JP6105746B2 - 試料保持具 - Google Patents
試料保持具 Download PDFInfo
- Publication number
- JP6105746B2 JP6105746B2 JP2015547779A JP2015547779A JP6105746B2 JP 6105746 B2 JP6105746 B2 JP 6105746B2 JP 2015547779 A JP2015547779 A JP 2015547779A JP 2015547779 A JP2015547779 A JP 2015547779A JP 6105746 B2 JP6105746 B2 JP 6105746B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- cylindrical portion
- sample holder
- flange
- inner peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
- C04B2237/127—The active component for bonding being a refractory metal
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/88—Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ceramic Products (AREA)
Description
方に向かって内周面の間隔が次第に狭くなっている部分を含む筒部を有する金属部材とを備えており、前記狭くなっている部分の前記内周面と前記セラミック体の前記下面との間に隙間があり、前記鍔部の厚みが、前記筒部の厚みよりも小さい。
2:筺体
20:貫通孔
3:セラミック体
30:試料保持面
4:金属部材
41:鍔部
42:筒部
43:隙間
5:ろう材
51:凹部
6:メタライズ層
7:セラミックリング
10:試料処理装置
Claims (6)
- 上面と下面とを有し、前記上面に試料保持面を有するセラミック体と、該セラミック体の前記下面に接合された鍔部および該鍔部の内周から下方に向かって内周面の間隔が次第に狭くなっている部分を含む筒部を有する金属部材とを備えており、前記狭くなっている部分の前記内周面と前記セラミック体の前記下面との間に隙間があり、前記鍔部の厚みが、前記筒部の厚みよりも小さい試料保持具。
- 上面と下面とを有し、前記上面に試料保持面を有するセラミック体と、該セラミック体の前記下面に接合された鍔部および該鍔部の内周から下方に向かって内周面の間隔が次第に狭くなっている部分を含む筒部を有する金属部材とを備えており、前記狭くなっている部分の前記内周面と前記セラミック体の前記下面との間に隙間があり、前記筒部の厚みが、前記セラミック体側の端部において反対側の端部よりも小さい試料保持具。
- 前記筒部の厚みが、前記セラミック体側の端部から反対側の前記端部に向かうにつれて大きくなっている請求項2に記載の試料保持具。
- 前記筒部の内周面の前記セラミック体の前記下面に垂直な仮想線に対する傾斜角が、下方に向かうにつれて小さくなっている請求項1乃至請求項3のいずれかに記載の試料保持具。
- 前記鍔部は前記筒部側の端部において厚みが最も小さくなっている請求項1乃至請求項4のいずれかに記載の試料保持具。
- 前記筒部の内周面の表面粗さが、前記鍔部の上面の表面粗さよりも大きい請求項1乃至請求項5のいずれかに記載の試料保持具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013233742 | 2013-11-12 | ||
JP2013233742 | 2013-11-12 | ||
PCT/JP2014/079994 WO2015072496A1 (ja) | 2013-11-12 | 2014-11-12 | 試料保持具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015072496A1 JPWO2015072496A1 (ja) | 2017-03-16 |
JP6105746B2 true JP6105746B2 (ja) | 2017-03-29 |
Family
ID=53057430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015547779A Active JP6105746B2 (ja) | 2013-11-12 | 2014-11-12 | 試料保持具 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6105746B2 (ja) |
WO (1) | WO2015072496A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015124116A (ja) * | 2013-12-26 | 2015-07-06 | 京セラ株式会社 | 試料保持具 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3597936B2 (ja) * | 1996-03-27 | 2004-12-08 | 京セラ株式会社 | ウェハ保持装置 |
JP4641569B2 (ja) * | 1998-07-24 | 2011-03-02 | 日本碍子株式会社 | 窒化アルミニウム質焼結体、耐蝕性部材、金属埋設および半導体保持装置 |
JP4627164B2 (ja) * | 2003-08-18 | 2011-02-09 | 東京エレクトロン株式会社 | 基板保持構造物および基板処理装置 |
US8956459B2 (en) * | 2005-02-23 | 2015-02-17 | Kyocera Corporation | Joined assembly, wafer holding assembly, attaching structure thereof and method for processing wafer |
-
2014
- 2014-11-12 JP JP2015547779A patent/JP6105746B2/ja active Active
- 2014-11-12 WO PCT/JP2014/079994 patent/WO2015072496A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015124116A (ja) * | 2013-12-26 | 2015-07-06 | 京セラ株式会社 | 試料保持具 |
Also Published As
Publication number | Publication date |
---|---|
WO2015072496A1 (ja) | 2015-05-21 |
JPWO2015072496A1 (ja) | 2017-03-16 |
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