JP6128847B2 - 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 - Google Patents

自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 Download PDF

Info

Publication number
JP6128847B2
JP6128847B2 JP2012517584A JP2012517584A JP6128847B2 JP 6128847 B2 JP6128847 B2 JP 6128847B2 JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012517584 A JP2012517584 A JP 2012517584A JP 6128847 B2 JP6128847 B2 JP 6128847B2
Authority
JP
Japan
Prior art keywords
substrate
metal
pattern
patterned
stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012517584A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012531518A5 (cg-RX-API-DMAC7.html
JP2012531518A (ja
Inventor
リジュン ツー，
リジュン ツー，
マシュー， エイチ． フレイ，
マシュー， エイチ． フレイ，
ミュンチャン カン，
ミュンチャン カン，
ジェフリー， エイチ． トッキー，
ジェフリー， エイチ． トッキー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2012531518A publication Critical patent/JP2012531518A/ja
Publication of JP2012531518A5 publication Critical patent/JP2012531518A5/ja
Application granted granted Critical
Publication of JP6128847B2 publication Critical patent/JP6128847B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP2012517584A 2009-06-25 2010-06-17 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 Active JP6128847B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22040709P 2009-06-25 2009-06-25
US61/220,407 2009-06-25
PCT/US2010/038942 WO2010151471A1 (en) 2009-06-25 2010-06-17 Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015137927A Division JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Publications (3)

Publication Number Publication Date
JP2012531518A JP2012531518A (ja) 2012-12-10
JP2012531518A5 JP2012531518A5 (cg-RX-API-DMAC7.html) 2013-07-25
JP6128847B2 true JP6128847B2 (ja) 2017-05-17

Family

ID=42710497

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012517584A Active JP6128847B2 (ja) 2009-06-25 2010-06-17 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2015137927A Expired - Fee Related JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2017050042A Withdrawn JP2017166070A (ja) 2009-06-25 2017-03-15 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015137927A Expired - Fee Related JP6399975B2 (ja) 2009-06-25 2015-07-09 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
JP2017050042A Withdrawn JP2017166070A (ja) 2009-06-25 2017-03-15 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品

Country Status (5)

Country Link
US (1) US8647522B2 (cg-RX-API-DMAC7.html)
EP (1) EP2446067B1 (cg-RX-API-DMAC7.html)
JP (3) JP6128847B2 (cg-RX-API-DMAC7.html)
CN (1) CN102803562B (cg-RX-API-DMAC7.html)
WO (1) WO2010151471A1 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5643774B2 (ja) 2009-02-26 2014-12-17 スリーエム イノベイティブ プロパティズ カンパニー 低視認性の重ね合わせられた微小パターンを有する、タッチスクリーンセンサ及びパターン基材
WO2011002617A1 (en) 2009-06-30 2011-01-06 3M Innovative Properties Company Electronic displays and metal micropatterned substrates having a graphic
CN102666103B (zh) 2009-12-22 2016-04-06 3M创新有限公司 用于使用增压辊的微接触印刷的装置及方法
CN103262342B (zh) 2010-12-16 2016-08-10 3M创新有限公司 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品
US9301397B2 (en) 2011-09-30 2016-03-29 3M Innovative Properties Company Methods of continuously wet etching a patterned substrate
BR112016010214A2 (pt) 2013-11-06 2017-08-08 3M Innovative Properties Co ?estampas de impressão por microcontato com características funcionais?
WO2015126372A1 (en) * 2014-02-19 2015-08-27 Uni-Pixel Displays, Inc. Method of passivating a conductive pattern with self-assembling monolayers
US9232661B1 (en) 2014-09-22 2016-01-05 International Business Machines Corporation Magnetically controllable fluidic etching process
CN104538138B (zh) * 2014-12-30 2017-12-29 南京萨特科技发展有限公司 精密贴片电阻器的制作方法
CN104630773B (zh) * 2015-03-07 2017-01-18 宋彦震 一种全自动pcb板腐蚀箱
CN106455348A (zh) * 2016-11-29 2017-02-22 福建农林大学 Pcb板升降腐蚀机及使用方法
CN107833827B (zh) * 2017-10-25 2020-07-31 武汉华星光电技术有限公司 一种阵列基板的刻蚀方法
JP7368264B2 (ja) * 2019-02-20 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
CN113463099B (zh) * 2020-03-31 2023-08-29 长沙韶光铬版有限公司 一种银的细微图形化蚀刻方法
FR3110716B1 (fr) * 2020-05-19 2022-04-29 Commissariat Energie Atomique Procede de fabrication de moules pour lithographie par nano-impression
CN116683283A (zh) * 2023-05-30 2023-09-01 中国科学院半导体研究所 半导体激光器湿法腐蚀方法及其装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1313233A (en) 1919-08-12 Ernest grass
GB1080536A (en) * 1964-09-18 1967-08-23 Her Majesty S Principal Sec De Improvements in or relating to chemical etching
US3483049A (en) * 1965-12-20 1969-12-09 Teletype Corp Method of froth etching
US3565707A (en) * 1969-03-03 1971-02-23 Fmc Corp Metal dissolution
DE2030304C3 (de) * 1970-06-19 1981-06-19 Walter 6983 Kreuzwertheim Lemmen Verfahren zum Ätzen von Metall
DE2353936A1 (de) * 1973-10-27 1975-05-07 Rudolf Schmidt Verfahren und vorrichtung zur verbesserung und/oder beschleunigung chemischer vorgaenge in fluessigkeiten und baedern
US4602184A (en) * 1984-10-29 1986-07-22 Ford Motor Company Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions
JPS61133390A (ja) * 1984-12-03 1986-06-20 Hitachi Cable Ltd めつきされた金の剥離方法
JPS61207584A (ja) * 1985-03-11 1986-09-13 Sumitomo Electric Ind Ltd 回路基板の製造方法
JPH0719944B2 (ja) * 1991-02-05 1995-03-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 微細電子回路パッケージの製造方法
JPH0677624A (ja) * 1992-08-25 1994-03-18 Matsushita Electric Ind Co Ltd プリント配線板のエッチング方法とエッチング装置
WO1997007429A1 (en) 1995-08-18 1997-02-27 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
EP1339897A2 (en) * 2000-10-16 2003-09-03 Geoffrey Alan Ozin Method of self-assembly and optical applications of crystalline colloidal patterns on substrates
US7041232B2 (en) * 2001-03-26 2006-05-09 International Business Machines Corporation Selective etching of substrates with control of the etch profile
US20020190028A1 (en) * 2001-05-31 2002-12-19 International Business Machines Corporation Method of improving uniformity of etching of a film on an article
GB0323902D0 (en) * 2003-10-11 2003-11-12 Koninkl Philips Electronics Nv Method for patterning a substrate surface
EP1834011A2 (en) * 2004-12-06 2007-09-19 Koninklijke Philips Electronics N.V. Etchant solutions and additives therefor
JP4528164B2 (ja) * 2005-03-11 2010-08-18 関東化学株式会社 エッチング液組成物
EP2044485B1 (en) * 2006-06-28 2013-06-05 Northwestern University Etching hole arrays
US8764996B2 (en) 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
EP2257969B1 (en) 2008-02-28 2017-12-20 3M Innovative Properties Company Methods of patterning a conductor on a substrate
US8284332B2 (en) 2008-08-01 2012-10-09 3M Innovative Properties Company Touch screen sensor with low visibility conductors
EP4300190B1 (en) 2008-02-28 2025-06-25 3M Innovative Properties Co. Touch screen sensor
EP2260366B1 (en) 2008-02-28 2018-09-19 3M Innovative Properties Company Touch screen sensor having varying sheet resistance
CN102307851B (zh) 2008-12-11 2015-05-06 3M创新有限公司 酰胺连接的全氟聚醚硫醇化合物及其制备方法和用途
JP2015137927A (ja) * 2014-01-22 2015-07-30 株式会社ブルービジョン 撮像装置及び検査システム

