JP6112890B2 - プローブユニット、基板検査装置およびプローブユニット組立方法 - Google Patents

プローブユニット、基板検査装置およびプローブユニット組立方法 Download PDF

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Publication number
JP6112890B2
JP6112890B2 JP2013022184A JP2013022184A JP6112890B2 JP 6112890 B2 JP6112890 B2 JP 6112890B2 JP 2013022184 A JP2013022184 A JP 2013022184A JP 2013022184 A JP2013022184 A JP 2013022184A JP 6112890 B2 JP6112890 B2 JP 6112890B2
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Japan
Prior art keywords
support
support plate
probe
plate
hole
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JP2013022184A
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English (en)
Japanese (ja)
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JP2014153148A (ja
Inventor
昌史 小林
昌史 小林
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Hioki EE Corp
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Hioki EE Corp
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Application filed by Hioki EE Corp filed Critical Hioki EE Corp
Priority to JP2013022184A priority Critical patent/JP6112890B2/ja
Priority to TW103102592A priority patent/TWI608236B/zh
Priority to PCT/JP2014/051767 priority patent/WO2014123031A1/ja
Priority to KR1020157017764A priority patent/KR20150115728A/ko
Priority to CN201480005373.6A priority patent/CN104937424B/zh
Publication of JP2014153148A publication Critical patent/JP2014153148A/ja
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Publication of JP6112890B2 publication Critical patent/JP6112890B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2013022184A 2013-02-07 2013-02-07 プローブユニット、基板検査装置およびプローブユニット組立方法 Active JP6112890B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013022184A JP6112890B2 (ja) 2013-02-07 2013-02-07 プローブユニット、基板検査装置およびプローブユニット組立方法
TW103102592A TWI608236B (zh) 2013-02-07 2014-01-24 Probe unit, substrate inspection apparatus, and probe unit combination method
PCT/JP2014/051767 WO2014123031A1 (ja) 2013-02-07 2014-01-28 プローブユニット、基板検査装置およびプローブユニット組立方法
KR1020157017764A KR20150115728A (ko) 2013-02-07 2014-01-28 프로브 유닛, 기판 검사 장치 및 프로브 유닛 조립 방법
CN201480005373.6A CN104937424B (zh) 2013-02-07 2014-01-28 探针单元、基板检查装置及探针单元组装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013022184A JP6112890B2 (ja) 2013-02-07 2013-02-07 プローブユニット、基板検査装置およびプローブユニット組立方法

Publications (2)

Publication Number Publication Date
JP2014153148A JP2014153148A (ja) 2014-08-25
JP6112890B2 true JP6112890B2 (ja) 2017-04-12

Family

ID=51299628

Family Applications (1)

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JP2013022184A Active JP6112890B2 (ja) 2013-02-07 2013-02-07 プローブユニット、基板検査装置およびプローブユニット組立方法

Country Status (5)

Country Link
JP (1) JP6112890B2 (zh)
KR (1) KR20150115728A (zh)
CN (1) CN104937424B (zh)
TW (1) TWI608236B (zh)
WO (1) WO2014123031A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6537315B2 (ja) * 2015-03-23 2019-07-03 オルガン針株式会社 ワイヤープローブ用治具
JP6706076B2 (ja) * 2016-01-14 2020-06-03 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
KR102338320B1 (ko) * 2016-07-28 2021-12-10 니혼덴산리드가부시키가이샤 검사 지그, 이를 구비하는 기판 검사 장치, 및 검사 지그의 제조 방법
US10018458B2 (en) * 2016-09-12 2018-07-10 The Boeing Company Validating parts using a number of contiguous coupons produced from part excess
KR101845652B1 (ko) * 2017-01-17 2018-04-04 주식회사 텝스 부품 실장된 웨이퍼 테스트를 위한 하이브리드 프로브 카드
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
KR101958353B1 (ko) * 2017-08-04 2019-03-15 리노공업주식회사 검사장치
KR102002702B1 (ko) * 2017-11-09 2019-07-22 이영희 프로브 카드
JP7453891B2 (ja) * 2020-10-06 2024-03-21 日本航空電子工業株式会社 電気部品検査器具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5956835A (en) * 1994-10-03 1999-09-28 Aksu; Allen Test fixtures for testing of printed circuit boards
JPH11125646A (ja) * 1997-10-21 1999-05-11 Mitsubishi Electric Corp 垂直針型プローブカード、その製造方法およびその不良プローブ針の交換方法
JP3505495B2 (ja) * 2000-09-13 2004-03-08 日本電産リード株式会社 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
JP4732360B2 (ja) * 2003-11-14 2011-07-27 ウエントワース ラボラトリーズ，インコーポレイテッド 組立補助材が組み込まれたダイ設計
TWM255404U (en) * 2004-01-29 2005-01-11 Shuenn Jyh Electronics Co Ltd Probe base of circuit board circuit tester
DE202007016398U1 (de) * 2006-11-27 2008-02-21 Feinmetall Gmbh Kontaktiervorrichtung zum Kontaktieren eines zu prüfenden elektrischen Prüflings
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
CN201845029U (zh) * 2010-11-08 2011-05-25 港建日置股份有限公司 测试探针
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism

Also Published As

Publication number Publication date
CN104937424B (zh) 2018-01-09
CN104937424A (zh) 2015-09-23
TW201447307A (zh) 2014-12-16
WO2014123031A1 (ja) 2014-08-14
TWI608236B (zh) 2017-12-11
KR20150115728A (ko) 2015-10-14
JP2014153148A (ja) 2014-08-25

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