JP2012531518A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012531518A5 JP2012531518A5 JP2012517584A JP2012517584A JP2012531518A5 JP 2012531518 A5 JP2012531518 A5 JP 2012531518A5 JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012517584 A JP2012517584 A JP 2012517584A JP 2012531518 A5 JP2012531518 A5 JP 2012531518A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- self
- assembled monolayer
- patterned region
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000002094 self assembled monolayer Substances 0.000 claims 3
- 239000013545 self-assembled monolayer Substances 0.000 claims 3
- 238000001039 wet etching Methods 0.000 claims 2
- 230000005587 bubbling Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22040709P | 2009-06-25 | 2009-06-25 | |
| US61/220,407 | 2009-06-25 | ||
| PCT/US2010/038942 WO2010151471A1 (en) | 2009-06-25 | 2010-06-17 | Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015137927A Division JP6399975B2 (ja) | 2009-06-25 | 2015-07-09 | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012531518A JP2012531518A (ja) | 2012-12-10 |
| JP2012531518A5 true JP2012531518A5 (cg-RX-API-DMAC7.html) | 2013-07-25 |
| JP6128847B2 JP6128847B2 (ja) | 2017-05-17 |
Family
ID=42710497
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012517584A Active JP6128847B2 (ja) | 2009-06-25 | 2010-06-17 | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
| JP2015137927A Expired - Fee Related JP6399975B2 (ja) | 2009-06-25 | 2015-07-09 | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
| JP2017050042A Withdrawn JP2017166070A (ja) | 2009-06-25 | 2017-03-15 | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015137927A Expired - Fee Related JP6399975B2 (ja) | 2009-06-25 | 2015-07-09 | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
| JP2017050042A Withdrawn JP2017166070A (ja) | 2009-06-25 | 2017-03-15 | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8647522B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2446067B1 (cg-RX-API-DMAC7.html) |
| JP (3) | JP6128847B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102803562B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2010151471A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5643774B2 (ja) | 2009-02-26 | 2014-12-17 | スリーエム イノベイティブ プロパティズ カンパニー | 低視認性の重ね合わせられた微小パターンを有する、タッチスクリーンセンサ及びパターン基材 |
| WO2011002617A1 (en) | 2009-06-30 | 2011-01-06 | 3M Innovative Properties Company | Electronic displays and metal micropatterned substrates having a graphic |
| CN102666103B (zh) | 2009-12-22 | 2016-04-06 | 3M创新有限公司 | 用于使用增压辊的微接触印刷的装置及方法 |
| CN103262342B (zh) | 2010-12-16 | 2016-08-10 | 3M创新有限公司 | 透明性微图案化rfid天线以及装配透明性微图案化rfid天线的制品 |
| US9301397B2 (en) | 2011-09-30 | 2016-03-29 | 3M Innovative Properties Company | Methods of continuously wet etching a patterned substrate |
| BR112016010214A2 (pt) | 2013-11-06 | 2017-08-08 | 3M Innovative Properties Co | ?estampas de impressão por microcontato com características funcionais? |
| WO2015126372A1 (en) * | 2014-02-19 | 2015-08-27 | Uni-Pixel Displays, Inc. | Method of passivating a conductive pattern with self-assembling monolayers |
| US9232661B1 (en) | 2014-09-22 | 2016-01-05 | International Business Machines Corporation | Magnetically controllable fluidic etching process |
| CN104538138B (zh) * | 2014-12-30 | 2017-12-29 | 南京萨特科技发展有限公司 | 精密贴片电阻器的制作方法 |
| CN104630773B (zh) * | 2015-03-07 | 2017-01-18 | 宋彦震 | 一种全自动pcb板腐蚀箱 |
| CN106455348A (zh) * | 2016-11-29 | 2017-02-22 | 福建农林大学 | Pcb板升降腐蚀机及使用方法 |
| CN107833827B (zh) * | 2017-10-25 | 2020-07-31 | 武汉华星光电技术有限公司 | 一种阵列基板的刻蚀方法 |
| JP7368264B2 (ja) * | 2019-02-20 | 2023-10-24 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、及び基板処理方法 |
| CN113463099B (zh) * | 2020-03-31 | 2023-08-29 | 长沙韶光铬版有限公司 | 一种银的细微图形化蚀刻方法 |
| FR3110716B1 (fr) * | 2020-05-19 | 2022-04-29 | Commissariat Energie Atomique | Procede de fabrication de moules pour lithographie par nano-impression |
