JP6121782B2 - 多層セラミック基板およびその製造方法 - Google Patents

多層セラミック基板およびその製造方法 Download PDF

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Publication number
JP6121782B2
JP6121782B2 JP2013082648A JP2013082648A JP6121782B2 JP 6121782 B2 JP6121782 B2 JP 6121782B2 JP 2013082648 A JP2013082648 A JP 2013082648A JP 2013082648 A JP2013082648 A JP 2013082648A JP 6121782 B2 JP6121782 B2 JP 6121782B2
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Prior art keywords
glass
firing
insulating layer
substrate
insulating
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Japanese (ja)
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JP2014207265A5 (enExample
JP2014207265A (ja
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達哉 加藤
達哉 加藤
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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JP2013082648A 2013-04-11 2013-04-11 多層セラミック基板およびその製造方法 Active JP6121782B2 (ja)

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JP2013082648A JP6121782B2 (ja) 2013-04-11 2013-04-11 多層セラミック基板およびその製造方法

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JP2013082648A JP6121782B2 (ja) 2013-04-11 2013-04-11 多層セラミック基板およびその製造方法

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JP2014207265A JP2014207265A (ja) 2014-10-30
JP2014207265A5 JP2014207265A5 (enExample) 2016-03-03
JP6121782B2 true JP6121782B2 (ja) 2017-04-26

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102470168B1 (ko) * 2015-12-08 2022-11-23 삼성전기주식회사 패키지기판
JP2020030127A (ja) * 2018-08-23 2020-02-27 日本特殊陶業株式会社 電気検査用基板およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3961033B2 (ja) * 1995-02-27 2007-08-15 京セラ株式会社 積層ガラス−セラミック回路基板
JP2006137618A (ja) * 2004-11-10 2006-06-01 Sanyo Electric Co Ltd 誘電体セラミック基板

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JP2014207265A (ja) 2014-10-30

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