Also Published As

Publication number Publication date
EP2446067A1 (en) 2012-05-02
WO2010151471A1 (en) 2010-12-29
EP2446067B1 (en) 2019-11-20
CN102803562A (zh) 2012-11-28
US8647522B2 (en) 2014-02-11
JP6399975B2 (ja) 2018-10-03
CN102803562B (zh) 2015-09-30
JP2017166070A (ja) 2017-09-21
US20120082825A1 (en) 2012-04-05
JP2015214757A (ja) 2015-12-03
JP2012531518A (ja) 2012-12-10

Similar Documents

Publication Publication Date Title
JP6399975B2 (ja) 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品
EP2370269B1 (en) Patterning process
Wei et al. Tin sensitization for electroless plating review
Carvalho et al. Self-assembled monolayers of eicosanethiol on palladium and their use in microcontact printing
Wang et al. Mechanically robust superhydrophobic steel surface with anti-icing, UV-durability, and corrosion resistance properties
US7682703B2 (en) Microfabrication using patterned topography and self-assembled monolayers
JP5319769B2 (ja) パターン形成された基板の形成方法
CN101243209A (zh) 使用复制的图案化外形和自组装单层的微加工
KR20070092219A (ko) 에칭 용액 및 이를 위한 첨가제
Liu et al. An environmentally-friendly method to fabricate extreme wettability patterns on metal substrates with good time stability
Andreatta et al. Grafted-to Polymeric Layers Enabling Highly Adhesive Copper Films Deposited by Electroless Plating on Ultra-Smooth Three-Dimensional-Printed Surfaces
Mondin et al. Fabrication of micro-and submicrometer silver patterns by microcontact printing of mercaptosilanes and direct electroless metallization
JP4429141B2 (ja) エッチング液セット、これを用いるエッチング方法及び配線基板の製造方法
Akamatsu et al. Site-selective direct photochemical deposition of copper on glass substrates using TiO2 nanocrystals
CN103998650B (zh) 积层体及其制造方法、印刷配线基板及底层形成用组合物
Larmour et al. Assessment of roughness and chemical modification in determining the hydrophobic properties of metals
JP3808037B2 (ja) 基板上の金属の無電界堆積およびパターニングのための方法
Zhang et al. Control and Patterning of Various Hydrophobic Surfaces: In-situ Modification Realized by Flexible Atmospheric Plasma Stamp Technique
Asakura et al. Fabrication of high-density copper microstructures using vacuum ultraviolet light lithography and hydrofluoric acid etching treatment
Fujii et al. Maskless soft lithography for fabricating micro-and nanoscale Ag structures via solid-state electrochemical etching using a polymer electrolyte membrane for optoelectronic and sensing applications
JP2006303199A (ja) パターン形成方法及び有機薄膜トランジスタ
JP2005194611A (ja) 膜パターンの製造方法、導電層の製造方法、電子デバイスの製造方法及び電子デバイス
JP6213994B2 (ja) 光酸化剤による導電性膜印刷用親水性パターン形成方法
Lee et al. Fabrication of large-area CoNi mold for nanoimprint lithography
Yasukawa et al. Site-Selective Metal Patterning/Metal-Assisted Chemical Etching on GaAs Substrate through Colloidal Crystal Templating

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130604

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130604

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140307

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140408

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140626

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140703

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140827

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150324

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150702

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20150709

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20150821

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170411

R150 Certificate of patent or registration of utility model

Ref document number: 6128847

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250