| CN116683283A (zh) * | 2023-05-30 | 2023-09-01 | 中国科学院半导体研究所 | 半导体激光器湿法腐蚀方法及其装置 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1313233A (en) | 1919-08-12 | Ernest grass | ||
| GB1080536A (en) * | 1964-09-18 | 1967-08-23 | Her Majesty S Principal Sec De | Improvements in or relating to chemical etching |
| US3483049A (en) * | 1965-12-20 | 1969-12-09 | Teletype Corp | Method of froth etching |
| US3565707A (en) * | 1969-03-03 | 1971-02-23 | Fmc Corp | Metal dissolution |
| DE2030304C3 (de) * | 1970-06-19 | 1981-06-19 | Walter 6983 Kreuzwertheim Lemmen | Verfahren zum Ätzen von Metall |
| DE2353936A1 (de) * | 1973-10-27 | 1975-05-07 | Rudolf Schmidt | Verfahren und vorrichtung zur verbesserung und/oder beschleunigung chemischer vorgaenge in fluessigkeiten und baedern |
| US4602184A (en) * | 1984-10-29 | 1986-07-22 | Ford Motor Company | Apparatus for applying high frequency ultrasonic energy to cleaning and etching solutions |
| JPS61133390A (ja) * | 1984-12-03 | 1986-06-20 | Hitachi Cable Ltd | めつきされた金の剥離方法 |
| JPS61207584A (ja) * | 1985-03-11 | 1986-09-13 | Sumitomo Electric Ind Ltd | 回路基板の製造方法 |
| JPH0719944B2 (ja) * | 1991-02-05 | 1995-03-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 微細電子回路パッケージの製造方法 |
| JPH0677624A (ja) * | 1992-08-25 | 1994-03-18 | Matsushita Electric Ind Co Ltd | プリント配線板のエッチング方法とエッチング装置 |
| WO1997007429A1 (en) | 1995-08-18 | 1997-02-27 | President And Fellows Of Harvard College | Self-assembled monolayer directed patterning of surfaces |
| EP1339897A2 (en) * | 2000-10-16 | 2003-09-03 | Geoffrey Alan Ozin | Method of self-assembly and optical applications of crystalline colloidal patterns on substrates |
| US7041232B2 (en) * | 2001-03-26 | 2006-05-09 | International Business Machines Corporation | Selective etching of substrates with control of the etch profile |
| US20020190028A1 (en) * | 2001-05-31 | 2002-12-19 | International Business Machines Corporation | Method of improving uniformity of etching of a film on an article |
| GB0323902D0 (en) * | 2003-10-11 | 2003-11-12 | Koninkl Philips Electronics Nv | Method for patterning a substrate surface |
| EP1834011A2 (en) * | 2004-12-06 | 2007-09-19 | Koninklijke Philips Electronics N.V. | Etchant solutions and additives therefor |
| JP4528164B2 (ja) * | 2005-03-11 | 2010-08-18 | 関東化学株式会社 | エッチング液組成物 |
| EP2044485B1 (en) * | 2006-06-28 | 2013-06-05 | Northwestern University | Etching hole arrays |
| US8764996B2 (en) | 2006-10-18 | 2014-07-01 | 3M Innovative Properties Company | Methods of patterning a material on polymeric substrates |
| EP2257969B1 (en) | 2008-02-28 | 2017-12-20 | 3M Innovative Properties Company | Methods of patterning a conductor on a substrate |
| US8284332B2 (en) | 2008-08-01 | 2012-10-09 | 3M Innovative Properties Company | Touch screen sensor with low visibility conductors |
| EP4300190B1 (en) | 2008-02-28 | 2025-06-25 | 3M Innovative Properties Co. | Touch screen sensor |
| EP2260366B1 (en) | 2008-02-28 | 2018-09-19 | 3M Innovative Properties Company | Touch screen sensor having varying sheet resistance |
| CN102307851B (zh) | 2008-12-11 | 2015-05-06 | 3M创新有限公司 | 酰胺连接的全氟聚醚硫醇化合物及其制备方法和用途 |
| JP2015137927A (ja) * | 2014-01-22 | 2015-07-30 | 株式会社ブルービジョン | 撮像装置及び検査システム |
-
2010
- 2010-06-17 CN CN201080028067.6A patent/CN102803562B/zh not_active Expired - Fee Related
- 2010-06-17 WO PCT/US2010/038942 patent/WO2010151471A1/en not_active Ceased
- 2010-06-17 EP EP10728512.4A patent/EP2446067B1/en active Active
- 2010-06-17 US US13/319,704 patent/US8647522B2/en not_active Expired - Fee Related
- 2010-06-17 JP JP2012517584A patent/JP6128847B2/ja active Active
-
2015
- 2015-07-09 JP JP2015137927A patent/JP6399975B2/ja not_active Expired - Fee Related
-
2017
- 2017-03-15 JP JP2017050042A patent/JP2017166070A/ja not_active Withdrawn