JP6110159B2 - 複合部材及びその製造方法 - Google Patents
複合部材及びその製造方法 Download PDFInfo
- Publication number
- JP6110159B2 JP6110159B2 JP2013033473A JP2013033473A JP6110159B2 JP 6110159 B2 JP6110159 B2 JP 6110159B2 JP 2013033473 A JP2013033473 A JP 2013033473A JP 2013033473 A JP2013033473 A JP 2013033473A JP 6110159 B2 JP6110159 B2 JP 6110159B2
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- JP
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- Prior art keywords
- dam
- adhesive
- composite
- joint surface
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000853 adhesive Substances 0.000 claims description 109
- 230000001070 adhesive effect Effects 0.000 claims description 102
- 239000000919 ceramic Substances 0.000 claims description 66
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 229920001187 thermosetting polymer Polymers 0.000 claims description 44
- 239000010410 layer Substances 0.000 claims description 36
- 238000005304 joining Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 239000002156 adsorbate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 239000000112 cooling gas Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920002050 silicone resin Polymers 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229940035339 tri-chlor Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013033473A JP6110159B2 (ja) | 2013-02-22 | 2013-02-22 | 複合部材及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013033473A JP6110159B2 (ja) | 2013-02-22 | 2013-02-22 | 複合部材及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014165267A JP2014165267A (ja) | 2014-09-08 |
| JP2014165267A5 JP2014165267A5 (enrdf_load_stackoverflow) | 2016-03-03 |
| JP6110159B2 true JP6110159B2 (ja) | 2017-04-05 |
Family
ID=51615631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013033473A Active JP6110159B2 (ja) | 2013-02-22 | 2013-02-22 | 複合部材及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6110159B2 (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10688750B2 (en) | 2017-10-03 | 2020-06-23 | Applied Materials, Inc. | Bonding structure of E chuck to aluminum base configuration |
| US10847402B2 (en) | 2018-04-02 | 2020-11-24 | Applied Materials, Inc. | Bond protection around porous plugs |
| US11380572B2 (en) | 2019-05-24 | 2022-07-05 | Applied Materials, Inc. | Substrate support carrier with improved bond layer protection |
| US11456161B2 (en) | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6463938B2 (ja) * | 2014-10-08 | 2019-02-06 | 日本特殊陶業株式会社 | 静電チャック |
| KR102176064B1 (ko) * | 2017-11-10 | 2020-11-09 | 주식회사 아이앤티 | 정전척 제조방법 및 정전척 |
| JP7210192B2 (ja) * | 2018-08-30 | 2023-01-23 | 日本特殊陶業株式会社 | 保持装置の製造方法 |
| KR20220018053A (ko) * | 2019-06-12 | 2022-02-14 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버 컴포넌트들을 위한 실란트 (sealant) 코팅 |
| KR102341865B1 (ko) * | 2021-05-13 | 2021-12-21 | 고광노 | 수리가 용이한 정전척 |
| KR102418014B1 (ko) * | 2021-08-27 | 2022-07-07 | 주식회사 동탄이엔지 | 홀이 구비되는 필름형 본딩층을 포함하는 정전척 및 정전척의 제조 방법 |
| KR102592339B1 (ko) * | 2022-08-09 | 2023-10-23 | 주식회사 동탄이엔지 | 다공성 필터가 구비되는 정전척의 제조 방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1065047A (ja) * | 1996-08-20 | 1998-03-06 | Tokuyama Corp | 半導体素子搭載用パッケージの製造方法 |
| JP5143184B2 (ja) * | 2010-05-07 | 2013-02-13 | 日本碍子株式会社 | ウエハー載置装置の製造方法 |
-
2013
- 2013-02-22 JP JP2013033473A patent/JP6110159B2/ja active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10688750B2 (en) | 2017-10-03 | 2020-06-23 | Applied Materials, Inc. | Bonding structure of E chuck to aluminum base configuration |
| US11192323B2 (en) | 2017-10-03 | 2021-12-07 | Applied Materials, Inc. | Bonding structure of e chuck to aluminum base configuration |
| US11794441B2 (en) | 2017-10-03 | 2023-10-24 | Applied Materials, Inc. | Bonding structure of e chuck to aluminum base configuration |
| US10847402B2 (en) | 2018-04-02 | 2020-11-24 | Applied Materials, Inc. | Bond protection around porous plugs |
| US11456161B2 (en) | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
| US11380572B2 (en) | 2019-05-24 | 2022-07-05 | Applied Materials, Inc. | Substrate support carrier with improved bond layer protection |
| US11651987B2 (en) | 2019-05-24 | 2023-05-16 | Applied Materials, Inc. | Substrate support carrier with improved bond layer protection |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014165267A (ja) | 2014-09-08 |
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