JP6123152B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP6123152B2 JP6123152B2 JP2011254314A JP2011254314A JP6123152B2 JP 6123152 B2 JP6123152 B2 JP 6123152B2 JP 2011254314 A JP2011254314 A JP 2011254314A JP 2011254314 A JP2011254314 A JP 2011254314A JP 6123152 B2 JP6123152 B2 JP 6123152B2
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- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- KAHVZNKZQFSBFW-UHFFFAOYSA-N n-methyl-n-trimethylsilylmethanamine Chemical compound CN(C)[Si](C)(C)C KAHVZNKZQFSBFW-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- SJHHDDDGXWOYOE-UHFFFAOYSA-N oxytitamium phthalocyanine Chemical compound [Ti+2]=O.C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 SJHHDDDGXWOYOE-UHFFFAOYSA-N 0.000 description 1
- 235000012736 patent blue V Nutrition 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical group 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical class SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011254314A JP6123152B2 (ja) | 2010-12-08 | 2011-11-21 | 樹脂組成物 |
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|---|---|---|---|
| JP2010273874 | 2010-12-08 | ||
| JP2010273874 | 2010-12-08 | ||
| JP2011254314A JP6123152B2 (ja) | 2010-12-08 | 2011-11-21 | 樹脂組成物 |
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| JP2015210436A Division JP2016048788A (ja) | 2010-12-08 | 2015-10-27 | 樹脂組成物 |
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| JP2012136693A JP2012136693A (ja) | 2012-07-19 |
| JP6123152B2 true JP6123152B2 (ja) | 2017-05-10 |
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| JP2015210436A Pending JP2016048788A (ja) | 2010-12-08 | 2015-10-27 | 樹脂組成物 |
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| JP (2) | JP6123152B2 (zh) |
| KR (1) | KR101834151B1 (zh) |
| TW (1) | TWI600705B (zh) |
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| KR102028579B1 (ko) * | 2013-08-30 | 2019-10-04 | 동우 화인켐 주식회사 | 착색 감광성 수지 조성물 |
| JP6761224B2 (ja) * | 2014-02-19 | 2020-09-23 | 味の素株式会社 | プリント配線板、半導体装置及び樹脂シートセット |
| DE102014206220A1 (de) | 2014-04-01 | 2015-10-01 | Tesa Se | Verfahren zur Plasma-initiierten Verklebung |
| JP6409390B2 (ja) * | 2014-07-28 | 2018-10-24 | 住友ベークライト株式会社 | 配線基板、半導体パッケージ、電子装置、配線基板の製造方法、および半導体パッケージの製造方法 |
| CN107207705B (zh) * | 2015-02-03 | 2019-11-01 | 日立化成株式会社 | 环氧树脂组合物、膜状环氧树脂组合物、固化物及电子装置 |
| JP6511840B2 (ja) * | 2015-02-03 | 2019-05-15 | 日立化成株式会社 | エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物及び電子部品装置 |
| JP2017011232A (ja) * | 2015-06-26 | 2017-01-12 | 京セラ株式会社 | 配線基板およびその製造方法 |
| JP6406147B2 (ja) * | 2015-07-21 | 2018-10-17 | 株式会社デンソー | 電子装置 |
| JP6610069B2 (ja) * | 2015-08-06 | 2019-11-27 | 住友ベークライト株式会社 | ソルダーレジスト用樹脂組成物、キャリア付樹脂膜、配線基板、電子装置、および電子装置の製造方法 |
| JP6668637B2 (ja) * | 2015-08-24 | 2020-03-18 | 住友ベークライト株式会社 | 樹脂組成物、樹脂膜、回路基板および半導体装置 |
