effects 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000007791 liquid phase Substances 0.000 claims description 5
- 239000007790 solid phase Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 230000008901 benefit Effects 0.000 description 9
- 239000003570 air Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000010813 municipal solid waste Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1701—Component parts, details or accessories; Auxiliary operations using a particular environment during moulding, e.g. moisture-free or dust-free
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/005—Using a particular environment, e.g. sterile fluids other than air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2007614A NL2007614C2 (nl) | 2011-10-18 | 2011-10-18 | Werkwijze en inrichting voor het met behulp van een reductie-materiaal dat een faseovergang ondergaat omhullen van elektronische componenten. |
| NL2007614 | 2011-10-18 | ||
| PCT/NL2012/050724 WO2013066162A1 (en) | 2011-10-18 | 2012-10-18 | Method and device for encapsulating electronic components using a reduction material which undergoes a phase change |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103874569A CN103874569A (zh) | 2014-06-18 |
| CN103874569B true CN103874569B (zh) | 2017-02-15 |
Family
ID=47116232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280050764.0A Expired - Fee Related CN103874569B (zh) | 2011-10-18 | 2012-10-18 | 用于使用经历相变的还原材料来封装电子元件的方法和设备 |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JP6133879B2 (ko) |
| KR (1) | KR102017672B1 (ko) |
| CN (1) | CN103874569B (ko) |
| DE (1) | DE112012004392B4 (ko) |
| GB (1) | GB2516148B (ko) |
| MY (1) | MY165079A (ko) |
| NL (1) | NL2007614C2 (ko) |
| SG (1) | SG2014011431A (ko) |
| WO (1) | WO2013066162A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2016011B1 (en) * | 2015-12-23 | 2017-07-03 | Besi Netherlands Bv | Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators. |
| DE102017216711A1 (de) * | 2017-09-21 | 2019-03-21 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Herstellung von mit einer Gießmasse zumindest bereichsweise überdeckten Bauelementen |
| DE102023200536A1 (de) | 2023-01-24 | 2024-07-25 | BSH Hausgeräte GmbH | Verfahren zum spezifischen Spritzgießen von Haushaltsgeräte-Kunststoffbauteilen, sowie Spritzgießmaschine |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1554851A1 (de) * | 1966-04-16 | 1970-01-22 | Phoenix Gummiwerke Ag | Verfahren zum Einspritzen einer plastischen Kautschuk- oder Kunststoffmischung in eine Hohlform |
| JPS6297812A (ja) * | 1985-10-23 | 1987-05-07 | Mitsubishi Electric Corp | 樹脂成形方法 |
| NL9400119A (nl) | 1994-01-27 | 1995-09-01 | 3P Licensing Bv | Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze. |
| DE4427309C2 (de) | 1994-08-02 | 1999-12-02 | Ibm | Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten |
| JP3407987B2 (ja) * | 1994-08-18 | 2003-05-19 | Ｔｏｗａ株式会社 | 樹脂封止成形用金型の保管方法及び電子部品の樹脂封止成形方法 |
| JP3569224B2 (ja) * | 2000-12-11 | 2004-09-22 | アピックヤマダ株式会社 | 樹脂封止方法及び樹脂封止装置 |
| US6770236B2 (en) * | 2000-08-22 | 2004-08-03 | Apic Yamada Corp. | Method of resin molding |
| JP2006198813A (ja) * | 2005-01-18 | 2006-08-03 | Hitachi Chem Co Ltd | 封止成形方法及び封止成形装置 |
| JP2009099680A (ja) * | 2007-10-15 | 2009-05-07 | Panasonic Corp | 光学デバイスおよびその製造方法 |
| NL2003792C2 (nl) * | 2009-07-17 | 2011-01-18 | Fico Bv | Werkwijze en inrichting voor het met gecontroleerde gasdruk omhullen van elektronische componenten. |
-
2011
- 2011-10-18 NL NL2007614A patent/NL2007614C2/nl not_active IP Right Cessation
-
2012
- 2012-10-18 SG SG2014011431A patent/SG2014011431A/en unknown
- 2012-10-18 JP JP2014537018A patent/JP6133879B2/ja not_active Expired - Fee Related
- 2012-10-18 MY MYPI2014000972A patent/MY165079A/en unknown
- 2012-10-18 WO PCT/NL2012/050724 patent/WO2013066162A1/en active Application Filing
- 2012-10-18 DE DE112012004392.8T patent/DE112012004392B4/de active Active
- 2012-10-18 KR KR1020147012095A patent/KR102017672B1/ko active IP Right Grant
- 2012-10-18 GB GB1407324.1A patent/GB2516148B/en not_active Expired - Fee Related
- 2012-10-18 CN CN201280050764.0A patent/CN103874569B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014530510A (ja) | 2014-11-17 |
| WO2013066162A1 (en) | 2013-05-10 |
| JP6133879B2 (ja) | 2017-05-24 |
| KR20140079453A (ko) | 2014-06-26 |
| GB2516148A (en) | 2015-01-14 |
| GB2516148B (en) | 2016-10-26 |
| MY165079A (en) | 2018-02-28 |
| DE112012004392T5 (de) | 2014-07-10 |
| DE112012004392B4 (de) | 2021-10-28 |
| GB201407324D0 (en) | 2014-06-11 |
| NL2007614C2 (nl) | 2013-04-22 |
| SG2014011431A (en) | 2014-06-27 |
| CN103874569A (zh) | 2014-06-18 |
| KR102017672B1 (ko) | 2019-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2524955B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| CN103874569B (zh) | 用于使用经历相变的还原材料来封装电子元件的方法和设备 | |
| WO2008062301A8 (en) | A method for manufacturing pouches of cohesionless material | |
| US8394308B2 (en) | Mold method | |
| KR19990068067A (ko) | 반도체 장치용 수지 실링 방법 및 장치 | |
| US20110169195A1 (en) | Molding apparatus and molding method | |
| WO2006008164A3 (de) | Spritzgiessmaschine und verfahren zum spritzgiessen | |
| US20090115098A1 (en) | Mould Part and Method for Encapsulating Electronic Components | |
| US20080143008A1 (en) | Molding apparatus and molding process | |
| CN102548729A (zh) | 利用受控气压封装电子元件的方法和设备 | |
| JP3569224B2 (ja) | 樹脂封止方法及び樹脂封止装置 | |
| JP6779209B2 (ja) | 電子部品を有するキャリアのオーバーモールド制御用の金型、成形装置および方法ならびに成形品 | |
| JPH09117931A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| SE0601469L (sv) | Metod och anordning för att formspruta del av förpackningsbehållare | |
| CN107107398B (zh) | 树脂成形装置 | |
| US4826931A (en) | Tablet for resin-molding semiconductor devices | |
| JP3704461B2 (ja) | 樹脂封止方法及び樹脂封止装置 | |
| TW201622943A (zh) | 一種注塑機的自動進料加熱裝置及其方法 | |
| EP0943544A1 (en) | A preforming device for machines that make and package pods containing products for infusion | |
| JP3581759B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| FR2962110A1 (fr) | Machine a emballer sous vide de type vertical | |
| JP3751325B2 (ja) | 電子部品の樹脂封止成形方法 | |
| JPH10189630A (ja) | 電子部品の樹脂封止成形方法 | |
| CN210436526U (zh) | 一种避免模具未充分填充的注塑模具 | |
| CN110544637B (zh) | 一种半导体器件模封方法及用于该模封方法的封装模具 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170215 Termination date: 20211018 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |