JP6114312B2 - タンパク質を含有する化学機械研磨（ｃｍｐ）組成物 - Google Patents
タンパク質を含有する化学機械研磨（ｃｍｐ）組成物 Download PDFInfo
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- JP6114312B2 JP6114312B2 JP2014556155A JP2014556155A JP6114312B2 JP 6114312 B2 JP6114312 B2 JP 6114312B2 JP 2014556155 A JP2014556155 A JP 2014556155A JP 2014556155 A JP2014556155 A JP 2014556155A JP 6114312 B2 JP6114312 B2 JP 6114312B2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/18—Other polishing compositions based on non-waxy substances on other substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261597210P | 2012-02-10 | 2012-02-10 | |
| US61/597,210 | 2012-02-10 | ||
| PCT/IB2013/050647 WO2013118015A1 (en) | 2012-02-10 | 2013-01-25 | Chemical mechanical polishing (cmp) composition comprising a protein |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015511258A JP2015511258A (ja) | 2015-04-16 |
| JP2015511258A5 JP2015511258A5 (enExample) | 2016-03-10 |
| JP6114312B2 true JP6114312B2 (ja) | 2017-04-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014556155A Expired - Fee Related JP6114312B2 (ja) | 2012-02-10 | 2013-01-25 | タンパク質を含有する化学機械研磨（ｃｍｐ）組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9777192B2 (enExample) |
| EP (1) | EP2812911B1 (enExample) |
| JP (1) | JP6114312B2 (enExample) |
| KR (1) | KR20140122271A (enExample) |
| CN (1) | CN104081501B (enExample) |
| IL (1) | IL233797A0 (enExample) |
| MY (1) | MY171093A (enExample) |
| RU (1) | RU2631875C2 (enExample) |
| SG (1) | SG11201404747UA (enExample) |
| TW (1) | TWI606102B (enExample) |
| WO (1) | WO2013118015A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104169418B (zh) * | 2012-02-13 | 2017-06-13 | 国立大学法人京都工艺纤维大学 | 具有对氮化硅(si3n4)的亲和性的肽及其用途 |
| US9340706B2 (en) * | 2013-10-10 | 2016-05-17 | Cabot Microelectronics Corporation | Mixed abrasive polishing compositions |
| US9551075B2 (en) * | 2014-08-04 | 2017-01-24 | Sinmat, Inc. | Chemical mechanical polishing of alumina |
| KR102605140B1 (ko) * | 2015-12-17 | 2023-11-24 | 솔브레인 주식회사 | 화학 기계적 연마 슬러리 조성물 및 이를 이용한 연마 방법 |
| US11326076B2 (en) * | 2019-01-25 | 2022-05-10 | Versum Materials Us, Llc | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives |
| US11608451B2 (en) | 2019-01-30 | 2023-03-21 | Versum Materials Us, Llc | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates |
| KR20210076571A (ko) * | 2019-12-16 | 2021-06-24 | 주식회사 케이씨텍 | Sti 공정용 연마 슬러리 조성물 |
| WO2021231090A1 (en) * | 2020-05-11 | 2021-11-18 | Versum Materials Us, Llc | Novel pad-1 n-a-bottle (pib) technology for advanced chemical-mechanical planarization (cmp) slurries and processes |
| US12009339B2 (en) | 2020-08-18 | 2024-06-11 | Seoul National University R&Db Foundation | Electronic device and method of transferring electronic element using stamping and magnetic field alignment |
| CN118240485B (zh) * | 2024-05-27 | 2024-08-16 | 嘉兴市小辰光伏科技有限公司 | 一种具有云朵状塔基硅片碱抛添加剂及其使用方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE266071T1 (de) * | 1998-02-24 | 2004-05-15 | Showa Denko Kk | Schleifmittelzusammensetzung zum polieren eines halbleiterbauteils und herstellung des halbleiterbauteils mit derselben |
| JP3560484B2 (ja) * | 1998-08-05 | 2004-09-02 | 昭和電工株式会社 | Ｌｓｉデバイス研磨用研磨材組成物及び研磨方法 |
| US6679761B1 (en) | 1999-11-04 | 2004-01-20 | Seimi Chemical Co., Ltd. | Polishing compound for semiconductor containing peptide |
| JP2002110596A (ja) * | 2000-10-02 | 2002-04-12 | Mitsubishi Electric Corp | 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法 |
| TWI281493B (en) * | 2000-10-06 | 2007-05-21 | Mitsui Mining & Smelting Co | Polishing material |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| US7241734B2 (en) * | 2004-08-18 | 2007-07-10 | E. I. Du Pont De Nemours And Company | Thermophilic hydrophobin proteins and applications for surface modification |
| JP4027929B2 (ja) * | 2004-11-30 | 2007-12-26 | 花王株式会社 | 半導体基板用研磨液組成物 |
| US20060216935A1 (en) * | 2005-03-28 | 2006-09-28 | Ferro Corporation | Composition for oxide CMP in CMOS device fabrication |
| EP1929512A2 (en) | 2005-08-05 | 2008-06-11 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
| KR101395542B1 (ko) * | 2006-05-02 | 2014-05-14 | 캐보트 마이크로일렉트로닉스 코포레이션 | 반도체 물질의 ｃｍｐ를 위한 조성물 및 방법 |
| EP2092031A1 (en) | 2006-12-04 | 2009-08-26 | Basf Se | Planarization composition for metal surfaces comprising an alumina hydrate abrasive |
| JP4784614B2 (ja) * | 2008-02-25 | 2011-10-05 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体 |
| WO2010037730A1 (en) * | 2008-10-03 | 2010-04-08 | Basf Se | Chemical mechanical polishing (cmp) polishing solution with enhanced performance |
| CA2752808A1 (en) * | 2009-03-09 | 2010-09-16 | Basf Se | Use of a synergistic mixture of water-soluble polymers and hydrophobins for thickening aqueous phases |
| JP2012028747A (ja) * | 2010-06-24 | 2012-02-09 | Hitachi Chem Co Ltd | Ｃｍｐ研磨液及び基板の研磨方法 |
-
2013
- 2013-01-25 CN CN201380006888.3A patent/CN104081501B/zh not_active Expired - Fee Related
- 2013-01-25 US US14/377,648 patent/US9777192B2/en not_active Expired - Fee Related
- 2013-01-25 RU RU2014136534A patent/RU2631875C2/ru not_active IP Right Cessation
- 2013-01-25 WO PCT/IB2013/050647 patent/WO2013118015A1/en not_active Ceased
- 2013-01-25 KR KR1020147024959A patent/KR20140122271A/ko not_active Ceased
- 2013-01-25 JP JP2014556155A patent/JP6114312B2/ja not_active Expired - Fee Related
- 2013-01-25 EP EP13746024.2A patent/EP2812911B1/en not_active Not-in-force
- 2013-01-25 SG SG11201404747UA patent/SG11201404747UA/en unknown
- 2013-01-25 MY MYPI2014002325A patent/MY171093A/en unknown
- 2013-02-07 TW TW102105003A patent/TWI606102B/zh not_active IP Right Cessation
-
2014
- 2014-07-24 IL IL233797A patent/IL233797A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013118015A1 (en) | 2013-08-15 |
| US20150017454A1 (en) | 2015-01-15 |
| JP2015511258A (ja) | 2015-04-16 |
| EP2812911A1 (en) | 2014-12-17 |
| EP2812911A4 (en) | 2015-08-12 |
| EP2812911B1 (en) | 2017-06-28 |
| MY171093A (en) | 2019-09-25 |
| TWI606102B (zh) | 2017-11-21 |
| IL233797A0 (en) | 2014-09-30 |
| CN104081501A (zh) | 2014-10-01 |
| KR20140122271A (ko) | 2014-10-17 |
| RU2014136534A (ru) | 2016-03-27 |
| CN104081501B (zh) | 2019-02-01 |
| SG11201404747UA (en) | 2014-09-26 |
| RU2631875C2 (ru) | 2017-09-28 |
| TW201339258A (zh) | 2013-10-01 |
| US9777192B2 (en) | 2017-10-03 |
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