JP6129497B2 - 連続メッキ装置 - Google Patents

連続メッキ装置 Download PDF

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Publication number
JP6129497B2
JP6129497B2 JP2012190977A JP2012190977A JP6129497B2 JP 6129497 B2 JP6129497 B2 JP 6129497B2 JP 2012190977 A JP2012190977 A JP 2012190977A JP 2012190977 A JP2012190977 A JP 2012190977A JP 6129497 B2 JP6129497 B2 JP 6129497B2
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Japan
Prior art keywords
nozzles
workpiece
plating
nozzle
electrode
Prior art date
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JP2012190977A
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English (en)
Japanese (ja)
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JP2013082996A (ja
Inventor
仁志 薄田
仁志 薄田
朝裕 野田
朝裕 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Almex Pe Inc
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Almex Pe Inc
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Publication date
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Priority to JP2012190977A priority Critical patent/JP6129497B2/ja
Publication of JP2013082996A publication Critical patent/JP2013082996A/ja
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Publication of JP6129497B2 publication Critical patent/JP6129497B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2012190977A 2011-09-29 2012-08-31 連続メッキ装置 Active JP6129497B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012190977A JP6129497B2 (ja) 2011-09-29 2012-08-31 連続メッキ装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011214302 2011-09-29
JP2011214302 2011-09-29
JP2012190977A JP6129497B2 (ja) 2011-09-29 2012-08-31 連続メッキ装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017078949A Division JP6342543B2 (ja) 2011-09-29 2017-04-12 連続メッキ装置

Publications (2)

Publication Number Publication Date
JP2013082996A JP2013082996A (ja) 2013-05-09
JP6129497B2 true JP6129497B2 (ja) 2017-05-17

Family

ID=47878725

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012190977A Active JP6129497B2 (ja) 2011-09-29 2012-08-31 連続メッキ装置
JP2017078949A Active JP6342543B2 (ja) 2011-09-29 2017-04-12 連続メッキ装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017078949A Active JP6342543B2 (ja) 2011-09-29 2017-04-12 連続メッキ装置

Country Status (5)

Country Link
JP (2) JP6129497B2 (zh)
KR (1) KR101461213B1 (zh)
CN (1) CN103031587B (zh)
DE (1) DE102012018394A1 (zh)
TW (1) TWI489009B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102245402B1 (ko) 2020-01-21 2021-04-28 주식회사 우리선테크 인쇄회로기판 도금장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI530593B (zh) * 2014-08-11 2016-04-21 亞智科技股份有限公司 多陽極控制裝置及具有該裝置的電鍍設備
JP2016089186A (ja) * 2014-10-30 2016-05-23 京セラサーキットソリューションズ株式会社 電解めっき装置
JP6496015B2 (ja) * 2015-05-08 2019-04-03 株式会社日立製作所 湿式表面処理装置
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
KR101593378B1 (ko) * 2015-10-23 2016-02-12 선호경 Pcb 도금액 분사장치
MY197368A (en) * 2016-09-29 2023-06-14 Almex Pe Inc Workpiece holding jig and surface treatment apparatus
CN113584563A (zh) * 2021-08-20 2021-11-02 葛小家 一种印刷电路板用电镀装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4378281A (en) 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
JPS58177487A (ja) * 1982-04-08 1983-10-18 Sumitomo Metal Ind Ltd 隔膜電解メツキ方法および装置
JPH0726235B2 (ja) * 1986-07-10 1995-03-22 三菱重工業株式会社 連続電気メツキ装置
JPH0274000A (ja) * 1988-09-09 1990-03-13 Permelec Electrode Ltd プリント基板の銅メッキ方法及び使用する装置
JPH086198B2 (ja) * 1990-08-15 1996-01-24 株式会社アルメックス 水平搬送型メッキ装置
US5211826A (en) * 1991-09-26 1993-05-18 Siemens Aktiengesellschaft Electroplating means for perforated printed circuit boards to be treated in a horizontal pass
JPH05140795A (ja) * 1991-11-21 1993-06-08 Toagosei Chem Ind Co Ltd 金属板に支持された電解銅箔の製造方法
JPH06212492A (ja) * 1993-01-12 1994-08-02 Nkk Corp 連続電気めっき装置
JP3426394B2 (ja) * 1995-04-12 2003-07-14 新日本製鐵株式会社 ストリップの電気メッキ装置
JP3299725B2 (ja) 1998-12-11 2002-07-08 株式会社ケミトロン メッキ方法とその装置
CN100523309C (zh) * 2003-12-25 2009-08-05 亚洲电镀器材有限公司 电镀设备液体输送系统，有该系统的电镀设备及其操作方法
DE102005005095A1 (de) 2005-02-04 2006-08-10 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zur elektrochemischen Behandlung von Bauteilen in Durchlaufanlagen
JP5457010B2 (ja) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 連続めっき処理装置
JP5437665B2 (ja) * 2009-03-06 2014-03-12 住友電気工業株式会社 高速連続めっき処理装置
JP5435355B2 (ja) * 2009-09-04 2014-03-05 日立金属株式会社 メッキ装置
JP5660281B2 (ja) 2010-03-31 2015-01-28 Toto株式会社 吐水装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102245402B1 (ko) 2020-01-21 2021-04-28 주식회사 우리선테크 인쇄회로기판 도금장치

Also Published As

Publication number Publication date
CN103031587A (zh) 2013-04-10
KR101461213B1 (ko) 2014-11-14
TW201333273A (zh) 2013-08-16
JP6342543B2 (ja) 2018-06-13
JP2013082996A (ja) 2013-05-09
DE102012018394A1 (de) 2013-04-04
TWI489009B (zh) 2015-06-21
CN103031587B (zh) 2016-12-21
JP2017122284A (ja) 2017-07-13
KR20130035206A (ko) 2013-04-08

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