| JP6107992B1 (ja) * | 2016-03-02 | 2017-04-05 | 住友ベークライト株式会社 | 樹脂シート |
| JP6897026B2 (ja) * | 2016-08-10 | 2021-06-30 | 味の素株式会社 | 樹脂組成物 |
| JP6866858B2 (ja) * | 2017-03-10 | 2021-04-28 | 味の素株式会社 | 樹脂組成物層 |
| JP7279303B2 (ja) * | 2017-05-10 | 2023-05-23 | 味の素株式会社 | 樹脂組成物層 |
| KR102208828B1 (ko) * | 2017-06-09 | 2021-01-27 | 고오 가가쿠고교 가부시키가이샤 | 감광성 수지 조성물, 드라이 필름, 및 프린트 배선판 |
| CN111164151A (zh) * | 2017-10-10 | 2020-05-15 | 味之素株式会社 | 固化体及其制造方法、树脂片材及树脂组合物 |
| JP2018082184A (ja) * | 2017-12-06 | 2018-05-24 | 味の素株式会社 | 樹脂シート |
| JP7296191B2 (ja) * | 2018-01-09 | 2023-06-22 | 味の素株式会社 | 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置 |
| JP6927151B2 (ja) * | 2018-05-29 | 2021-08-25 | 味の素株式会社 | 樹脂組成物 |
| CN112673043B (zh) * | 2018-09-19 | 2024-03-29 | 喜利得股份公司 | 用于环氧树脂混合物的固化剂组合物、环氧树脂混合物和多组分环氧树脂体系 |
| US20240057252A1 (en) * | 2020-12-17 | 2024-02-15 | Sekisui Kasei Co., Ltd. | Laminate, laminate with buildup layer, laminate with metal foil, and circuit board |
| CN114806217A (zh) * | 2021-10-22 | 2022-07-29 | 双乐颜料泰兴市有限公司 | 一种藏青色着色剂及其制备方法 |
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| JP2690825B2 (ja) * | 1990-07-10 | 1997-12-17 | 三井東圧化学株式会社 | 低軟化点ナフトールアラルキル樹脂およびその樹脂を用いたエポキシ樹脂組成物 |
| JP3319621B2 (ja) * | 1992-11-20 | 2002-09-03 | 日本化薬株式会社 | エポキシ（メタ）アクリレート、重合性樹脂組成物及びその硬化物 |
| JP3729554B2 (ja) * | 1995-03-23 | 2005-12-21 | 日本化薬株式会社 | エポキシ樹脂の製造方法 |
| JP2003046226A (ja) * | 2001-07-30 | 2003-02-14 | Kyocera Corp | 配線基板およびその製造方法 |
| JP2003101244A (ja) * | 2001-09-27 | 2003-04-04 | Ibiden Co Ltd | 多層プリント配線板の製造方法および多層プリント配線板 |
| JP4714135B2 (ja) * | 2002-03-29 | 2011-06-29 | 太陽ホールディングス株式会社 | 不飽和基含有多分岐化合物、それを含有する硬化性組成物及びその硬化物 |
| JP2004238437A (ja) * | 2003-02-04 | 2004-08-26 | Nippon Kayaku Co Ltd | ナフトール系フェノール樹脂及びその製造法 |
| JP2006113402A (ja) * | 2004-10-15 | 2006-04-27 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、永久保護膜の形成方法及びプリント配線板 |
| JP4687196B2 (ja) * | 2005-03-30 | 2011-05-25 | 住友ベークライト株式会社 | 配線板 |
| US20100112474A1 (en) * | 2007-03-12 | 2010-05-06 | Fujifilm Corporation | Photosensitive composition, photosensitive film, method for forming a permanent pattern, and printed board |
| JP5506382B2 (ja) * | 2007-07-18 | 2014-05-28 | 昭和電工株式会社 | 熱硬化性樹脂組成物 |
| JPWO2010029726A1 (ja) * | 2008-09-11 | 2012-02-02 | 住友ベークライト株式会社 | 半導体装置および半導体装置に用いる樹脂組成物 |
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2011
- 2011-11-21 JP JP2011254314A patent/JP6123152B2/ja active Active
- 2011-12-01 TW TW100144217A patent/TWI600705B/zh active
- 2011-12-07 KR KR1020110130437A patent/KR101834151B1/ko active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201229127A (en) | 2012-07-16 |
| JP2016048788A (ja) | 2016-04-07 |
| TWI600705B (zh) | 2017-10-01 |
| KR20120064043A (ko) | 2012-06-18 |
| JP2012136693A (ja) | 2012-07-19 |
| KR101834151B1 (ko) | 2018-03-05 |
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